JPH0342675Y2 - - Google Patents

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Publication number
JPH0342675Y2
JPH0342675Y2 JP1985161571U JP16157185U JPH0342675Y2 JP H0342675 Y2 JPH0342675 Y2 JP H0342675Y2 JP 1985161571 U JP1985161571 U JP 1985161571U JP 16157185 U JP16157185 U JP 16157185U JP H0342675 Y2 JPH0342675 Y2 JP H0342675Y2
Authority
JP
Japan
Prior art keywords
holder
wedge
chip
base
feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985161571U
Other languages
Japanese (ja)
Other versions
JPS6270432U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985161571U priority Critical patent/JPH0342675Y2/ja
Publication of JPS6270432U publication Critical patent/JPS6270432U/ja
Application granted granted Critical
Publication of JPH0342675Y2 publication Critical patent/JPH0342675Y2/ja
Expired legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は、例えば積層チツプコンデンサを製造
する際、その途中の銀塗り工程において多数の積
層チツプを端面が面一となるように揃えて保持さ
せるような場合等に好適に用いられるクランプ装
置に関する。
[Detailed description of the invention] Industrial application field The present invention is designed to hold a large number of laminated chips aligned so that their end faces are flush during the silver coating process during the manufacture of multilayer chip capacitors, for example. The present invention relates to a clamp device that is suitably used in such cases.

従来の技術 これまで、積層チツプコンデンサを製造する場
合の途中の銀塗り工程においては、第6図に示す
ように、板状のホルダ100の一端面に両面テー
プ101を貼付け、この両面テープ101に多数
の積層チツプ102を一個づつ手作業で貼着保持
させて、各チツプ102の両端面103,103
に銀ペーストを塗布していた。
BACKGROUND ART Until now, in the silver coating process during the production of multilayer chip capacitors, as shown in FIG. A large number of laminated chips 102 are attached and held one by one by hand, and both end faces 103, 103 of each chip 102 are attached.
silver paste was applied to it.

考案が解決しようとする問題点 しかしながら、上記のように手作業で積層チツ
プ102を貼着する場合は極めて能率が悪く、且
つ多くの人手を要するため人件費も嵩むという問
題があつた。
Problems to be Solved by the Invention However, as described above, when pasting the laminated chips 102 manually, there is a problem that efficiency is extremely low and that a large amount of manpower is required, resulting in increased labor costs.

しかも、手作業では各チツプ102の正確な位
置決めが容易でないため、銀ペーストを塗布すべ
き端面103が面一となるように各チツプ102
を整列させ難く、第6図に示すように各チツプ1
02の端面間に多少の段差ができたり、或いは破
線で示すように積層チツプ102が傾いたりする
場合があり、それ故、銀ペーストを塗布すると、
第7図に示すように銀ペーストの塗膜104が全
体に厚くなつたり、全体に薄くなつたり、部分的
に厚みが変化したりする問題があつた。
Moreover, since it is not easy to accurately position each chip 102 manually, each chip 102 must be positioned so that the end surface 103 to which silver paste is to be applied is flush with the chip 102.
It is difficult to line up the chips, and as shown in Figure 6, each chip 1
02, or the laminated chip 102 may be tilted as shown by the broken line.Therefore, when silver paste is applied,
As shown in FIG. 7, there was a problem in that the silver paste coating 104 became thicker overall, thinner overall, or partially changed in thickness.

また、上記のように積層チツプ102を単に両
面テープ101に貼着するだけでは、気温変化に
よつて粘着力が低下したような場合、或いはチツ
プ102の押圧力が低下したような場合に、該チ
ツプ102が脱落するという問題もあつた。
Furthermore, if the laminated chip 102 is simply attached to the double-sided tape 101 as described above, if the adhesive strength decreases due to temperature changes, or if the pressing force of the chip 102 decreases, There was also the problem that the chip 102 fell off.

問題点を解決するための手段 上記の問題を解決するため、本考案は、フイー
ダより送られてくる対象物を受ける凹欠部が間隔
おきに多数形成され且つ各凹欠部に上記対象物を
締付け固定する楔形部材が設けられたホルダを、
上記フイーダに対して接近離反自在な基台に脱着
自在に装着すると共に、上記ホルダの各凹欠部に
送られてきた対象物の端面を面一に揃えるストツ
パを上記基台に設け、上記の各楔形部材を締付方
向に押す押しピンと緩め方向に押戻す戻しピンを
配設したことを要旨とする。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a method in which a large number of recesses are formed at intervals for receiving the objects fed from the feeder, and the objects are placed in each recess. A holder equipped with a wedge-shaped member to be tightened and fixed.
The feeder is removably attached to a base that can approach and separate from the feeder, and a stopper is provided on the base to align the end surfaces of the objects sent to each recessed part of the holder flush. The gist is that a push pin that pushes each wedge-shaped member in the tightening direction and a return pin that pushes it back in the loosening direction are provided.

考案の作用 かかる構成のクランプ装置にあつては、フイー
ダよりホルダの各凹欠部に送られた積層チツプ等
の対象物がストツパーで当止され、端面が面一に
揃えられて受け止められる。そして、基台がフイ
ーダより離れたときに、各凹欠部の楔形部材が押
しピンによつて締付け方向に押され、各凹欠部の
対象物は該楔形部材によつて締付け固定される。
従つて、各対象物は端面を面一に揃えた状態でホ
ルダに保持されるので、該端面に銀ペースト等を
塗布した場合に均一な塗膜が形成される。また、
戻しピンによつて楔形部材を押戻すと締付けが解
除され、各対象物をホルダの各凹欠部から簡単に
取り出すことができる。
Effects of the Invention In the clamp device having such a structure, objects such as laminated chips sent from the feeder to each recessed part of the holder are stopped by the stopper and received with the end surfaces aligned flush with each other. Then, when the base is separated from the feeder, the wedge-shaped member of each recessed notch is pushed in the tightening direction by the push pin, and the object in each recessed notch is tightened and fixed by the wedge-shaped member.
Therefore, each object is held in the holder with its end surfaces flush with each other, so that when silver paste or the like is applied to the end surfaces, a uniform coating is formed. Also,
When the wedge-shaped member is pushed back by the return pin, the tightening is released, and each object can be easily taken out from each recessed part of the holder.

実施例 以下、実施例を挙げて本考案を詳述する。Example Hereinafter, the present invention will be described in detail with reference to Examples.

第1図は本考案の一実施例に係るクランプ装置
の概略分解斜視図であつて、ここに1は多数の平
行な送り溝11が形成されたフイーダを示してお
り、積層チツプ等の対象物Aは各送り溝11内を
摺動して、後述するようにホルダ2の各凹欠部へ
間欠的に送られるようになつている。
FIG. 1 is a schematic exploded perspective view of a clamping device according to an embodiment of the present invention, in which reference numeral 1 indicates a feeder in which a large number of parallel feeding grooves 11 are formed, and the object such as laminated chips etc. A slides in each feed groove 11 and is intermittently fed to each recessed portion of the holder 2 as described later.

また、2は短冊状の板体よりなるホルダで、こ
のホルダ2の上端縁には、上記フイーダ1の送り
溝11から送られてくる対象物Aを受ける多数の
凹欠部21が該送り溝11の対応位置に形成さ
れ、各凹欠部21には楔形部材22が設けられて
いる。そして、このホルダ2の左右両端縁は、上
記フイーダ1に対して接近離反自在な基台3の両
側板31,31に形成された溝32,32に嵌合
され、該ホルダ2を上方に引抜くと取外せるよう
に装着されている。更に、上記基台3の前板33
とホルダ2の間には、各凹欠部21に送られてく
る対象物Aの端面を面一に揃えて整列させるため
の短冊状の板体よりなるストツパ4が配設され、
該ストツパ4は間隔調節用のボルト5によつて基
台3の前板33に取付けられている。
Reference numeral 2 denotes a holder made of a strip-shaped plate, and the upper edge of this holder 2 has a number of recessed notches 21 for receiving objects A fed from the feed groove 11 of the feeder 1. 11, and each recessed notch 21 is provided with a wedge-shaped member 22. The left and right end edges of this holder 2 are fitted into grooves 32, 32 formed in both side plates 31, 31 of the base 3, which can move toward and away from the feeder 1, and the holder 2 is pulled upward. It is attached so that it can be removed by pulling it out. Furthermore, the front plate 33 of the base 3
A stopper 4 made of a strip-shaped plate is disposed between the holder 2 and the holder 2 to align the end surfaces of the objects A sent to each recessed notch 21 so that they are flush with each other.
The stopper 4 is attached to the front plate 33 of the base 3 with bolts 5 for adjusting the distance.

上記楔形部材22は、凹欠部21に供給された
対象物Aを締付け固定するためのもので、第4図
の拡大平面図に示すように、該楔形部材22の斜
面221が凹欠部21の一方の傾斜側面211に
摺接しており、また該楔形部材22の対象物押圧
面222の対象物供給側の端部には、対象物Aの
供給を容易にするための呼込み斜面223が形成
されている。そして、この楔形部材22は第5図
の断面図に示すように、下方にのびる一対の脚部
224,224を備え、凹欠部21の底面212
を跨ぐように載置した状態で、ホルダ2のピン挿
通孔に遊挿した可動ピン23の両端を双方の脚部
224,224の孔に挿入固定することによつ
て、第4図及び第5図に二点鎖線で示す緩め位置
から実線で示す締付け位置まで移動できるように
取付けられている。
The wedge-shaped member 22 is for tightening and fixing the object A supplied to the recessed notch 21, and as shown in the enlarged plan view of FIG. is in sliding contact with one inclined side surface 211 of the wedge-shaped member 22, and a drawing slope 223 for facilitating the supply of the object A is formed at the end of the object supply side of the object pressing surface 222 of the wedge-shaped member 22. has been done. As shown in the sectional view of FIG. 5, this wedge-shaped member 22 includes a pair of legs 224, 224 extending downward,
4 and 5, by inserting and fixing both ends of the movable pin 23 loosely inserted into the pin insertion hole of the holder 2 into the holes of both legs 224, 224. It is mounted so that it can be moved from the loosened position shown by the two-dot chain line in the figure to the tightened position shown by the solid line.

各楔形部材22を締付け方向に押す押しピン6
は、第3図に示すように、先端の大径ヘツド部6
1と、後端の抜止め部62と、その中間の小径軸
部63とからなるもので、該小径軸部63が可動
取付板64に挿通されており、大径ヘツド部61
と可動取付板64との間にはコイルスプリング6
5が該小径軸部63を囲む状態で設けられてい
る。この可動取付板64は、後述するのように、
フイーダ1からホルダ2の各凹欠部21へ対象物
Aが供給されるときには邪魔にならないよう上方
に引き上げられているが、供給後に各対象物Aを
締付け固定するときには下降するように構成され
ており、この下降した取付板64に向かつて基台
3が接近すると、各楔形部材22が各押しピン6
の大径ヘツド部61に当接してコイルスプリング
65の弾発力により締付け方向に押込まれるよう
になつている。
Push pin 6 that pushes each wedge-shaped member 22 in the tightening direction
As shown in FIG. 3, the large diameter head portion 6 at the tip
1, a retaining part 62 at the rear end, and a small diameter shaft part 63 in the middle.The small diameter shaft part 63 is inserted into the movable mounting plate 64, and the large diameter head part 61
A coil spring 6 is connected between the movable mounting plate 64 and the movable mounting plate 64.
5 is provided to surround the small diameter shaft portion 63. This movable mounting plate 64, as described later,
When the object A is fed from the feeder 1 to each concave notch 21 of the holder 2, it is pulled up so as not to get in the way, but when the object A is tightened and fixed after being fed, it is configured to be lowered. When the base 3 approaches the lowered mounting plate 64, each wedge-shaped member 22 presses against each push pin 6.
The coil spring 65 contacts the large diameter head portion 61 of the coil spring 65 and is pushed in the tightening direction by the elastic force of the coil spring 65.

一方、各楔形部材22を緩め方向に押戻すそれ
ぞれの戻しピン7は、第1図及び第3図に示すよ
うに前記押しピン6と反対側に位置する可動取付
板71に突設されており、この可動取付板71が
基台3に向かつて移動すると、各戻しピン7は、
基台3の前板33及びストッパ4に形成されたピ
ン貫通孔34,41を貫通して各楔形部材22を
緩め方向に押戻し、これによつて各対象物Aの締
付け固定が解除されるようになつている。
On the other hand, each return pin 7 that pushes back each wedge-shaped member 22 in the loosening direction is provided in a protruding manner on a movable mounting plate 71 located on the opposite side of the push pin 6, as shown in FIGS. 1 and 3. , when this movable mounting plate 71 moves toward the base 3, each return pin 7
The pins pass through the pin through holes 34 and 41 formed in the front plate 33 of the base 3 and the stopper 4 and push back each wedge-shaped member 22 in the loosening direction, thereby releasing the tightening fixation of each object A. It's becoming like that.

上記のような構成のクランプ装置によつて例え
ば積層チツプを対象物Aとして保持固定し、該チ
ツプAの端面に銀ペーストを塗布する場合を次に
説明する。
A case in which, for example, a laminated chip is held and fixed as an object A by the clamping device having the above-mentioned structure, and silver paste is applied to the end face of the chip A will be described below.

まず、積層チツプAの供給時には、第2図に示
すようにフイーダ1の先端とホルダ2との隙間が
僅かとなるように基台2がフイーダ1に接近して
位置しており、この状態において積層チツプAは
フイーダ1の送り溝11から対向するホルダ2の
各凹欠部21に送られる。そして、各凹欠部21
に送られた積層チツプAは、図示のようにストツ
パ4に当接し、それぞれの端面が面一に揃えられ
た整列状態で各凹欠部21に受止められる。次い
で、基台2がフイーダ1から離反し、第1図に示
すように、押しピン6の可動取付板64が下降し
てフイーダ1と基台2との間で停止する。する
と、基台2は該可動取付板64に向かつて移動
し、前述のように各楔形部材22が各押しピン6
に当接してコイルスプリング65の弾発力で締付
け方向に押込まれる。このように各楔形部材22
が押込まれると、該楔形部材22の斜面221の
作用で押込力が積層チツプAの方へ分力され、第
4図に示すように、積層チツプAは楔形部材22
の押圧面222と凹欠部21の側面212によつ
て強固に挟持固定される。
First, when supplying the laminated chips A, the base 2 is positioned close to the feeder 1 so that there is a small gap between the tip of the feeder 1 and the holder 2, as shown in FIG. The laminated chips A are fed from the feeding groove 11 of the feeder 1 to each recessed notch 21 of the opposing holder 2. And each concave notch 21
As shown in the figure, the laminated chips A come into contact with the stopper 4 and are received in the recessed notches 21 in an aligned state with their respective end faces aligned flush. Next, the base 2 is separated from the feeder 1, and the movable mounting plate 64 of the push pin 6 is lowered and stopped between the feeder 1 and the base 2, as shown in FIG. Then, the base 2 moves toward the movable mounting plate 64, and each wedge-shaped member 22 moves toward each push pin 6, as described above.
, and is pushed in the tightening direction by the elastic force of the coil spring 65. In this way, each wedge-shaped member 22
When the chip A is pushed in, the pushing force is divided toward the laminated chip A due to the action of the slope 221 of the wedge-shaped member 22, and as shown in FIG.
It is firmly clamped and fixed by the pressing surface 222 of and the side surface 212 of the recessed notch 21 .

かくして積層チツプAの固定が完了すると、ホ
ルダ2を基台3より抜出し、例えばロールコータ
等の塗布手段で積層チツプAの両端面に銀ペース
トを塗布する。この場合、各積層チツプAは端面
が面一となつた整列状態で固定保持されているの
で、銀ペーストの塗膜は均一な厚みに形成され
る。
When the fixation of the laminated chip A is thus completed, the holder 2 is taken out from the base 3, and silver paste is applied to both end surfaces of the laminated chip A using coating means such as a roll coater. In this case, since each of the laminated chips A is fixed and held in an aligned state with the end faces flush, the coating film of silver paste is formed to have a uniform thickness.

銀ペーストの塗布が完了すると、ホルダ2は再
び基台2に装着され、戻しピン7の可動取付板7
1が基台2に向かつて移動し、前述のように各楔
形部材22が各戻しピン7によつて緩め方向に押
戻され、各積層チツプAの締付け固定が解除され
る。かくして締付けの解除された各積層チツプA
はホルダ2から容器に入れられ、次の工程へ移さ
れる。
When the application of the silver paste is completed, the holder 2 is mounted on the base 2 again, and the movable mounting plate 7 of the return pin 7 is attached.
1 moves toward the base 2, and as described above, each wedge-shaped member 22 is pushed back in the loosening direction by each return pin 7, and the fastening fixation of each laminated chip A is released. Each laminated chip A is thus untightened.
is put into a container from holder 2 and transferred to the next process.

考案の効果 以上の説明から理解できるように、本考案のク
ランプ装置によれば、基台に対するホルダの脱着
作業を除いて、対象物の供給から締付け固定及び
その解除に至るまで自動的に行われるため、能率
が極めてよく、且つ人手も殆ど不要に等しいの
で、人件費の大幅な節約が可能となる。しかも、
各対象物は端面を面一に揃えた整列状態で固定保
持されるので、該端面に例えば銀ペースト等を塗
布するような場合、塗膜を均一な厚みに形成する
ことが可能となる。その上、楔形部材によつて各
対象物を機械的に強固に挟持固定するため、対象
物が脱落することも満足に防止される。
Effects of the invention As can be understood from the above explanation, according to the clamping device of the invention, everything from supplying the object to tightening and fixing and releasing it is automatically performed, except for the work of attaching and detaching the holder to the base. Therefore, the efficiency is extremely high and there is almost no need for manpower, so it is possible to save a large amount of labor costs. Moreover,
Since each object is fixed and held in an aligned state with its end surfaces flush, when applying silver paste or the like to the end surfaces, it is possible to form a coating film with a uniform thickness. Furthermore, since each object is firmly clamped and fixed mechanically by the wedge-shaped member, the objects are satisfactorily prevented from falling off.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案クランプ装置の一実施例を示す
分解斜視図、第2図は対象物の供給時における同
装置の部分平面図、第3図は対象物の締付け固定
時における同装置の部分平面図、第4図は楔形部
材によつて対象物を締付け固定した状態を示す拡
大部分平面図、第5図は第4図における−線
断面図、第6図は積層チツプを貼着した従来ホル
ダの斜視図、第7図は従来ホルダに貼着した積層
チツプに銀ペーストを塗布した状態を示す部分拡
大正面図である。 1……フイーダ、2……ホルダ、3……基台、
4……ホツパ、6……押しピン、7……戻しピ
ン、21……凹欠部、22……楔形部材、A……
対象物(積層チツプ)。
Fig. 1 is an exploded perspective view showing an embodiment of the clamping device of the present invention, Fig. 2 is a partial plan view of the device when an object is being supplied, and Fig. 3 is a portion of the device when tightening and fixing an object. A plan view, FIG. 4 is an enlarged partial plan view showing a state in which an object is fastened and fixed by a wedge-shaped member, FIG. 5 is a cross-sectional view taken along the - line in FIG. 4, and FIG. FIG. 7 is a perspective view of the holder, and is a partially enlarged front view showing a state in which silver paste has been applied to the laminated chips conventionally attached to the holder. 1... feeder, 2... holder, 3... base,
4...Hopper, 6...Push pin, 7...Return pin, 21...Concave notch, 22...Wedge-shaped member, A...
Object (laminated chip).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フイーダより供給されるチツプ部材を受ける凹
欠部が所定ピツチで多数形成され且つ各凹欠部に
上記チツプ部材を締付け固定する楔形部材が設け
られたホルダを、上記フイーダに対して接近離反
自在な基台に脱着自在に装着すると共に、上記ホ
ルダの各凹欠部に供給されたチツプ部材の端面を
面一に揃えるストツパを上記基台に設け、上記の
各楔形部材を締付方向に押す押しピンと緩め方向
に押戻す戻しピンを配設して成るクランプ装置。
A holder having a plurality of recessed portions formed at a predetermined pitch to receive the chip members supplied from the feeder, and each recessed portion provided with a wedge-shaped member for tightening and fixing the chip member, is movable toward and away from the feeder. The base is provided with a stopper that is removably attached to the base and that aligns the end faces of the chip members supplied to each recessed part of the holder flush, and a pusher that pushes each of the wedge-shaped members in the tightening direction. A clamping device consisting of a pin and a return pin that pushes back in the loosening direction.
JP1985161571U 1985-10-21 1985-10-21 Expired JPH0342675Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985161571U JPH0342675Y2 (en) 1985-10-21 1985-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985161571U JPH0342675Y2 (en) 1985-10-21 1985-10-21

Publications (2)

Publication Number Publication Date
JPS6270432U JPS6270432U (en) 1987-05-02
JPH0342675Y2 true JPH0342675Y2 (en) 1991-09-06

Family

ID=31088004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985161571U Expired JPH0342675Y2 (en) 1985-10-21 1985-10-21

Country Status (1)

Country Link
JP (1) JPH0342675Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662285B2 (en) * 2006-12-14 2011-03-30 信越ポリマー株式会社 Holding jig, electrode forming apparatus, and electrode forming method
JP2008284640A (en) * 2007-05-16 2008-11-27 Shin Etsu Polymer Co Ltd Small part holder

Also Published As

Publication number Publication date
JPS6270432U (en) 1987-05-02

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