JPH0320471B2 - - Google Patents
Info
- Publication number
- JPH0320471B2 JPH0320471B2 JP60239150A JP23915085A JPH0320471B2 JP H0320471 B2 JPH0320471 B2 JP H0320471B2 JP 60239150 A JP60239150 A JP 60239150A JP 23915085 A JP23915085 A JP 23915085A JP H0320471 B2 JPH0320471 B2 JP H0320471B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60239150A JPH0320471B2 (ja) | 1985-10-25 | 1985-10-25 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60239150A JPH0320471B2 (ja) | 1985-10-25 | 1985-10-25 | |
EP86308308A EP0225041B1 (en) | 1985-10-25 | 1986-10-24 | Electroless gold plating solution |
DE8686308308T DE3668011D1 (de) | 1985-10-25 | 1986-10-24 | POWERFUL GOLD PLATING SOLUTION. |
US06/923,135 US4792469A (en) | 1985-10-25 | 1986-10-24 | Electroless gold plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6299477A JPS6299477A (en) | 1987-05-08 |
JPH0320471B2 true JPH0320471B2 (ja) | 1991-03-19 |
Family
ID=17040493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60239150A Expired - Lifetime JPH0320471B2 (ja) | 1985-10-25 | 1985-10-25 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4792469A (ja) |
EP (1) | EP0225041B1 (ja) |
JP (1) | JPH0320471B2 (ja) |
DE (1) | DE3668011D1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4021681C2 (ja) * | 1989-07-12 | 1991-12-05 | Kojima Chemicals Co. Ltd., Tokio/Tokyo, Jp | |
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
JP2538461B2 (ja) * | 1991-02-22 | 1996-09-25 | 奥野製薬工業株式会社 | 無電解金めっき方法 |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
JP3302512B2 (ja) * | 1994-08-19 | 2002-07-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3331260B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3331261B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
US5750018A (en) * | 1997-03-18 | 1998-05-12 | Learonal, Inc. | Cyanide-free monovalent copper electroplating solutions |
DE19745797C2 (de) * | 1997-10-16 | 2001-11-08 | Bosch Gmbh Robert | Lösung und Verfahren zum stromlosen Vergolden |
JP3466521B2 (ja) * | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | 置換型無電解金めっき液及び無電解金めっき方法 |
JP4649666B2 (ja) * | 2006-07-11 | 2011-03-16 | 独立行政法人産業技術総合研究所 | Electroless gold plating solution |
JP5526459B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP5526458B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124428A (en) * | 1976-04-13 | 1977-10-19 | Hideji Sasaki | Nonnelectrolytic gold plating bath |
JPS59229478A (en) * | 1983-06-09 | 1984-12-22 | Noritoshi Honma | Stabilizer for electroless gold plating liquid |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE361056B (ja) * | 1969-10-30 | 1973-10-15 | Western Electric Co | |
GB1547028A (en) * | 1976-11-19 | 1979-06-06 | Mine Safety Appliances Co | Electroless gold plating baths |
FR2441666B1 (ja) * | 1978-11-16 | 1981-05-08 | Prost Tournier Patrick | |
US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
SE8302798L (sv) * | 1982-06-07 | 1983-12-08 | Occidental Chem Co | WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH |
-
1985
- 1985-10-25 JP JP60239150A patent/JPH0320471B2/ja not_active Expired - Lifetime
-
1986
- 1986-10-24 EP EP86308308A patent/EP0225041B1/en not_active Expired - Lifetime
- 1986-10-24 US US06/923,135 patent/US4792469A/en not_active Expired - Lifetime
- 1986-10-24 DE DE8686308308T patent/DE3668011D1/de not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124428A (en) * | 1976-04-13 | 1977-10-19 | Hideji Sasaki | Nonnelectrolytic gold plating bath |
JPS59229478A (en) * | 1983-06-09 | 1984-12-22 | Noritoshi Honma | Stabilizer for electroless gold plating liquid |
Also Published As
Publication number | Publication date |
---|---|
US4792469A (en) | 1988-12-20 |
JPS6299477A (en) | 1987-05-08 |
DE3668011D1 (de) | 1990-02-08 |
EP0225041A1 (en) | 1987-06-10 |
EP0225041B1 (en) | 1990-01-03 |