JPH0343718Y2 - - Google Patents

Info

Publication number
JPH0343718Y2
JPH0343718Y2 JP1982137318U JP13731882U JPH0343718Y2 JP H0343718 Y2 JPH0343718 Y2 JP H0343718Y2 JP 1982137318 U JP1982137318 U JP 1982137318U JP 13731882 U JP13731882 U JP 13731882U JP H0343718 Y2 JPH0343718 Y2 JP H0343718Y2
Authority
JP
Japan
Prior art keywords
pellet
pellets
mounting
semiconductor
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982137318U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5942039U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13731882U priority Critical patent/JPS5942039U/ja
Publication of JPS5942039U publication Critical patent/JPS5942039U/ja
Application granted granted Critical
Publication of JPH0343718Y2 publication Critical patent/JPH0343718Y2/ja
Granted legal-status Critical Current

Links

JP13731882U 1982-09-10 1982-09-10 半導体部品の組立装置 Granted JPS5942039U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13731882U JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13731882U JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Publications (2)

Publication Number Publication Date
JPS5942039U JPS5942039U (ja) 1984-03-17
JPH0343718Y2 true JPH0343718Y2 (cs) 1991-09-12

Family

ID=30308474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13731882U Granted JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Country Status (1)

Country Link
JP (1) JPS5942039U (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0630374B2 (ja) * 1986-09-29 1994-04-20 東京エレクトロン株式会社 プロ−バにおけるウエハのθ調整方法
JPH052179Y2 (cs) * 1988-05-14 1993-01-20

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
US4167174A (en) * 1977-12-08 1979-09-11 General Signal Corporation Method and apparatus for aligning the streets of a semiconductor wafer

Also Published As

Publication number Publication date
JPS5942039U (ja) 1984-03-17

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