JPH0332423U - - Google Patents

Info

Publication number
JPH0332423U
JPH0332423U JP9405589U JP9405589U JPH0332423U JP H0332423 U JPH0332423 U JP H0332423U JP 9405589 U JP9405589 U JP 9405589U JP 9405589 U JP9405589 U JP 9405589U JP H0332423 U JPH0332423 U JP H0332423U
Authority
JP
Japan
Prior art keywords
lead frame
resin
mold
molding device
clamped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9405589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9405589U priority Critical patent/JPH0332423U/ja
Publication of JPH0332423U publication Critical patent/JPH0332423U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP9405589U 1989-08-09 1989-08-09 Pending JPH0332423U (US07223432-20070529-C00017.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9405589U JPH0332423U (US07223432-20070529-C00017.png) 1989-08-09 1989-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9405589U JPH0332423U (US07223432-20070529-C00017.png) 1989-08-09 1989-08-09

Publications (1)

Publication Number Publication Date
JPH0332423U true JPH0332423U (US07223432-20070529-C00017.png) 1991-03-29

Family

ID=31643396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9405589U Pending JPH0332423U (US07223432-20070529-C00017.png) 1989-08-09 1989-08-09

Country Status (1)

Country Link
JP (1) JPH0332423U (US07223432-20070529-C00017.png)

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