JPH03235410A - Airtight hollow electronic parts - Google Patents

Abstract

PURPOSE:To obtain high airtightness by using thermoplastic synthetic resin superior in productivity and material cost for a cap body and a case body by ensuring the airtightness of an interface between the case body and a lead body by using adhesive for bonding and sealing airtightly the cap body and the case body to constitute a package. CONSTITUTION:The case body 11 is of such recessed shape that a wall parts 13 are formed integrally at both the ends of a base board part 12, and is made of the thermoplastic synthetic resin such as chloride plastic, etc., and is formed integrally with plural plate-shaped lead pieces 3 as the lead bodies by insert molding, and the inside end parts of the lead pieces 3 are exposed above the base board part 12, and the outside end parts project to the outside as penetrating both the end parts of the case body 11. The cap body 15 is of thin cylindrical shape with opening parts 16 at both its ends, and is made of the thermoplastic synthetic resin, and the case body 11 is inserted in it, and the outside end parts of the lead bodies 3 project to the outside from the opening parts 16. The adhesive 19 is filled up in the inside of the opening parts 16 so as to cover the end parts of the case body 11, and the airtightness of the interfaces between the cap body 15 and the case body 11 and between the case body 11 and the lead pieces 3 is ensured.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Field of Application) The present invention relates to an airtight device such as a surface acoustic wave device in which an electronic component element, such as a surface acoustic wave element, is housed in an airtight hollow package. This invention relates to hollow electronic components.

(Prior Art) For example, a surface acoustic wave device requires an airtight space on the surface of the surface acoustic wave element used.

For this reason, conventionally, as shown in FIG. 3, a plurality of metal plate-shaped lead pieces 3, which are integrally formed as a lead frame 2 by connecting portions 1 that are cut later, are combined by insert molding. A box-shaped case body 4 made of resin is integrally formed, and inside the case body 4, an inner end of the plurality of lead pieces 3 and an inner end of any of the plurality of lead pieces 3 are integrally formed. At the same time, the outer ends of the plurality of lead pieces 3 are made to penetrate through both ends of the case body 4 and protrude to the outside, as shown in FIG. After mounting a surface acoustic wave element 6 (hereinafter simply referred to as element 6) on the mounting portion 5 and electrically connecting the element 6 and the inner ends of the plurality of lead pieces 3 with metal wires 7, As shown in FIG. 5, a lid-shaped cap body 8 made of synthetic resin is attached to the opening of the case body 4, and the two are hermetically sealed with adhesive or ultrasonic heat welding, etc. A package having a hollow part 9 which is airtight to the surface of the part 6 is formed.

However, in a package with such a structure, since both the case body 4 and the cap body 8 are made of synthetic resin,
Although it is possible to ensure airtightness between the metal lead piece 3 and the case body 4, it is difficult to ensure airtightness between the metal lead piece 3 and the case body 4 because the difference in coefficient of thermal expansion causes the interface between the two to separate. Even when thermosetting synthetic resin such as epoxy, which is used in the packaging of semiconductor devices such as ICs and LSIs, is used, there is a gap between the side surface 31 of the plate-shaped lead piece 3 and the case body 4 shown in FIG. Although good adhesion can be maintained, lead piece 3
Since the direction of the shrinkage force of the resin is in the relationship shown by the arrow between the end face 3b and the case body 4, complete adhesion cannot be obtained, and it is difficult to obtain a low level of airtightness of about 2 atmospheres. was the limit.

By the way, thermosetting synthetic resins such as epoxy used in the packaging of semiconductor devices such as ICs and LSIs are originally adhesives, but release agents are added to improve their bonding properties with metals. Although it is a weakened material and has relatively high adhesion to metals such as the lead piece 3, it has problems in productivity and material cost.

In contrast, engineering plastics (hereinafter referred to as
Thermoplastic synthetic resins such as engineering plastics themselves have high physical stability, that is, they have low affinity with other substances, so they have good adhesion to metals such as the lead piece 3. is significantly inferior to thermosetting synthetic resins, but when used in packages, compared to thermosetting synthetic resins,
Productivity is 5-8 times higher, material cost is 20-30% higher,
It's extremely good.

(Problems to be Solved by the Invention) In the structure of conventional airtight hollow electronic components such as surface acoustic wave devices, thermosetting synthetic materials that have relatively high adhesion to metals such as the lead piece 3 are used. Even if resin is used for the package, complete adhesion cannot be achieved, and only a low level of airtightness can be achieved.Despite this, thermosetting synthetic resin must be used for the package. This was disadvantageous in terms of productivity and material costs.

The present invention has been made in view of the above points, and particularly relates to the structure of airtight hollow electronic components such as surface acoustic wave devices.
The purpose of this project is to improve the structure of the package and manufacture airtight hollow electronic components with high airtightness using a package made of thermoplastic synthetic resin that is superior in terms of productivity and material cost.

[Structure of the invention]

(Means for Solving the Problems) The airtight hollow electronic component of the present invention has a cylindrical cap body 15 having an opening 16 at at least one end, and a space between the cap body 15 that is mounted inside the cap body 15, and the airtight hollow electronic component of the present invention. A case body 11 having a hollow portion 18 formed therein; an electronic component element 6 disposed in the hollow portion 18 and provided in the case body 11; and an end portion of the case body 11 connected to the electronic component element 6. a lead body 3 that penetrates through the opening 16 of the cap body 15 and protrudes from the opening 16 of the cap body 15; and an adhesive 1 filled inside the opening 16 of the cap body 15 to cover the end of the case body 11.
9.

(Function) The airtight hollow electronic component of the present invention airtightly seals the cap body 15 and the case body 11 with the adhesive 19, and also ensures the airtightness of the interface between the case body 11 and the lead body 3. be.

(Example) An example of the airtight hollow electronic component of the present invention will be described with reference to FIGS. 1 and 2.

This embodiment is an example of a surface acoustic wave device similar to the conventional example explained in FIGS. 3 to 6, and the same parts are given the same reference numerals.

1 and 2, 11 is a case body, and this case body 11 has a concave shape with wall parts 13 integrally molded on both ends of a base plate part 12, and is made of thermoplastic synthetic resin such as engineering plastic. Lead piece 3 as a metal plate-shaped lead body
The inner end portions of the plurality of lead pieces 3 and the inner side of one of the plurality of lead pieces 3 are integrally formed by insert molding, and the inner end portions of the plurality of lead pieces 3 and the inner side of one of the plurality of lead pieces 3 are formed on the concave surface of the case body 11, that is, the upper surface of the substrate portion 12. Attachment part 5 integrally formed at the end
are exposed, and the outer ends of the plurality of lead pieces 3 penetrate both ends of the case body 4 and protrude to the outside.

Note that, as described in FIG. 3, the plurality of lead pieces 3 are integrally formed as the lead frame 2 by the connecting portion 1, and are individually separated by cutting the connecting portion 1.

A surface acoustic wave element 6 (hereinafter simply referred to as element 6) as an electronic component element is mounted on the mounting portion 5 of the lead piece 3, and this element 6 and the inner ends of the plurality of lead pieces 3 are connected to each other. It is electrically connected with a metal wire 7.

Reference numeral 15 designates a cap body for the case body 4, and this cap body 14 has a thin rectangular cylindrical shape with openings 16 at both ends, and is made of thermoplastic synthetic resin such as engineering plastic. An edge 17 is formed at the end of the case body 11.

Then, the concave case body 11 is mounted inside this thin rectangular cylindrical cap body 15, thereby forming a hollow portion 18 between the case body 11 and the cap body 15 with respect to the surface of the element 6. The outer ends of the plurality of lead pieces 3 protrude outside from openings 16 at both ends of the cap body 15.

Then, an adhesive 19 is filled inside the openings 16 at both ends of the cap body 15 so as to cover the ends of the case body 11.
5 and the case body 11 are adhesively sealed in an airtight manner, and the interface between the case body 11 and the plurality of lead pieces 3 is ensured to be airtight, thereby ensuring high airtightness in the hollow portion 18.

〔Effect of the invention〕

As described above, according to the present invention, the structure of an airtight hollow electronic component such as a surface acoustic wave device, in particular, the structure of its package is improved, and the cap body and case body constituting the package are bonded in an airtight manner. Since the sealing adhesive ensures airtightness at the interface between the case body and the lead body, high airtightness can be ensured in the hollow part, and therefore,
Thermoplastic synthetic resin, which is excellent in productivity and material cost, can be used for the cap body and case body that constitute the package.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a surface acoustic wave device showing an embodiment of the airtight hollow electronic component of the present invention, FIG. 2 is a perspective view of the assembled state, and FIG. 3 is a cross-sectional view of a conventional surface acoustic wave device. 4 is a sectional view thereof, FIG. 5 is a sectional view of the assembled state, and FIG. 6 is an explanatory diagram of the problem. 3. Lead piece as lead body, 6. Surface acoustic wave element as electronic component element, 11. Case body, 15.
Cap body, 16φ/opening, 18 fist/hollow part, 19/
·glue. 4i place 1

Claims (1)

[Claims] (1) A cylindrical cap body having an opening at at least one end, a case body installed inside the cap body and forming a hollow part between the cap body, and a case body disposed in the hollow part. an electronic component element provided in the electronic component element; a lead body connected to the electronic component element and extending through the end of the case body and protruding from the opening of the cap body; 1. An airtight hollow electronic component, comprising an adhesive filled to cover an end of a case body.