JPH0340504B2 - - Google Patents

Info

Publication number
JPH0340504B2
JPH0340504B2 JP57016962A JP1696282A JPH0340504B2 JP H0340504 B2 JPH0340504 B2 JP H0340504B2 JP 57016962 A JP57016962 A JP 57016962A JP 1696282 A JP1696282 A JP 1696282A JP H0340504 B2 JPH0340504 B2 JP H0340504B2
Authority
JP
Japan
Prior art keywords
semiconductor element
cooling
semiconductor
cooling fins
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57016962A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58135657A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1696282A priority Critical patent/JPS58135657A/ja
Publication of JPS58135657A publication Critical patent/JPS58135657A/ja
Publication of JPH0340504B2 publication Critical patent/JPH0340504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1696282A 1982-02-06 1982-02-06 半導体装置 Granted JPS58135657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1696282A JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1696282A JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS58135657A JPS58135657A (ja) 1983-08-12
JPH0340504B2 true JPH0340504B2 (enrdf_load_stackoverflow) 1991-06-19

Family

ID=11930726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1696282A Granted JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS58135657A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP5803560B2 (ja) * 2011-10-24 2015-11-04 トヨタ自動車株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349767U (enrdf_load_stackoverflow) * 1976-09-30 1978-04-26
JPS55134783U (enrdf_load_stackoverflow) * 1979-03-16 1980-09-25

Also Published As

Publication number Publication date
JPS58135657A (ja) 1983-08-12

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