JPH0347673U - - Google Patents

Info

Publication number
JPH0347673U
JPH0347673U JP1989109540U JP10954089U JPH0347673U JP H0347673 U JPH0347673 U JP H0347673U JP 1989109540 U JP1989109540 U JP 1989109540U JP 10954089 U JP10954089 U JP 10954089U JP H0347673 U JPH0347673 U JP H0347673U
Authority
JP
Japan
Prior art keywords
workpiece
processing head
laser
treats
irradiates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989109540U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989109540U priority Critical patent/JPH0347673U/ja
Publication of JPH0347673U publication Critical patent/JPH0347673U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるレーザ加工
ヘツドを示す構成断面図、第2図はこの考案の他
の実施例を示すレーザ加工ヘツドの構成断面図、
第3図は従来のレーザ加工ヘツドを示す構成断面
図である。 図において、1……レーザビーム、2……加工
レンズ、3……反射鏡、4……スキヤナーミラー
、5……モーター、6……加工ヘツド構造物、7
……被加工物、8……反射光、9……吸収体であ
る。なお、図中、同一符号は同一、又は相当部分
を示す。
FIG. 1 is a cross-sectional view of a laser processing head according to an embodiment of this invention, and FIG. 2 is a cross-sectional view of a laser processing head according to another embodiment of this invention.
FIG. 3 is a sectional view showing a conventional laser processing head. In the figure, 1...Laser beam, 2...Processing lens, 3...Reflector, 4...Scanner mirror, 5...Motor, 6...Processing head structure, 7
...Workpiece, 8...Reflected light, 9...Absorber. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] レーザビームを被加工物に照射し、被加工物を
熱処理するレーザ加工ヘツドにおいて被加工物面
側の加工ヘツド構造物にレーザ光を吸収する部材
を設けたことを特徴とするレーザ加工ヘツド。
1. A laser processing head which irradiates a laser beam onto a workpiece and heat-treats the workpiece, characterized in that a processing head structure on the side of the workpiece surface is provided with a member that absorbs laser light.
JP1989109540U 1989-09-19 1989-09-19 Pending JPH0347673U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989109540U JPH0347673U (en) 1989-09-19 1989-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989109540U JPH0347673U (en) 1989-09-19 1989-09-19

Publications (1)

Publication Number Publication Date
JPH0347673U true JPH0347673U (en) 1991-05-02

Family

ID=31658127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989109540U Pending JPH0347673U (en) 1989-09-19 1989-09-19

Country Status (1)

Country Link
JP (1) JPH0347673U (en)

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