JPH0335583A - Formation of flexible circuit board and through hole part thereof - Google Patents
Formation of flexible circuit board and through hole part thereofInfo
- Publication number
- JPH0335583A JPH0335583A JP1170482A JP17048289A JPH0335583A JP H0335583 A JPH0335583 A JP H0335583A JP 1170482 A JP1170482 A JP 1170482A JP 17048289 A JP17048289 A JP 17048289A JP H0335583 A JPH0335583 A JP H0335583A
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- circuit board
- conductive
- adhesive layer
- conductive foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000011888 foil Substances 0.000 claims abstract description 51
- 239000012790 adhesive layer Substances 0.000 claims abstract description 48
- 239000000843 powder Substances 0.000 claims abstract description 31
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 30
- 230000001070 adhesive effect Effects 0.000 abstract description 30
- 239000000463 material Substances 0.000 abstract description 25
- 238000003475 lamination Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000012939 laminating adhesive Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フィルム基材を不要としたフレキシブル回路
基板及びスルーホール部の形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a flexible circuit board that does not require a film base material, and a method for forming a through-hole portion.
（従来の技術）
第５図に示すように、従来の一般的なフレキシブル回路
基板Ａは、電気絶縁性のフィルム基材ｌの両面に薄い接
着剤層２ａｓ２ｂを介して導電箔３ａ、３ｂをラミネー
トした五層構造を有する。(Prior Art) As shown in FIG. 5, a conventional general flexible circuit board A has conductive foils 3a and 3b laminated on both sides of an electrically insulating film base l with a thin adhesive layer 2as2b interposed therebetween. It has a five-layer structure.
このようなフレキシブル回路基板Ａは、通常、第６図に
示すように、第一のラミネート工程において、接着剤が
コーティングされた一方の導電箔３ａをフィルム基材ｌ
の片面（上面）に供給し、一対の熱圧着ロール４ａ、４
ｂで両者をラミネートした後、更に第二のラミネート工
程において、接着剤がコーティングされた他方の導電箔
３ｂをフィルム基材１の反対面（下面）に供給し、一対
の熱圧着ロール５ａ、５ｂで両者をラミネートする方法
により製造されている。尚、接着剤層がフィルム基材ｌ
にコーティングされる場合もある。As shown in FIG. 6, such a flexible circuit board A is usually manufactured by attaching one conductive foil 3a coated with an adhesive to a film base l in a first lamination process.
A pair of thermocompression rolls 4a, 4
After laminating the two in step b, in a second lamination step, the other conductive foil 3b coated with an adhesive is supplied to the opposite surface (lower surface) of the film base material 1, and a pair of thermocompression rolls 5a, 5b are applied. It is manufactured by laminating the two together. Note that the adhesive layer is a film base l.
Sometimes it is coated.
そして、得られたフレキシブル回路基板Ａは、導電箔３
ａ、３ｂをエツチングすることによって両面に回路が形
成され、更に、該導電箔３ａ、３ｂを１続するスルーホ
ール部が形成されて完成品となる。その場合、スルーホ
ール部の形成方法としては、通常、第７図に示すスルー
ホール部６ａのように、フレキシブル回路基板Ａに透孔
７を形成してメツキ処理により該透孔の内面から上下開
口縁をメツキ層８で被覆するか、或いは、第８図に示す
スルーホール部６ｂのように、フレキシブル回路基板Ａ
に透孔７を形成してその中に導電インク９を充填する方
法が採用される。Then, the obtained flexible circuit board A has a conductive foil 3
A circuit is formed on both sides by etching the conductive foils 3a and 3b, and a through hole is formed to connect the conductive foils 3a and 3b, resulting in a completed product. In that case, the method for forming the through-hole section is usually to form a through-hole 7 in the flexible circuit board A and to open the upper and lower sides from the inner surface of the through-hole by plating, as in the through-hole section 6a shown in FIG. Either cover the edges with a plating layer 8, or cover the flexible circuit board A with a through-hole portion 6b shown in FIG.
A method is employed in which a through hole 7 is formed and conductive ink 9 is filled therein.
（発明が解決しようとする課題）
しかしながら、上記のフレキシブル回路基板Ａは、導電
箔３ａ、３ｂとフィルム基材ｌの双方に対し良好な接着
性を有する接着剤を選択使用してフィルム基材１の両面
に導電箔３ａ、３ｂをラミネートする必要があるため、
接着剤の種類が制限されるという問題があり、しかも、
熱収縮の異なる複雑な５層構造であるため、導電箔３ａ
、３ｂをラミネートしたあとの寸法安定性が悪いという
問題があった。また、このフレキシブル回路基板Ａの製
造には二つのラミネート工程が組み込まれるので、製造
工程が複雑になるという問題もあつた。(Problem to be Solved by the Invention) However, the above-mentioned flexible circuit board A is manufactured by selecting and using an adhesive that has good adhesion to both the conductive foils 3a and 3b and the film base material l. Because it is necessary to laminate conductive foils 3a and 3b on both sides of the
There is a problem that the types of adhesives are limited, and
Because it has a complex five-layer structure with different heat shrinkage, the conductive foil 3a
, 3b was laminated with a problem of poor dimensional stability. Furthermore, since two lamination processes are incorporated in the manufacture of the flexible circuit board A, there is also the problem that the manufacturing process becomes complicated.
更に、スルーホール部として上記のようなメツキ処理に
よるスルーホール部６ａや導電インク充填によるスルー
ホール部６ｂを形成すると、それに要する加工工数が多
くなり、コスト的にも不利になるという問題があった。Furthermore, if the through-hole portion 6a is formed by plating as described above or the through-hole portion 6b is filled with conductive ink as the through-hole portion, there is a problem in that the number of processing steps required increases, which is disadvantageous in terms of cost. .
本発明は上記問題に鑑みてなされたもので、その目的は
、接着剤の選択範囲が広く、寸法安定性に優れ、従来よ
り単純な製造工程で能率良く量産できるフィルム基材の
不要なフレキシブル回路基板を提供することにある。本
発明の他の目的は、上記に加えてスルーホール部を極く
簡単に形成できるフレキシブル回路基板を提供すること
にある。The present invention has been made in view of the above-mentioned problems, and its purpose is to create a flexible circuit that does not require a film base material, which allows for a wide range of adhesive selection, has excellent dimensional stability, and can be mass-produced efficiently using a simpler manufacturing process than conventional ones. The purpose is to provide the substrate. In addition to the above, another object of the present invention is to provide a flexible circuit board in which through-hole portions can be formed extremely easily.
本発明の更に他の目的は、フレキシブル回路基板にスル
ーホール部を簡単に形成することのできる方法を提供す
ることにある。Still another object of the present invention is to provide a method for easily forming through-hole portions in a flexible circuit board.
（課題を解決するための手段）
本発明の第一のフレキシブル回路基板は、電気絶縁性の
接着剤層を片面に設けた二枚の導電箔を、該接着剤層が
内側となるようにラミネートして成ることを特徴とする
ものであり、これによって上記の目的が達成される。(Means for Solving the Problems) A first flexible circuit board of the present invention is made by laminating two conductive foils each having an electrically insulating adhesive layer on one side so that the adhesive layer is on the inside. This is characterized by the following, and thereby the above object is achieved.
また、本発明の第二のフレキシブル回路基板は、導電性
粉末がリークしない濃度で分散された電気絶縁性の導電
性粉末入り接着剤層を片面に設けた二枚の導電箔を、該
接着剤層が内側となるようにラミネートして成ることを
特徴とするものであり、これによって上記の他の目的が
達成される。In addition, the second flexible circuit board of the present invention includes two conductive foils each having an adhesive layer containing electrically insulating conductive powder dispersed in a concentration that does not leak conductive powder on one side. It is characterized by being laminated so that the layers are on the inside, thereby achieving the other objects mentioned above.
更に、本発明のスルーホール部の形成方法は、第二のフ
レキシブル回路基板をプレス加工により局部的に薄肉化
してスルーホール部を形成することを特徴としており、
これによって上記の更に他の目的が達成される。Furthermore, the method for forming a through-hole portion of the present invention is characterized in that the through-hole portion is formed by locally thinning the second flexible circuit board by press working,
This achieves the other objectives mentioned above.
（作用）
本発明の第一のフレキシブル回路基板は、ラミネートさ
れた二枚の導電箔の内側の電気絶縁性接着剤層が、ラミ
ネート用の接着剤としての役目とフィルム基材としての
役目を兼ねるので、フィルム基材が存在しなくても、こ
の内側の接着剤層によって両表面の導電箔が絶縁され、
フレキシブル回路基板が形層れしないように保形される
。このようにフィルム基材がなくなると、従来のフレキ
シブル回路基板のように導電箔とフィルム基材の双方に
対して良好な接着力を有する接着剤を選択使用する必要
がなくなり、導電箔に対してのみ良好な接着力を有する
電気絶縁性の接着剤を選択すればよいことになるので、
接着剤の選択範囲が拡大し、また、フィルム基材の熱伸
縮に起因する寸法安定性低下の欠点も改善される。更に
、このフレキシブル回路基板は、°片面に接着剤層を設
けた二枚の導電箔を単一のラミネート工程でラミネート
するだけで製造できるので、製造工程を従来より単純化
することができる。(Function) In the first flexible circuit board of the present invention, the electrically insulating adhesive layer on the inside of the two laminated conductive foils serves both as an adhesive for lamination and as a film base material. Therefore, even if there is no film base material, the conductive foils on both surfaces are insulated by this inner adhesive layer.
The shape of the flexible circuit board is maintained so that it does not lose its shape. When the film base material is eliminated, there is no need to select and use an adhesive that has good adhesion to both the conductive foil and the film base material as in conventional flexible circuit boards. You only need to select an electrically insulating adhesive with good adhesive strength.
The selection range of adhesives is expanded, and the disadvantage of reduced dimensional stability due to thermal expansion and contraction of the film base material is also improved. Furthermore, this flexible circuit board can be manufactured by simply laminating two conductive foils each having an adhesive layer on one side in a single lamination process, making the manufacturing process simpler than before.
また、本発明の第二のフレキシブル回路基板は、導電性
粉末入り接着剤層がその内部に導電性粉末をリークしな
い濃度で分散させたものであるため、そのままの状態で
は第一のフレキシブル回路基板の接着剤層と同様にフィ
ルム基材としての役目を兼ね備え、この導電性粉末入り
接着剤層によって両表面の導電箔の絶縁とフレキシブル
回路基板の保形が行われる。Furthermore, since the second flexible circuit board of the present invention has the conductive powder-containing adhesive layer dispersed therein at a concentration that does not leak the conductive powder, the second flexible circuit board of the present invention is similar to the first flexible circuit board in its original state. Like the adhesive layer, it also serves as a film base material, and this adhesive layer containing conductive powder insulates the conductive foils on both surfaces and maintains the shape of the flexible circuit board.
そして、本発明のスルーホール部の形成方法により、こ
の第二のフレキシブル回路基板をプレス加工して局部的
に薄肉化すると、その薄肉化された部分においては、両
面の導電箔が互いに接近すると共に、接着剤層中の導電
性粉末の分散状態が密になり、この導電性粉末を介して
両面の導電箔が導通するため、スルーホール部が簡単に
形成される。Then, when this second flexible circuit board is pressed and locally thinned by the through-hole forming method of the present invention, the conductive foils on both sides approach each other and The conductive powder in the adhesive layer is densely dispersed, and the conductive foils on both sides are electrically connected through the conductive powder, so that the through-hole portion is easily formed.
（実施例） 以下、図面に基づいて本発明の詳細な説明する。(Example) Hereinafter, the present invention will be described in detail based on the drawings.
第１図は本発明フレキシブル回路基板の実施例の部分断
面図、第２図はそのフレキシブル回路基板の製造方法の
説明図である。FIG. 1 is a partial sectional view of an embodiment of the flexible circuit board of the present invention, and FIG. 2 is an explanatory diagram of a method of manufacturing the flexible circuit board.
このフレキシブル回路基板Ｂは、電気絶縁性の接着剤層
１１を片面に設けた二枚の導電箔１２ａ、１２ｂを、該
接着剤層１１が内側となるように重ね合わせてラミネー
トしたもので、この内側の接着剤層１１がラミネート用
の接着剤としての役目とフィルム基材としての役目を兼
ね備えた構造をしている。そのため、フィルム基材が存
在しなくても、この内側の接着剤層１１によって両面の
導電箔１２ａ、１２ｂが絶縁され、フレキシブル回路基
板が形層れしないように保形されるのである。This flexible circuit board B is made by laminating two conductive foils 12a and 12b each having an electrically insulating adhesive layer 11 on one side, one on top of the other with the adhesive layer 11 on the inside. The inner adhesive layer 11 has a structure that serves as both a laminating adhesive and a film base material. Therefore, even if there is no film base material, the conductive foils 12a and 12b on both sides are insulated by the inner adhesive layer 11, and the shape of the flexible circuit board is maintained so that it does not deviate.
・このように接着剤層１１はフィルム基材としての役目
を兼ねるものであるから、その全体厚みｔを２０〜５０
μｍ程度に設定することが望ましい。・Since the adhesive layer 11 also serves as a film base material, the total thickness t should be 20 to 50 mm.
It is desirable to set it to about μm.
接着剤層１１の全体厚みｔが２０μｍより小さくなると
、フレキシブル回路基板Ｂの強度が低下し、絶縁性も不
十分になる恐れがあり、逆に５０μｍより大きくなると
、フレキシブル回路基板のフレキシビリティが低下する
等の不都合を生じるからである。If the total thickness t of the adhesive layer 11 is smaller than 20 μm, the strength of the flexible circuit board B may be reduced and the insulation properties may become insufficient. On the other hand, if it is larger than 50 μm, the flexibility of the flexible circuit board will be reduced. This is because it causes inconveniences such as
接着剤としては、導電箔１２ａＳ １２ｂに対して良好
な接着力を有する電気絶縁性の接着剤がいずれも使用可
能であり、例えばウレタン系、エポキシ系その他種々の
樹脂接着剤を使用することができる。この点、従来のフ
レキシブル回路基板に用いる接着剤は、フィルム基材と
導電箔の双方に対して良好な接着力を有するものに限ら
れていたが、本発明のフレキシブル回路基板では、フィ
ルム基材に対する接着性を何ら考慮することなく接着剤
を選択できるので、接着剤の選択範囲が従来より拡大す
るという利点がある。As the adhesive, any electrically insulating adhesive that has good adhesion to the conductive foils 12aS and 12b can be used; for example, urethane-based, epoxy-based, and other various resin adhesives can be used. . In this respect, adhesives used for conventional flexible circuit boards are limited to those that have good adhesion to both the film base material and the conductive foil, but in the flexible circuit board of the present invention, the film base material Since the adhesive can be selected without considering the adhesion to the material, there is an advantage that the range of adhesive selection is wider than before.
また、両面の導電箔１２ａＳ １２ｂは、従来のフレキ
シブル回路基板における導電箔と同様のものでよく、例
えばアルミニウム箔、銅箔その他の金属箔が好適に使用
される。Further, the conductive foils 12aS and 12b on both sides may be similar to conductive foils in conventional flexible circuit boards, and for example, aluminum foil, copper foil, or other metal foil is preferably used.
このような構成のフレキシブル回路基板Ｂは、第２図に
例示の方法によって簡単に製造することができる。即ち
、一方の導電箔１２ａをガイドロール１３ａとコータロ
ール１４ａの間に連続供給し、導電箔１２ａの片面（図
では下面）に接着剤を前記厚み七の約半分の厚さにコー
ティングして接着剤層１１を形成する。これと平行して
、他方の導電箔１２ｔ）をガイドロール１３ｂとコーク
ロール１４ｂの間に連続供給し、同様に厚みｔの約半分
の厚さの接着剤層１１を導電箔１２ｂの片面（図では上
面）に形成する。The flexible circuit board B having such a configuration can be easily manufactured by the method illustrated in FIG. 2. That is, one conductive foil 12a is continuously supplied between the guide roll 13a and the coater roll 14a, and adhesive is coated on one side (lower side in the figure) of the conductive foil 12a to a thickness of about half of the thickness 7, and then bonded. The agent layer 11 is formed. In parallel with this, the other conductive foil 12t) is continuously supplied between the guide roll 13b and the cork roll 14b, and similarly the adhesive layer 11 with a thickness of about half the thickness t is applied to one side of the conductive foil 12b (Fig. Then, form it on the top surface).
そして、接着剤層１１が形成された双、方の導電箔１２
ａ、１２ｂを予備乾燥機１５ａ、１５ｂに通して接着剤
層１１を予備乾燥してから、ガイドロール１６ａ、１６
ｂを経て一対の熱圧着ロール１７ａ、１７ｂ間に連続供
給し、双方の導電箔１２ａ、１２ｂを接着剤層１１Ｓ
１１が内側となるように重ね合わせて該ａ−ル１７ａ、
ｆ７ｂで熱圧着し、一体にラミネートする。Then, the two conductive foils 12 on which the adhesive layer 11 is formed
a, 12b through pre-dryers 15a, 15b to pre-dry the adhesive layer 11, and then guide rolls 16a, 16.
The conductive foils 12a and 12b are continuously supplied between the pair of thermocompression rolls 17a and 17b through the adhesive layer 11S.
11 is on the inside, and the a-rule 17a,
Heat and press with f7b and laminate together.
かくして連続製造されたフレキシブル回路基板Ｂは、更
に乾燥機（図示せず）に通されて接着剤層１１が完全に
乾燥される。このとき、従来のフレキシブル回路基板の
ようにフィルム基材があると寸法安定性が悪いけれども
、このフレキシブル回路基板Ｂはフィルム基材がないた
め寸法安定性が良好である。The flexible circuit board B thus continuously manufactured is further passed through a dryer (not shown) to completely dry the adhesive layer 11. At this time, if there is a film base material like a conventional flexible circuit board, dimensional stability is poor, but this flexible circuit board B has good dimensional stability because it does not have a film base material.
上記のように、このフレキシブル回路基板Ｂは単一のラ
ミネート工程によって製造できるので、製造工程が従来
より単純となり、省力化を図ることができる。また、接
着剤層１１の厚みが合計で２０〜３０μｍ程度でよい場
合には、コータロール１４１）及び予備乾燥機１５ｂの
工程を省略し、コークロール１４ａの工程のみを行って
片面のみに接着剤を設ける構造も可能である。As described above, this flexible circuit board B can be manufactured by a single lamination process, so the manufacturing process is simpler than before, and labor savings can be achieved. In addition, if the total thickness of the adhesive layer 11 is about 20 to 30 μm, the steps of coater roll 141) and pre-dryer 15b are omitted, and only the step of coke roll 14a is performed, and the adhesive is applied only to one side. It is also possible to have a structure in which
尚、上記製造方法において、予備乾燥機１５ａ、１５ｔ
）を省略し、双方の導電箔１２ａ、１２ｂの接着剤層１
１を自然乾燥させるようにしてもよい。In addition, in the above manufacturing method, the pre-dryers 15a, 15t
) is omitted, and the adhesive layer 1 of both conductive foils 12a, 12b is omitted.
1 may be allowed to dry naturally.
また、場合によっては、導電箔１２ａ、１２ｂに接着剤
をコーティングする工程と、双方の導電箔１２ａ、１２
ｂをラミネートする工程を分離し、予め接着剤をコーテ
ィングした導電箔１２ａ、１２ｂを個別にＴ＄備してお
き、後で両者をラミネートするようにしてもよい。In some cases, a step of coating the conductive foils 12a, 12b with adhesive and a step of coating both the conductive foils 12a, 12b with an adhesive may be performed.
It is also possible to separate the step of laminating the conductive foils 12a and 12b coated with an adhesive in advance, and to laminate them later.
第３図は本発明フレキシブル回路基板の他の実施例を示
す部分断面図である。このフレキシブル回路基板Ｃは、
導電性粉末１８がリークしない濃度で分散された電気絶
縁性の導電性粉末入り接着剤層１９を片面に設けた二枚
の導電箔１２ａ、１２ｂを、該接着剤層が内側となるよ
うに重ね合わせてラミネートしたもので、この内側の導
電性粉末入り接着剤層１９が第１図のフレキシブル回路
基板における接着剤層１１と同様にラミネート用の接着
剤としての役目とフィルム基材としての役目を兼ね備え
た構造をしている。FIG. 3 is a partial sectional view showing another embodiment of the flexible circuit board of the present invention. This flexible circuit board C is
Two conductive foils 12a and 12b each having an adhesive layer 19 containing electrically insulating conductive powder dispersed in a concentration that does not leak conductive powder 18 on one side are stacked so that the adhesive layer is on the inside. The conductive powder-containing adhesive layer 19 on the inside functions as a laminating adhesive and as a film base material, similar to the adhesive layer 11 in the flexible circuit board shown in FIG. It has a structure that combines
この導電性粉末１８は例えば炭素粉末や金属粉末より成
るもので、リークしない濃度で接着剤層１−９に分散さ
れる必要があり、あまり高い濃度で分散されると接着剤
層１９の電気絶縁性が損なわれる。電気絶縁性の践点か
らは導電性粉末の濃度が低いほど良いわけであるが、あ
まり濃度が低いと、後述するようにスルーホール部を形
成しても両面の導電箔１２ａ、１２ｂが導通不良となる
ので、適正な濃度範囲で分散されることが望ましい。This conductive powder 18 is made of carbon powder or metal powder, for example, and needs to be dispersed in the adhesive layer 1-9 at a concentration that will not cause leakage. Sexuality is impaired. From the point of view of electrical insulation, the lower the concentration of the conductive powder, the better. However, if the concentration is too low, the conductive foils 12a and 12b on both sides will have poor conductivity even if through-hole portions are formed, as will be described later. Therefore, it is desirable to disperse within an appropriate concentration range.
導電性粉末１８の適正な濃度範囲は導電性粉末の種類に
よって異なる。導電粉末としては、カーボン、ニッケル
、銀等の各種導電粉末が使用できるが、粒子は通常５〜
３０μｍ１ 分散量は１〜２％（体積比）とするのが好
ましい。The appropriate concentration range for the conductive powder 18 varies depending on the type of conductive powder. Various conductive powders such as carbon, nickel, and silver can be used as the conductive powder, but the particles are usually 5 to 50%.
30 μm 1 The amount of dispersion is preferably 1 to 2% (volume ratio).
尚、導電箔１２ａ、１２１）の材質や、導電性粉末入り
接着剤層１９の厚みｔや、接着剤の種類等については、
第１図のフレキシブル回路基板のものと実質的に同様で
あるので説明を省略する。The material of the conductive foils 12a, 121), the thickness t of the conductive powder-containing adhesive layer 19, the type of adhesive, etc.
Since it is substantially the same as that of the flexible circuit board shown in FIG. 1, the explanation will be omitted.
このようなフレキシブル回路基板Ｃは、前述した第２図
の製造方法において、接着剤に代えて導電性粉末を分散
させた導電性粉末入り接着剤を導電箔１２ａ、１２ｂに
それぞれコーティングすることにより簡単に製造するこ
とができる。Such a flexible circuit board C can be easily manufactured by coating the conductive foils 12a and 12b with an adhesive containing conductive powder in which conductive powder is dispersed instead of the adhesive in the manufacturing method shown in FIG. 2 described above. can be manufactured.
次に、第４図を参照しながら、フレキシブル回路基［Ｃ
にスルーホール部を形成する方法を説明する。Next, referring to FIG. 4, the flexible circuit board [C
The method for forming the through-hole section will be explained below.
まず、フレキシブル回路基板Ｃを加熱プレス機にセット
し、該基板Ｃのスルーホール部を形成すべき個所を押圧
ビン２０ａと支持ピン２０１）で上下から加熱プレス加
工して、該基板Ｃを局部的に圧縮し薄肉化する。このよ
うに加熱プレス加工すると、薄肉化された部分では、両
面の導電箔１２ａ、１２ｂが内側に凹曲して互いに接近
し、導電性粉末入り接着剤層１９も圧縮されて内部の導
電性粉末１８の分散状態が密になる。そのため、この密
に分散された導電性粉末１８を介して両面の導電箔１２
ａ、１２ｂが導通し、スルーホール部２１が簡単に形成
されるのである。これに対し、薄肉化されない部分の導
電性粉末入り接着剤層１９は、導電性粉末１８の分散状
態が粗のままであるため電気絶縁性を維持する。First, the flexible circuit board C is set in a heating press machine, and the parts of the board C where through holes are to be formed are heated and pressed from above and below using the press bottle 20a and the support pin 201), and the board C is locally pressed. Compress and thin the wall. When hot pressing is performed in this way, the conductive foils 12a and 12b on both sides curve inward and approach each other in the thinned portion, and the conductive powder-containing adhesive layer 19 is also compressed, so that the conductive powder inside is compressed. The dispersion state of 18 becomes dense. Therefore, the conductive foils 12 on both sides are
A and 12b are electrically connected, and the through hole portion 21 can be easily formed. On the other hand, in the part of the adhesive layer 19 containing conductive powder that is not thinned, the conductive powder 18 remains coarsely dispersed, and thus maintains electrical insulation.
加熱プレス加工の圧力については、導電箔１２ａＳ １
２ｂが破損しない圧力範囲内で出来るだけ高圧に設定し
、両面の導電箔１２ａ、１２ｂの間隔が５μｍ以下とな
るようにフレキシブル回路基板Ｃを圧縮することが好ま
しい。尚、加熱プレス加工の温度については、導電性粉
末入り接着剤層１９の樹脂の軟化、溶融温度を考慮して
適正な温度を設定すればよい。Regarding the pressure of hot press processing, conductive foil 12aS 1
It is preferable to set the pressure as high as possible within a pressure range that does not damage the flexible circuit board C and compress the flexible circuit board C so that the distance between the conductive foils 12a and 12b on both sides is 5 μm or less. It should be noted that the temperature of the hot press process may be set to an appropriate temperature in consideration of the softening and melting temperature of the resin of the conductive powder-containing adhesive layer 19.
（発明の効果）
以上の説明から明らかなように、本発明のフレキシブル
回路基板は、内側の接着剤層をフィルム基材として兼用
することによりフィルム基材を不要にしてｌ！Ｊ串な三
層構造としたため、製造工程を単純化して能率良く安価
に量産することが可能となり、接着剤の選択範囲が拡大
し、寸法安定性も改善できるといった効果を奏する。(Effects of the Invention) As is clear from the above description, the flexible circuit board of the present invention eliminates the need for a film base material by using the inner adhesive layer as a film base material. The J-shaped three-layer structure simplifies the manufacturing process, making it possible to mass-produce efficiently and inexpensively, expanding the selection range of adhesives, and improving dimensional stability.
また、本発明のフレキシブル回路基板は、フィルム基材
として兼用する内側の接着剤層を導電性粉末入り接着剤
層とすることもできるので、上記効果のほかに、本発明
のスルーホール部形成方法によってスルーホール部を極
く簡単に形成できるといった効果を奏する。In addition, in the flexible circuit board of the present invention, the inner adhesive layer that also serves as a film base material can be an adhesive layer containing conductive powder. This has the effect that the through-hole portion can be formed extremely easily.
そして、本発明のスルーホール部形成方法は、プレス加
工によって上述のフレキシブル回路基板を圧縮し薄肉化
するだけでよいから、従来のメツキ処理や導電インク充
填によるスルーホール部形成方法に比べて加工工数や装
置類を大幅に減少させることができ、プレス機さえあれ
ば自由な位置にスルーホール部を極く簡単に形成するこ
とができるといった効果を奏する。The method for forming through-hole portions of the present invention requires only compressing and thinning the above-mentioned flexible circuit board by press processing, so it requires fewer processing steps than conventional methods for forming through-hole portions by plating or filling with conductive ink. It is possible to significantly reduce the number of devices and equipment, and it is possible to form through-hole portions at arbitrary positions extremely easily as long as there is a press machine.
４、 の な會 Ｂ
第１図は本発明フレキシブル回路基板の実施例を示す部
分断面図、第２図はそのフレキシブル回路基板の製法例
の説明図、第３図は本発明フレキシブル回路基板の他の
実施例を示す部分断面図、第４図は本発明のスルーホー
ル部の形成方法を説明する部分断面図、第５図は従来の
フレキシブル回路基板を示す部分断面図、第６図は従来
のフレキシブル回路基板の製法の説明図、第７図及び第
８図はそれぞれ従来のスルーホール部を示す部分断面図
である。4. No Nakai B Fig. 1 is a partial cross-sectional view showing an embodiment of the flexible circuit board of the present invention, Fig. 2 is an explanatory diagram of an example of the manufacturing method of the flexible circuit board, and Fig. 3 is a partial cross-sectional view showing an example of the flexible circuit board of the present invention. FIG. 4 is a partial cross-sectional view illustrating the method of forming a through-hole portion of the present invention, FIG. 5 is a partial cross-sectional view showing a conventional flexible circuit board, and FIG. 6 is a partial cross-sectional view showing a conventional flexible circuit board. FIGS. 7 and 8, which are explanatory diagrams of a method for manufacturing a flexible circuit board, are partial cross-sectional views showing conventional through-hole portions, respectively.
１１・・・接着剤層、１２ａ、１２ｂ・・・導電箔、１
８・・・導電性粉末、１９・・・導電性粉末入り接着剤
Ｌ２１・・・スルーホール部、 Ｂ、 Ｃ・・・フ
レキシブル回路基板。11... Adhesive layer, 12a, 12b... Conductive foil, 1
8... Conductive powder, 19... Adhesive containing conductive powder L21... Through-hole portion, B, C... Flexible circuit board.
以上that's all
Claims (3)
を、該接着剤層が内側となるようにラミネートして成る
フレキシブル回路基板。1. A flexible circuit board made by laminating two sheets of conductive foil with an electrically insulating adhesive layer on one side so that the adhesive layer is on the inside.
縁性の導電性粉末入り接着剤層を片面に設けた二枚の導
電箔を、該接着剤層が内側となるようにラミネートして
成るフレキシブル回路基板。2. A flexible circuit made by laminating two conductive foils each having an adhesive layer on one side containing electrically insulating conductive powder dispersed at a concentration that prevents conductive powder from leaking, with the adhesive layer on the inside. substrate.
工により局部的に薄肉化してスルーホール部を形成する
スルーホール部の形成方法。3. A method for forming a through-hole portion, comprising locally thinning the flexible circuit board according to claim 2 by press working to form a through-hole portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1170482A JPH0750818B2 (en) | 1989-06-30 | 1989-06-30 | Flexible circuit board and through-hole forming method thereof |
| US07/543,876 US5241137A (en) | 1989-06-30 | 1990-06-27 | Flexible circuit board with an electrically insulating adhesive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1170482A JPH0750818B2 (en) | 1989-06-30 | 1989-06-30 | Flexible circuit board and through-hole forming method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0335583A true JPH0335583A (en) | 1991-02-15 |
| JPH0750818B2 JPH0750818B2 (en) | 1995-05-31 |
Family
ID=15905771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1170482A Expired - Fee Related JPH0750818B2 (en) | 1989-06-30 | 1989-06-30 | Flexible circuit board and through-hole forming method thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5241137A (en) |
| JP (1) | JPH0750818B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101112129B1 (en) * | 2009-11-16 | 2012-02-22 | 울산대학교 산학협력단 | Anti-Motion Foundation |
| JP5616218B2 (en) * | 2008-04-13 | 2014-10-29 | 美惠子 伊東 | Plant cultivation container |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461909B1 (en) | 2000-08-30 | 2002-10-08 | Micron Technology, Inc. | Process for fabricating RuSixOy-containing adhesion layers |
| US6903005B1 (en) | 2000-08-30 | 2005-06-07 | Micron Technology, Inc. | Method for the formation of RuSixOy-containing barrier layers for high-k dielectrics |
| JP2011018873A (en) * | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | Electromagnetic shielding method and electromagnetic shielding film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4087300A (en) * | 1974-01-07 | 1978-05-02 | Edward Adler | Process for producing metal-plastic laminate |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3276106A (en) * | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Preparation of multilayer boards for electrical connections between layers |
| US3483059A (en) * | 1965-12-17 | 1969-12-09 | Avery Products Corp | Applicator for pressure-sensitive adhesive labels |
| US3483058A (en) * | 1966-03-23 | 1969-12-09 | Polymer Corp | Electrical laminate and method of making same |
| US3617613A (en) * | 1968-10-17 | 1971-11-02 | Spaulding Fibre Co | Punchable printed circuit board base |
| US3612745A (en) * | 1970-07-08 | 1971-10-12 | Sierracin Corp | Flexural bus bar assembly |
| JPS54162174A (en) * | 1978-06-14 | 1979-12-22 | Sumitomo Bakelite Co | Method of producing flexible printed circuit board |
| DE3175416D1 (en) * | 1980-09-15 | 1986-11-06 | Ciba Geigy Ag | Use of flexible materials in printed circuits |
| DE3175384D1 (en) * | 1980-09-15 | 1986-10-30 | Ciba Geigy Ag | Use of flexible materials in printed circuits |
| US4424095A (en) * | 1981-01-12 | 1984-01-03 | Kollmorgen Technologies Corporation | Radiation stress relieving of polymer articles |
| US4479991A (en) * | 1982-04-07 | 1984-10-30 | At&T Technologies, Inc. | Plastic coated laminate |
| EP0189189B1 (en) * | 1985-01-23 | 1993-08-04 | Toyo Boseki Kabushiki Kaisha | Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof |
| US4868637A (en) * | 1985-11-26 | 1989-09-19 | Clements James R | Electronic device including uniaxial conductive adhesive and method of making same |
| US4832455A (en) * | 1986-09-11 | 1989-05-23 | Kabushiki Kaisha Toshia | Liquid crystal apparatus having an anisotropic conductive layer between the lead electrodes of the liquid crystal device and the circuit board |
| BR8606465A (en) * | 1986-12-29 | 1988-07-12 | Petroleo Brasileiro Sa | PORTO OCEANICO |
| US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
| US4900878A (en) * | 1988-10-03 | 1990-02-13 | Hughes Aircraft Company | Circuit terminations having improved electrical and structural integrity |
-
1989
- 1989-06-30 JP JP1170482A patent/JPH0750818B2/en not_active Expired - Fee Related
-
1990
- 1990-06-27 US US07/543,876 patent/US5241137A/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4087300A (en) * | 1974-01-07 | 1978-05-02 | Edward Adler | Process for producing metal-plastic laminate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5616218B2 (en) * | 2008-04-13 | 2014-10-29 | 美惠子 伊東 | Plant cultivation container |
| KR101112129B1 (en) * | 2009-11-16 | 2012-02-22 | 울산대학교 산학협력단 | Anti-Motion Foundation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0750818B2 (en) | 1995-05-31 |
| US5241137A (en) | 1993-08-31 |
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| LAPS | Cancellation because of no payment of annual fees |