JPH0338111B2 - - Google Patents
Info
- Publication number
- JPH0338111B2 JPH0338111B2 JP18010084A JP18010084A JPH0338111B2 JP H0338111 B2 JPH0338111 B2 JP H0338111B2 JP 18010084 A JP18010084 A JP 18010084A JP 18010084 A JP18010084 A JP 18010084A JP H0338111 B2 JPH0338111 B2 JP H0338111B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- steel wire
- stainless steel
- photosensitive resin
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 238000000520 microinjection Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1625—Manufacturing processes electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
【発明の詳細な説明】
本発明は印刷用のインクジエツトプロツタ等に
用いられる微細孔径のノズルの製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a nozzle with a fine pore size used in an inkjet printer for printing and the like.
一般に、印刷用のインクジエツトには引抜きチ
ユーブが用いられるが、φ0.05mm以下の微細孔径
の加工ができず、微量のインク噴射用ノズルとし
ては不適当である。そこでレーザー光線による金
属孔形加工や、金属線にニツケルめつきを行い電
着完了後金属線のみ腐食溶解させる方法等が提案
されているが、前者にあつては製造コストが高
く、また後者にあつても加工後の腐食処理を必要
とすることなどから製造工程が複雑化するという
問題があつた。 Drawn tubes are generally used for ink jets for printing, but they cannot be processed into micropores with a diameter of φ0.05 mm or less, making them unsuitable as nozzles for ejecting small amounts of ink. Therefore, methods have been proposed, such as machining metal holes with a laser beam or nickel-plating the metal wire and corroding and dissolving only the metal wire after electrodeposition is complete, but the former method requires high manufacturing costs, and the latter method requires high production costs. However, there was a problem in that the manufacturing process was complicated by the need for corrosion treatment after processing.
本発明はかかる点に鑑がみてなされたものであ
つて、その目的とするところはめつきによる製造
で低コスト化が図れ、しかも後処理が不要な微量
噴射用ノズルの製造方法を提供するにある。 The present invention has been made in view of these points, and its purpose is to provide a method for manufacturing a micro-injection nozzle that can be manufactured by plating at low cost and that does not require post-processing. .
以下、発明を図の実施例に基づいて詳述する。 Hereinafter, the invention will be explained in detail based on the embodiments shown in the drawings.
まず基板１上に第１図のように２条の土手７
（幅は例えば10〜15mmとする）を水溶性感光液の
塗布による硬膜部により形成する。次に土手７で
挾まれた基板１表面にスルフアミン酸ツケル槽に
て一次めつき層２（厚みは例えば0.015mmとする）
を形成してこれをノズル母体とする。なお、基板
１として厚みが1.0〜2.0mmのステンレス鋼線を用
いるものとする。 First, two banks 7 are placed on the board 1 as shown in Figure 1.
(width is, for example, 10 to 15 mm) is formed by a hardened portion formed by coating a water-soluble photosensitive liquid. Next, a primary plating layer 2 (thickness is 0.015 mm, for example) is applied to the surface of the substrate 1 sandwiched between the banks 7 in a sulfamic acid coating bath.
is formed and this is used as the nozzle base. Note that the substrate 1 is a stainless steel wire with a thickness of 1.0 to 2.0 mm.
次に第２図のように基板１を水洗・乾燥させた
のち一次めつき層２上にステンレス鋼線３（径は
例えばφ0.03mmとする）を張設して両端をビス８
にて固定する。 Next, as shown in Figure 2, after washing and drying the substrate 1, a stainless steel wire 3 (diameter, for example, 0.03 mm) is stretched over the primary plating layer 2, and both ends are secured with screws 8.
Fix it with.
しかる後土手７及び一次めつき層２の表面に溶
剤型感光液を厚みを例えば0.008mm〜0.01mmで塗
布して感光樹脂層４を形成する。この場合感光樹
脂層４はステンレス鋼線３を完全に被覆するよう
にし、かつ一次めつき層２及び土手７と十分に密
着するようにする。 Thereafter, a solvent type photosensitive liquid is applied to the surfaces of the bank 7 and the primary plating layer 2 to a thickness of, for example, 0.008 mm to 0.01 mm to form the photosensitive resin layer 4. In this case, the photosensitive resin layer 4 is made to completely cover the stainless steel wire 3 and to be in sufficient contact with the primary plating layer 2 and the bank 7.
次に感光樹脂層４を乾燥させたのちパターンフ
イルム（図示せず）をその上に密着させ露光・現
像したのち、未硬化部分を公知の方法により除去
して一次めつき層２を露出部５と硬化した感光樹
脂層により被覆された被覆部９とに区分けする。
次にパターンフイルムの不透明部分に相当する露
出部５のニツケル表面を塩酸水で洗浄する。すな
わち、未硬化の感光樹脂を除去すると露出したニ
ツケル表面に酸化被覆が形成されており、この酸
化被膜部１０を塩酸水で洗浄して除去するのであ
る。そして、再度スルフアミン酸ニツケルめつき
層にて一次めつきと同一条件で電着をして二次め
つき層６（厚みは例えば0.013mmとする）を形成
して一次めつき層２と密着させるとともにステン
レス鋼線３を覆う。つぎに、被覆部９、すなわ
ち、インク溜まり部分に相当する硬化した感光樹
脂を、公知の方法、たとえば、キシレンとセロソ
ルブの１：１混合溶剤に膨じゆんさせて除去す
る。そして、第４図のようにステンレス鋼線３の
固定を解除し、めつき層２，３を基板１から剥離
するとともにステンレス鋼線３を引き抜いてノズ
ルＡを完成させる。 Next, after drying the photosensitive resin layer 4, a pattern film (not shown) is adhered thereon, exposed and developed, and the uncured portion is removed by a known method to leave the primary plating layer 2 in the exposed portion 5. and a covering portion 9 covered with a cured photosensitive resin layer.
Next, the exposed portion 5 of the nickel surface corresponding to the opaque portion of the pattern film is washed with hydrochloric acid water. That is, when the uncured photosensitive resin is removed, an oxidized coating is formed on the exposed nickel surface, and this oxidized coating 10 is removed by washing with hydrochloric acid water. Then, the nickel sulfamic acid plating layer is electrodeposited again under the same conditions as the primary plating to form the secondary plating layer 6 (thickness is, for example, 0.013 mm), which is brought into close contact with the primary plating layer 2. It also covers the stainless steel wire 3. Next, the cured photosensitive resin corresponding to the covering portion 9, that is, the ink reservoir portion, is removed by a known method, for example, by swelling with a 1:1 mixed solvent of xylene and cellosolve. Then, as shown in FIG. 4, the fixation of the stainless steel wire 3 is released, the plating layers 2 and 3 are peeled off from the substrate 1, and the stainless steel wire 3 is pulled out to complete the nozzle A.
なお、第４図中１１はインク溜りとして使用で
きその形状は上記被覆部９の形状を変えることに
より任意に変えることができる。また、ノズルＡ
の先端部は土手７を構成する水溶性感光液の硬膜
部と感光樹脂層４とで遮断された状態で形成され
るために形状が均一化し、したがつて放出される
インキの方向性が同一にできる。 Incidentally, reference numeral 11 in FIG. 4 can be used as an ink reservoir, and its shape can be changed arbitrarily by changing the shape of the covering portion 9. Also, nozzle A
Since the tip of the tip is blocked by the photosensitive resin layer 4 and the hardening film of the water-soluble photosensitive liquid that constitutes the bank 7, the shape is uniform, and the directionality of the ejected ink is therefore uniform. Can be made the same.
また水溶性感光液の基板への密着を良くするた
めに塩酸と硝酸の10％水溶液を温度40℃〜45℃に
加温し、５分間浸漬し、水洗及び乾燥後水溶性感
光液を塗布するようにする。感光性塗膜は厚い程
良く、その為に0.015mmの厚みにして原版を密着
させ、高圧水銀灯で露光現像し又塗膜の強度を保
つために現像後露光及び150℃の温度にて30分間
ベーキング処理をする。 In addition, in order to improve the adhesion of the water-soluble photosensitive liquid to the substrate, a 10% aqueous solution of hydrochloric acid and nitric acid is heated to a temperature of 40°C to 45°C, immersed for 5 minutes, washed with water and dried, and then the water-soluble photosensitive liquid is applied. Do it like this. The thicker the photosensitive coating, the better. Therefore, the thickness of the original plate was made to be 0.015 mm, and the original plate was exposed and developed using a high-pressure mercury lamp. In order to maintain the strength of the coating, the film was exposed to light after development and at a temperature of 150°C for 30 minutes. Perform baking process.
スルフアミン酸ニツケルめつきの液組成はスル
フアミン酸ニツケル450ｇ／、硼酸40ｇ／、
界面活性剤20c.c.／とし、めつき条件は温度48℃
〜50℃、PH4.0〜4.5、電流密度４〜6A／dm2とす
る。 The liquid composition for nickel sulfamate plating is nickel sulfamate 450g/, boric acid 40g/,
Surfactant 20c.c./Plating condition: Temperature 48℃
~50℃, PH4.0~4.5, and current density 4~6A/ dm2 .
上述のように、基板上にノズル母体となる一次
めつき層を形成したのち、この一次めつき層の上
に微細径のステンレス鋼線を張設し、次にこのス
テンレス鋼線を被覆するようにして一次めつき層
の表面に感光樹脂層を塗布し、次に所定箇所の感
光樹脂層を露光・現像ののち、硬化した樹脂部分
を除く未硬化部分を除去して一次めつき層及びス
テンレス鋼線を露出させ、次にこの露出箇所に二
次めつき層を形成して一次めつき層と電着接合す
るとともにステンレス鋼線を被覆し、しかるのち
硬化した感光樹脂を除去するとともに、めつき層
を基板から剥離しステンレス鋼線をめつき層から
引き抜くようにしたので、インク溜りなどを一体
として製造でき、又鋼線を引抜き加工するので、
鋼線を腐食して除去するのに比べて腐食後の処理
が不要となり、この結果量産性の向上、コストの
低減が可能になるという効果を奏する。 As mentioned above, after forming the primary plating layer that will become the nozzle base on the substrate, a fine-diameter stainless steel wire is stretched over this primary plating layer, and then the stainless steel wire is covered. A photosensitive resin layer is applied to the surface of the primary plating layer, and then the photosensitive resin layer is exposed and developed at predetermined locations, and the uncured parts except for the hardened resin parts are removed to form the primary plating layer and the stainless steel. The steel wire is exposed, and then a secondary plating layer is formed on the exposed area and electrodeposition bonded to the primary plating layer, covering the stainless steel wire, and then the hardened photosensitive resin is removed and the plate is coated. Since the plating layer is peeled off from the substrate and the stainless steel wire is pulled out from the plating layer, ink reservoirs etc. can be manufactured as one piece, and since the steel wire is drawn out,
Compared to corroding and removing steel wires, no post-corrosion treatment is required, and as a result, mass productivity can be improved and costs can be reduced.
第１図、第２図及び第３図ａ，ｂは本発明の製
造工程を示す図、第４図ａは同上のノズルの平面
図、第４図ｂは第４図ａのＸ−Ｘ断面図である。
１…基板、２…一次めつき層、３…鋼線、４…
感光樹脂層、５…露出部、６…二次めつき層。
Figures 1, 2, and 3a and 3b are diagrams showing the manufacturing process of the present invention, Figure 4a is a plan view of the same nozzle, and Figure 4b is the XX cross section of Figure 4a. It is a diagram. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Primary plating layer, 3...Steel wire, 4...
Photosensitive resin layer, 5... exposed portion, 6... secondary plating layer.
Claims (1)
成したのち、この一次めつき層の上に微細径のス
テンレス鋼線を張設し、次にこのステンレス鋼線
を被覆するようにして一次めつき層の表面に感光
樹脂を塗布し、次に所定箇所の感光樹脂層を露
光・現像ののち、硬化した樹脂部分を除く未硬化
部分を除去して一次めつき層及びステンレス鋼線
を露出させ、次にこの露出箇所に二次めつき層を
形成して一次めつき層と電着接合するとともにス
テンレス鋼線を被覆し、しかるのち硬化した感光
樹脂を除去するとともにめつき層を基板から剥離
しステンレス鋼線をめつき層から引き抜くことを
特徴とする微量噴射用ノズルの製造方法。1 After forming a primary plating layer that will become the nozzle base on the substrate, a fine-diameter stainless steel wire is stretched over this primary plating layer, and then the stainless steel wire is covered with a primary plating layer. Apply photosensitive resin to the surface of the plating layer, then expose and develop the photosensitive resin layer at predetermined locations, and then remove the uncured parts except for the hardened resin parts to expose the primary plating layer and the stainless steel wire. Next, a secondary plating layer is formed on this exposed area and electrodeposition bonded to the primary plating layer, covering the stainless steel wire, and then the hardened photosensitive resin is removed and the plating layer is peeled off from the substrate. A method for manufacturing a nozzle for micro-injection, characterized by pulling out a stainless steel wire from a plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18010084A JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18010084A JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157346A JPS6157346A (en) | 1986-03-24 |
| JPH0338111B2 true JPH0338111B2 (en) | 1991-06-07 |
Family
ID=16077426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18010084A Granted JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157346A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU1139100A (en) | 1998-10-16 | 2000-05-08 | Silverbrook Research Pty Limited | Improvements relating to inkjet printers |
| US6303221B1 (en) | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
-
1984
- 1984-08-28 JP JP18010084A patent/JPS6157346A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157346A (en) | 1986-03-24 |
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