JPH0332442U - - Google Patents

Info

Publication number

JPH0332442U

JPH0332442U JP7527089U JP7527089U JPH0332442U JP H0332442 U JPH0332442 U JP H0332442U JP 7527089 U JP7527089 U JP 7527089U JP 7527089 U JP7527089 U JP 7527089U JP H0332442 U JPH0332442 U JP H0332442U

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

heat sink

bonding

onto

Prior art date

1989-06-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 4
• 238000005476 soldering Methods 0.000 claims 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1