JPH0328664U - - Google Patents

Info

Publication number

JPH0328664U

JPH0328664U JP8935789U JP8935789U JPH0328664U JP H0328664 U JPH0328664 U JP H0328664U JP 8935789 U JP8935789 U JP 8935789U JP 8935789 U JP8935789 U JP 8935789U JP H0328664 U JPH0328664 U JP H0328664U

Authority

JP

Japan

Prior art keywords

circuit

conductor

conductor surface

soldered

bond

Prior art date

1989-07-29

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 4
• 238000007747 plating Methods 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1