JPH0345659U - - Google Patents
Info
- Publication number
- JPH0345659U JPH0345659U JP1989106086U JP10608689U JPH0345659U JP H0345659 U JPH0345659 U JP H0345659U JP 1989106086 U JP1989106086 U JP 1989106086U JP 10608689 U JP10608689 U JP 10608689U JP H0345659 U JPH0345659 U JP H0345659U
- Authority
- JP
- Japan
- Prior art keywords
- photodiodes
- layer
- glass substrate
- document
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106086U JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106086U JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345659U true JPH0345659U (US07709020-20100504-C00041.png) | 1991-04-26 |
| JPH083021Y2 JPH083021Y2 (ja) | 1996-01-29 |
Family
ID=31654833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106086U Expired - Lifetime JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083021Y2 (US07709020-20100504-C00041.png) |
-
1989
- 1989-09-09 JP JP1989106086U patent/JPH083021Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083021Y2 (ja) | 1996-01-29 |
