JPH0334862B2 - - Google Patents

Info

Publication number
JPH0334862B2
JPH0334862B2 JP60081092A JP8109285A JPH0334862B2 JP H0334862 B2 JPH0334862 B2 JP H0334862B2 JP 60081092 A JP60081092 A JP 60081092A JP 8109285 A JP8109285 A JP 8109285A JP H0334862 B2 JPH0334862 B2 JP H0334862B2
Authority
JP
Japan
Prior art keywords
clad
alloy
sealing plate
plate
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60081092A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61239648A (ja
Inventor
Naoki Uchama
Kyoshi Takaku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP60081092A priority Critical patent/JPS61239648A/ja
Publication of JPS61239648A publication Critical patent/JPS61239648A/ja
Publication of JPH0334862B2 publication Critical patent/JPH0334862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60081092A 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板 Granted JPS61239648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60081092A JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60081092A JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Publications (2)

Publication Number Publication Date
JPS61239648A JPS61239648A (ja) 1986-10-24
JPH0334862B2 true JPH0334862B2 (https=) 1991-05-24

Family

ID=13736743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60081092A Granted JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Country Status (1)

Country Link
JP (1) JPS61239648A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0746705B2 (ja) * 1985-08-02 1995-05-17 富士通株式会社 半導体装置
JPH0744024Y2 (ja) * 1987-03-31 1995-10-09 三菱マテリアル株式会社 半導体セラミック・パッケージ用窓枠状ろう材付き封着板

Also Published As

Publication number Publication date
JPS61239648A (ja) 1986-10-24

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