JPH03228351A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH03228351A
JPH03228351A JP2024606A JP2460690A JPH03228351A JP H03228351 A JPH03228351 A JP H03228351A JP 2024606 A JP2024606 A JP 2024606A JP 2460690 A JP2460690 A JP 2460690A JP H03228351 A JPH03228351 A JP H03228351A
Authority
JP
Japan
Prior art keywords
signal
switch
input terminal
supply
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024606A
Other languages
Japanese (ja)
Inventor
Yoshio Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2024606A priority Critical patent/JPH03228351A/en
Publication of JPH03228351A publication Critical patent/JPH03228351A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

PURPOSE: To improve the characteristics and to increase the productivity by designing in many and various specifications into one chip without increasing an internal capacity by providing a switch circuit which switches a connecting condition by a switch signal at supply level between the plural number of connecting sections and an internal circuit, locating input terminals of the switch signal close to the supply terminals.
CONSTITUTION: In a semiconductor device having the plural number of connecting sections 11, 12 which bring the device into connection with the external units, a switch circuit is provided between the connecting sections 11, 12 and an internal circuit to switch a connecting condition by a switch signal at supply level. Input terminals 13a, 13b of the said switch signal are located close to the supply terminals 5, 6. For example, in the case that the input terminal 13a is connected to the supply terminal 5, a signal from the signal input terminal 11 is transmitted to the inside with a pull- down transistor turned ON, a pull-down transistor 14 OFF, a transmittion gate 16 of a switch circuit block 20 ON and a transmittion gate 17 OFF. In the case that the input terminal 13b is connected to a GDN terminal 6, a signal from the external signal input terminal 12 is transmitted to the inside as reversely to the case mentioned above.
COPYRIGHT: (C)1991,JPO&Japio
JP2024606A 1990-02-02 1990-02-02 Semiconductor device Pending JPH03228351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024606A JPH03228351A (en) 1990-02-02 1990-02-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024606A JPH03228351A (en) 1990-02-02 1990-02-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH03228351A true JPH03228351A (en) 1991-10-09

Family

ID=12142811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024606A Pending JPH03228351A (en) 1990-02-02 1990-02-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH03228351A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009193658A (en) * 2008-02-14 2009-08-27 Hynix Semiconductor Inc Input circuit of semiconductor memory apparatus and controlling method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01280923A (en) * 1988-05-07 1989-11-13 Mitsubishi Electric Corp Semiconductor integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01280923A (en) * 1988-05-07 1989-11-13 Mitsubishi Electric Corp Semiconductor integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009193658A (en) * 2008-02-14 2009-08-27 Hynix Semiconductor Inc Input circuit of semiconductor memory apparatus and controlling method thereof
US8477557B2 (en) 2008-02-14 2013-07-02 SK Hynix Inc. Input circuit of semiconductor memory apparatus and controlling method thereof

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