JPH033737U - - Google Patents
Info
- Publication number
- JPH033737U JPH033737U JP6513689U JP6513689U JPH033737U JP H033737 U JPH033737 U JP H033737U JP 6513689 U JP6513689 U JP 6513689U JP 6513689 U JP6513689 U JP 6513689U JP H033737 U JPH033737 U JP H033737U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- die
- semiconductor chip
- bonded
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6513689U JPH033737U (US07122547-20061017-C00273.png) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6513689U JPH033737U (US07122547-20061017-C00273.png) | 1989-06-02 | 1989-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033737U true JPH033737U (US07122547-20061017-C00273.png) | 1991-01-16 |
Family
ID=31596698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6513689U Pending JPH033737U (US07122547-20061017-C00273.png) | 1989-06-02 | 1989-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033737U (US07122547-20061017-C00273.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011080796A (ja) * | 2009-10-05 | 2011-04-21 | Mitsubishi Electric Corp | 半導体素子のパッケージおよびそのテストソケット |
-
1989
- 1989-06-02 JP JP6513689U patent/JPH033737U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011080796A (ja) * | 2009-10-05 | 2011-04-21 | Mitsubishi Electric Corp | 半導体素子のパッケージおよびそのテストソケット |