JPH0345697U - - Google Patents

Info

Publication number

JPH0345697U

JPH0345697U JP10751689U JP10751689U JPH0345697U JP H0345697 U JPH0345697 U JP H0345697U JP 10751689 U JP10751689 U JP 10751689U JP 10751689 U JP10751689 U JP 10751689U JP H0345697 U JPH0345697 U JP H0345697U

Authority

JP

Japan

Prior art keywords

electronic component

heat sink

lead wires

spacer

mounting

Prior art date

1989-09-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 125000006850 spacer group Chemical group 0.000 claims description 4
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
• 230000017525 heat dissipation Effects 0.000 claims 1
• 239000011810 insulating material Substances 0.000 claims 1
• 239000007769 metal material Substances 0.000 claims 1
• 238000005476 soldering Methods 0.000 description 2
• 239000002184 metal Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1