JPH0346909A - Device for manufacturing semiconductor - Google Patents

Device for manufacturing semiconductor

Info

Publication number
JPH0346909A
JPH0346909A JP17924589A JP17924589A JPH0346909A JP H0346909 A JPH0346909 A JP H0346909A JP 17924589 A JP17924589 A JP 17924589A JP 17924589 A JP17924589 A JP 17924589A JP H0346909 A JPH0346909 A JP H0346909A
Authority
JP
Japan
Prior art keywords
belt
semiconductor substrate
projections
dirt
rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17924589A
Other languages
Japanese (ja)
Inventor
Tomio Yamamoto
山本 冨男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17924589A priority Critical patent/JPH0346909A/en
Publication of JPH0346909A publication Critical patent/JPH0346909A/en
Pending legal-status Critical Current

Links

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  • Belt Conveyors (AREA)

Abstract

PURPOSE:To eliminate slip and prevent rejects from being produced by providing a conveyor belt of a processing device of a leaf type with a plurality of projections. CONSTITUTION:A belt 2 stretched between gear-like rollers 1 for conveying semiconductor substrates is provided with abacus bead-like projections 3. This constitution permits the semiconductor substrate to be supported on its back side in contact only with the tip of the projections 3. As a result, soiling with the conveying system and resultant rejects are prevented. Slip is also prevented as the projections 3 and the gear-like rollers 1 are in engagement.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に関し、特に枚葉式の処
理装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device manufacturing apparatus, and particularly to a single-wafer processing apparatus.

〔従来の技術〕[Conventional technology]

従来、半導体基板の食刻等を行う半導体装置の製造装置
は、搬送系にベルトを使用していた。しかし、近年、こ
のベルトによる半導体基板裏面の汚れが問題となってき
たため、真空チャックで半導体基板裏面の一部をつかん
で搬送するロボット搬送方式へと変わりつつある。この
方式により半導体基板裏面の汚れは、従来の10分の1
以下になった。
2. Description of the Related Art Conventionally, semiconductor device manufacturing equipment that performs etching of semiconductor substrates has used a belt as a conveyance system. However, in recent years, contamination of the back surface of the semiconductor substrate by this belt has become a problem, so a shift is being made to a robot transport method in which a part of the back surface of the semiconductor substrate is grabbed and transported using a vacuum chuck. With this method, dirt on the back side of the semiconductor substrate is reduced to 1/10th compared to conventional methods.
It became below.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述したロボット搬送方式は、半導体基板裏面の汚れが
それまでのベルト方式に比べ10分の1以下と改善され
たが、半導体基板裏面の一部を真空チャックでつかむた
め、必ず一定以上の面積を真空チャックと接触させる必
要がある。この部分は真空で吸い付けられているなめ、
従来のベルト方式によるベルトからの汚れの付着に比べ
、真空チャックからさらに高密度でごみ等が付着する。
The above-mentioned robot transport method has improved the dirt on the back side of the semiconductor substrate to less than one-tenth of the previous belt method, but since a part of the back side of the semiconductor substrate is grabbed with a vacuum chuck, it always requires a certain area or more. Must be in contact with the vacuum chuck. This part is licked by vacuum,
Compared to the conventional belt method where dirt adheres from the belt, dirt and the like adhere to the vacuum chuck at a higher density.

したがって、この汚れが、次工程のウェット処理等で半
導体基板表面に再付着し、集積回路形成時の配線ショー
ト等の不良原因になるという欠点がある。この面積は、
半導体基板の口径が6インチから8インチへと大きくな
るにしたがって基板が重くなるため増大させる必要があ
り、上記欠点も顕著になる。
Therefore, there is a drawback that this dirt re-adheres to the surface of the semiconductor substrate during wet processing in the next step and causes defects such as wiring shorts during the formation of integrated circuits. This area is
As the diameter of the semiconductor substrate increases from 6 inches to 8 inches, the weight of the substrate becomes heavier and needs to be increased, and the above-mentioned drawbacks become more noticeable.

上述した従来の枚葉式の半導体基板の処理装置では、ベ
ルトや真空チャックを使用しているため、半導体基板裏
面と搬送系を面接触させているのに対し本発明は搬送系
を半導体基板と点接触させるという相違点を有する。
The conventional single-wafer semiconductor substrate processing equipment described above uses a belt or a vacuum chuck, so the back side of the semiconductor substrate and the transport system are brought into surface contact. The difference is that it makes point contact.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体装置の製造装置は、半導体基板をのせる
ベルトとこのベルトを動すためのローラーとを有する半
導体装置の製造装置において、前記ベルトに複数の突起
部を設けたものである。
A semiconductor device manufacturing apparatus according to the present invention includes a belt on which a semiconductor substrate is placed and a roller for moving the belt, in which a plurality of protrusions are provided on the belt.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の第1の実施例の搬送系の正面図である
FIG. 1 is a front view of a transport system according to a first embodiment of the present invention.

2つの歯車状のローラー1の間に、突起部3を1〜2c
m程度の間隔で取りつけたベルト3を張る。ここで突起
部3は、ソロパンの玉のような形状にしておく。
Between two gear-shaped rollers 1, a protrusion 3 is placed between 1 and 2c.
Tighten the belts 3 attached at intervals of about m. Here, the protrusion 3 is shaped like a ball of solo bread.

この構成された第1の実施例によれば、ローラー1を回
転させてベルト2上の半導体基板を搬送する場合、ベル
ト2上の突起部3の先端だけで半導体基板の裏面を支え
ることができるなめ、搬送系からの汚れの付着を最小限
にすることができる。
According to this first embodiment, when the roller 1 is rotated to convey the semiconductor substrate on the belt 2, the back surface of the semiconductor substrate can be supported only by the tip of the protrusion 3 on the belt 2. It is possible to minimize the adhesion of dirt from the transport system.

第2図は本発明の第2の実施例の搬送系の正面図である
FIG. 2 is a front view of a conveyance system according to a second embodiment of the present invention.

第1の実施例と同様に、ローラー1及び突起部3を取り
付けたベルト2により半導体基板を搬送する。しかし、
第1の実施例では、ローラー1とのこすれ等で突起部3
の先端が汚れることがある。本第2の実施例ではこの汚
れを洗浄用のブラシ4で落とすように構成しである。そ
してこの洗浄用ブラシ4はさらにアルコール等の洗浄液
5で洗浄される。このような構成にすることにより、ベ
ル1〜2上の突起部3の先端はいつもきれいな状態に保
たれ、半導体基板裏面の汚れはなくなる。
As in the first embodiment, a semiconductor substrate is transported by a belt 2 to which rollers 1 and protrusions 3 are attached. but,
In the first embodiment, the protrusion 3 is damaged due to rubbing with the roller 1, etc.
The tip may become dirty. In the second embodiment, this dirt is removed using a cleaning brush 4. This cleaning brush 4 is further cleaned with a cleaning liquid 5 such as alcohol. With this configuration, the tips of the projections 3 on the bells 1 and 2 are always kept clean, and the back surface of the semiconductor substrate is free from dirt.

〔発明の効果〕〔Effect of the invention〕

以上説明しなように本発明は、枚葉式の半導体基板処理
装置において、搬送系に、突起部を取り付けたベルトを
使用することにより半導体基板を突起部先端の点接触で
支えながら搬送することができるなめ、ロボット搬送の
真空チャック等に比べて、半導体基板裏面の汚れを大幅
に減少させることができる。その結果、次工程のウェッ
ト処理等で半導体基板表面に汚れが再付着して、配線シ
ョート等の不良が発生するのをおさえることができる。
As described above, the present invention uses a belt to which protrusions are attached in the conveyance system in a single-wafer type semiconductor substrate processing apparatus to convey the semiconductor substrate while supporting it by point contact with the tips of the protrusions. Because of this, contamination on the backside of semiconductor substrates can be significantly reduced compared to vacuum chucks that are transported by robots. As a result, it is possible to prevent dirt from re-adhering to the surface of the semiconductor substrate during wet processing in the next step, thereby preventing defects such as wiring shorts.

また、突起部が、歯車状のローラーとかみ合うため、従
来のベルト搬送のようなベルトのすべりもなくなる。
Furthermore, since the protrusion engages with the gear-shaped roller, there is no belt slippage that occurs in conventional belt conveyance.

第7図 、3Figure 7 ,3

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本発明の第1及び第2の実施例の搬
送系の正面図である。 1−′−・ローラー、2・・・ベルト、3・・・突起部
、4・・・ブラシ、5・・・洗浄液。 第2図
FIGS. 1 and 2 are front views of conveyance systems according to first and second embodiments of the present invention. 1-'--Roller, 2--Belt, 3--Protrusion, 4--Brush, 5--Cleaning liquid. Figure 2

Claims (1)

【特許請求の範囲】[Claims] 半導体基板をのせるベルトとこのベルトを動すためのロ
ーラーとを有する半導体装置の製造装置において、前記
ベルトに複数の突起部を設けたことを特徴とする半導体
装置の製造装置。
1. A semiconductor device manufacturing apparatus comprising a belt on which a semiconductor substrate is placed and a roller for moving the belt, wherein the belt is provided with a plurality of protrusions.
JP17924589A 1989-07-11 1989-07-11 Device for manufacturing semiconductor Pending JPH0346909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17924589A JPH0346909A (en) 1989-07-11 1989-07-11 Device for manufacturing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17924589A JPH0346909A (en) 1989-07-11 1989-07-11 Device for manufacturing semiconductor

Publications (1)

Publication Number Publication Date
JPH0346909A true JPH0346909A (en) 1991-02-28

Family

ID=16062473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17924589A Pending JPH0346909A (en) 1989-07-11 1989-07-11 Device for manufacturing semiconductor

Country Status (1)

Country Link
JP (1) JPH0346909A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014066280A1 (en) * 2012-10-24 2014-05-01 First Solar Malaysia Sdn. Bhd. Conveyor assembly with geared, removable rollers for a vapor deposition system
CN109501474A (en) * 2018-11-27 2019-03-22 滁州市朝友精密制造有限公司 A kind of cabinet components production surface marking device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014066280A1 (en) * 2012-10-24 2014-05-01 First Solar Malaysia Sdn. Bhd. Conveyor assembly with geared, removable rollers for a vapor deposition system
CN109501474A (en) * 2018-11-27 2019-03-22 滁州市朝友精密制造有限公司 A kind of cabinet components production surface marking device

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