JPH03241767A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPH03241767A
JPH03241767A JP3866490A JP3866490A JPH03241767A JP H03241767 A JPH03241767 A JP H03241767A JP 3866490 A JP3866490 A JP 3866490A JP 3866490 A JP3866490 A JP 3866490A JP H03241767 A JPH03241767 A JP H03241767A
Authority
JP
Japan
Prior art keywords
lead frame
punch
coining
tip parts
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3866490A
Other languages
Japanese (ja)
Inventor
Tokumi Togami
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP3866490A priority Critical patent/JPH03241767A/en
Publication of JPH03241767A publication Critical patent/JPH03241767A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To avoid defective bonding by a method wherein, after the tip parts of inner leads are plated, the tip parts are subjected to a coining process by a punch whose surface is roughed.
CONSTITUTION: The tip parts 2a of the inner leads 2 of a lead frame 7 are subjected to a coining process by the punch 9 of a press. The surface 9a of the punch 9 which faces the lead frame 7 is processed so as to have a rough surface. Therefore, if the punch 9 is made to descend while the lead frame 7 is placed on a punching die 8, the lead frame 7 is subjected to a coining process. At that time, even if a coining process is applied after plating, the rough surface of the punch 9 prevents the tip parts 2a of the inner leads 2 from having mirror surfaces. With this constitution, defective bonding can be avoided.
COPYRIGHT: (C)1991,JPO&Japio
JP3866490A 1990-02-20 1990-02-20 Manufacture of lead frame Pending JPH03241767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3866490A JPH03241767A (en) 1990-02-20 1990-02-20 Manufacture of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3866490A JPH03241767A (en) 1990-02-20 1990-02-20 Manufacture of lead frame

Publications (1)

Publication Number Publication Date
JPH03241767A true JPH03241767A (en) 1991-10-28

Family

ID=12531538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3866490A Pending JPH03241767A (en) 1990-02-20 1990-02-20 Manufacture of lead frame

Country Status (1)

Country Link
JP (1) JPH03241767A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148951A (en) * 1984-08-16 1986-03-10 Toshiba Corp Semiconductor device
JPS6242254B2 (en) * 1976-09-20 1987-09-07 Intaanashonaru Bijinesu Mashiinzu Corp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242254B2 (en) * 1976-09-20 1987-09-07 Intaanashonaru Bijinesu Mashiinzu Corp
JPS6148951A (en) * 1984-08-16 1986-03-10 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness

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