JPH0323980U - - Google Patents

Info

Publication number

JPH0323980U

JPH0323980U JP8542589U JP8542589U JPH0323980U JP H0323980 U JPH0323980 U JP H0323980U JP 8542589 U JP8542589 U JP 8542589U JP 8542589 U JP8542589 U JP 8542589U JP H0323980 U JPH0323980 U JP H0323980U

Authority

JP

Japan

Prior art keywords

hole

support frame

solder

prevention film

adhesion prevention

Prior art date

1989-07-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 4
• 230000002265 prevention Effects 0.000 claims description 3
• 239000000126 substance Substances 0.000 claims 1
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• 238000000034 method Methods 0.000 description 2
• 239000010931 gold Substances 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 230000000873 masking effect Effects 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1