JPH0350857A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH0350857A
JPH0350857A JP18650089A JP18650089A JPH0350857A JP H0350857 A JPH0350857 A JP H0350857A JP 18650089 A JP18650089 A JP 18650089A JP 18650089 A JP18650089 A JP 18650089A JP H0350857 A JPH0350857 A JP H0350857A
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
holes
main body
mounting operation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18650089A
Other languages
Japanese (ja)
Inventor
Akira Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP18650089A priority Critical patent/JPH0350857A/en
Publication of JPH0350857A publication Critical patent/JPH0350857A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE: To execute an accurate and easy alignment operation at a high-density mounting operation and at a soldering operation by a structure wherein leads in one part or more of a surface-mounting type semiconductor device are extended to the lower part from the bottom of the semiconductor device.
CONSTITUTION: Leads 2 on side faces of a semiconductor device main body 1 are provided with a gull-wing shape, a J-shape or the like so as to comply with a surface mounting operation. Leads 3 in one part or more are at an angle of 0 to 20° to a vertical direction and are extended to the lower part from the bottom of the semiconductor device main body 1. While the leads 3 are being inserted into through holes 5, this main body is soldered and mounted on a board 4 in which the through holes 5 have been formed in positions relative to the leads 3; thereby, the leads 2, 3 are mounted surely without a dislocation. Since through holes are not required in parts corresponding to the lower part of the leads 2, a high-density mounting operation can be realized when an electric circuit is formed on the rear or in an inside layer of the board 4. Even when recessed holes 6 are formed instead of the through holes 5, the same effect can be obtained.
COPYRIGHT: (C)1991,JPO&Japio
JP18650089A 1989-07-19 1989-07-19 Semiconductor device Pending JPH0350857A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18650089A JPH0350857A (en) 1989-07-19 1989-07-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18650089A JPH0350857A (en) 1989-07-19 1989-07-19 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH0350857A true JPH0350857A (en) 1991-03-05

Family

ID=16189580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18650089A Pending JPH0350857A (en) 1989-07-19 1989-07-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0350857A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049297A (en) * 2010-08-26 2012-03-08 Hitachi Cable Ltd Flat cable and connection structure of flat cable

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049297A (en) * 2010-08-26 2012-03-08 Hitachi Cable Ltd Flat cable and connection structure of flat cable

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