JPH0349987B2 - - Google Patents
Info
- Publication number
- JPH0349987B2 JPH0349987B2 JP6448987A JP6448987A JPH0349987B2 JP H0349987 B2 JPH0349987 B2 JP H0349987B2 JP 6448987 A JP6448987 A JP 6448987A JP 6448987 A JP6448987 A JP 6448987A JP H0349987 B2 JPH0349987 B2 JP H0349987B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/854,262 US4692346A (en) | 1986-04-21 | 1986-04-21 | Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62256968A JPS62256968A (en) | 1987-11-09 |
JPH0349987B2 true JPH0349987B2 (ja) | 1991-07-31 |
Family
ID=25318185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6448987A Active JPH0349987B2 (ja) | 1986-04-21 | 1987-03-20 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4692346A (ja) |
EP (1) | EP0242745B1 (ja) |
JP (1) | JPH0349987B2 (ja) |
DE (1) | DE3763518D1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3737489A1 (de) * | 1987-11-02 | 1989-05-18 | Schering Ag | METHOD FOR CONTROLLING AND / OR CONTROLLING METALIZATION PROCESSES, AND DEVICE THEREFOR |
US4808431A (en) * | 1987-12-08 | 1989-02-28 | International Business Machines Corp. | Method for controlling plating on seeded surfaces |
AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
US5117370A (en) * | 1988-12-22 | 1992-05-26 | Ford Motor Company | Detection system for chemical analysis of zinc phosphate coating solutions |
JP2638283B2 (ja) * | 1990-10-17 | 1997-08-06 | 日立化成工業株式会社 | Electroless plating deposition rate measuring device |
DE19546206A1 (de) * | 1994-12-19 | 1996-06-20 | At & T Corp | Methods of testing materials for use in chemical or electroless plating |
US5631845A (en) * | 1995-10-10 | 1997-05-20 | Ford Motor Company | Method and system for controlling phosphate bath constituents |
US5938845A (en) * | 1995-10-20 | 1999-08-17 | Aiwa Co., Ltd. | Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps |
US6500482B1 (en) * | 2001-08-31 | 2002-12-31 | Boules H. Morcos | Electroless nickel plating solution and process for its use |
JP3860111B2 (ja) * | 2002-12-19 | 2006-12-20 | 大日本スクリーン製造株式会社 | メッキ装置およびメッキ方法 |
JP4303484B2 (ja) * | 2003-01-21 | 2009-07-29 | 大日本スクリーン製造株式会社 | メッキ装置 |
US7205153B2 (en) | 2003-04-11 | 2007-04-17 | Applied Materials, Inc. | Analytical reagent for acid copper sulfate solutions |
WO2004109256A2 (en) * | 2003-06-06 | 2004-12-16 | Case Western Reserve University | Deposition and detection of zinc and other metals in solution |
US7851222B2 (en) * | 2005-07-26 | 2010-12-14 | Applied Materials, Inc. | System and methods for measuring chemical concentrations of a plating solution |
KR20110110462A (ko) * | 2010-04-01 | 2011-10-07 | 삼성전기주식회사 | 도금액의 활성도 측정 장치 및 방법 |
JP5759231B2 (ja) * | 2011-04-04 | 2015-08-05 | 日東電工株式会社 | めっき装置、めっき方法および配線回路基板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5348939A (en) * | 1976-10-16 | 1978-05-02 | Tokyo Shibaura Electric Co | Method of adjusting concentration of nonnelectrolytic plating solution |
US4132605B1 (ja) * | 1976-12-27 | 1986-06-10 | ||
JPS5926660B2 (ja) * | 1979-03-07 | 1984-06-29 | Tokyo Shibaura Electric Co | |
JPH0359142B2 (ja) * | 1983-06-07 | 1991-09-09 | Brother Ind Ltd | |
US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
US4626446A (en) * | 1985-06-03 | 1986-12-02 | International Business Machines Corporation | Electroless plating bath monitor |
-
1986
- 1986-04-21 US US06/854,262 patent/US4692346A/en not_active Expired - Fee Related
-
1987
- 1987-03-20 JP JP6448987A patent/JPH0349987B2/ja active Active
- 1987-04-10 EP EP19870105380 patent/EP0242745B1/en active Active
- 1987-04-10 DE DE8787105380T patent/DE3763518D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0242745A1 (en) | 1987-10-28 |
DE3763518D1 (de) | 1990-08-09 |
EP0242745B1 (en) | 1990-07-04 |
JPS62256968A (en) | 1987-11-09 |
US4692346A (en) | 1987-09-08 |