JPH0340952B2 - - Google Patents
Info
- Publication number
- JPH0340952B2 JPH0340952B2 JP4907982A JP4907982A JPH0340952B2 JP H0340952 B2 JPH0340952 B2 JP H0340952B2 JP 4907982 A JP4907982 A JP 4907982A JP 4907982 A JP4907982 A JP 4907982A JP H0340952 B2 JPH0340952 B2 JP H0340952B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- point metal
- heat conductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 239000004065 semiconductor Substances 0.000 claims description 50
- 238000002844 melting Methods 0.000 claims description 42
- 230000008018 melting Effects 0.000 claims description 42
- 239000004020 conductor Substances 0.000 claims description 41
- 238000001816 cooling Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 6
- 239000001993 wax Substances 0.000 description 12
- 239000002470 thermal conductor Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4907982A JPS58166750A (ja) | 1982-03-29 | 1982-03-29 | 集積回路の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4907982A JPS58166750A (ja) | 1982-03-29 | 1982-03-29 | 集積回路の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166750A JPS58166750A (ja) | 1983-10-01 |
| JPH0340952B2 true JPH0340952B2 (cs) | 1991-06-20 |
Family
ID=12821080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4907982A Granted JPS58166750A (ja) | 1982-03-29 | 1982-03-29 | 集積回路の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58166750A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60126853A (ja) * | 1983-12-14 | 1985-07-06 | Hitachi Ltd | 半導体デバイス冷却装置 |
| EP0366082B1 (en) * | 1988-10-28 | 1996-04-10 | Sumitomo Electric Industries, Ltd. | Member for carrying semiconductor device |
| US6243944B1 (en) * | 1997-12-08 | 2001-06-12 | Unisys Corporation | Residue-free method of assembling and disassembling a pressed joint with low thermal resistance |
| US6867976B2 (en) * | 2002-02-12 | 2005-03-15 | Hewlett-Packard Development Company, L.P. | Pin retention for thermal transfer interfaces, and associated methods |
| FR3138563B1 (fr) * | 2022-07-27 | 2025-04-11 | Safran Electronics & Defense | Drain thermique pour une carte électronique |
-
1982
- 1982-03-29 JP JP4907982A patent/JPS58166750A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58166750A (ja) | 1983-10-01 |
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