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JPH03185807A - Semiconductor manufacturing device and demagnification projection aligner - Google Patents

Semiconductor manufacturing device and demagnification projection aligner

Info

Publication number
JPH03185807A
JPH03185807A JP32396989A JP32396989A JPH03185807A JP H03185807 A JPH03185807 A JP H03185807A JP 32396989 A JP32396989 A JP 32396989A JP 32396989 A JP32396989 A JP 32396989A JP H03185807 A JPH03185807 A JP H03185807A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
mark
equipment
performed
reticle
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP32396989A
Other versions
JPH0666244B2 (en )
Inventor
Hiroshi Tanaka
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To detect offset values with high speed and high precision, by connecting and controlling, on line, a wafer conveying means and each equipment, printing and developing, on a wafer, a deviation measuring mark on a reticle and a calibration mark simultaneously, together with a pattern on the reticle at the time of exposure, and calculating alignment precision and offset amount by measuring both of the marks.
CONSTITUTION: Inspection is automatically performed while a wafer WF to be inspected is moved by the command of a control equipment, and each equipment and a stepper control equipment CD are connected by using a communication cable. Alignment is performed by using a set mark formed on the upper surface of a reticle RT lens LN disposed above a demagnification projection lens LN and an alignment mark of the reticle. By opening a shutter SHT for exposure, resist of the wafer WF is overlapped on a reticle side deviation amount measuring mark and a wafer side mark, and exposure is performed. After stage movement, alignment, and exposure are repeated and finished, development is performed by using developing equipment DE. Measurement of the deviation amount measuring mark is performed in the inspection process, measured values are stored in the controle equipment CD, and autoalignment precision and offset are calculated and output.
COPYRIGHT: (C)1991,JPO&Japio
JP32396989A 1989-12-15 1989-12-15 Semiconductor manufacturing method Expired - Lifetime JPH0666244B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32396989A JPH0666244B2 (en) 1989-12-15 1989-12-15 Semiconductor manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32396989A JPH0666244B2 (en) 1989-12-15 1989-12-15 Semiconductor manufacturing method
US07987247 US5249016A (en) 1989-12-15 1992-12-07 Semiconductor device manufacturing system

Publications (2)

Publication Number Publication Date
JPH03185807A true true JPH03185807A (en) 1991-08-13
JPH0666244B2 JPH0666244B2 (en) 1994-08-24

Family

ID=18160657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32396989A Expired - Lifetime JPH0666244B2 (en) 1989-12-15 1989-12-15 Semiconductor manufacturing method

Country Status (1)

Country Link
JP (1) JPH0666244B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194914A (en) * 1989-12-22 1991-08-26 Hitachi Ltd Method and apparatus for monitoring aligning accuracy of stepper
JPH05129178A (en) * 1991-10-31 1993-05-25 Toshiba Corp Method for measuring misalignment
US6721939B2 (en) * 2002-02-19 2004-04-13 Taiwan Semiconductor Manufacturing Co., Ltd Electron beam shot linearity monitoring
US7373213B2 (en) 2002-04-30 2008-05-13 Canon Kabushiki Kaisha Management system and apparatus, method therefor, and device manufacturing method
US7385700B2 (en) 2002-04-30 2008-06-10 Canon Kabushiki Kaisha Management system, apparatus, and method, exposure apparatus, and control method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913324A (en) * 1982-07-15 1984-01-24 Hitachi Ltd Scale-down projection exposure apparatus
JPS60256002A (en) * 1984-06-01 1985-12-17 Nippon Kogaku Kk <Nikon> Position detecting apparatus
JPS6232614A (en) * 1985-08-03 1987-02-12 Nippon Kogaku Kk <Nikon> Exposure device having self-checking function
JPH01179317A (en) * 1988-01-05 1989-07-17 Nikon Corp Substrate treatment system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913324A (en) * 1982-07-15 1984-01-24 Hitachi Ltd Scale-down projection exposure apparatus
JPS60256002A (en) * 1984-06-01 1985-12-17 Nippon Kogaku Kk <Nikon> Position detecting apparatus
JPS6232614A (en) * 1985-08-03 1987-02-12 Nippon Kogaku Kk <Nikon> Exposure device having self-checking function
JPH01179317A (en) * 1988-01-05 1989-07-17 Nikon Corp Substrate treatment system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194914A (en) * 1989-12-22 1991-08-26 Hitachi Ltd Method and apparatus for monitoring aligning accuracy of stepper
JPH05129178A (en) * 1991-10-31 1993-05-25 Toshiba Corp Method for measuring misalignment
US6721939B2 (en) * 2002-02-19 2004-04-13 Taiwan Semiconductor Manufacturing Co., Ltd Electron beam shot linearity monitoring
US7373213B2 (en) 2002-04-30 2008-05-13 Canon Kabushiki Kaisha Management system and apparatus, method therefor, and device manufacturing method
US7385700B2 (en) 2002-04-30 2008-06-10 Canon Kabushiki Kaisha Management system, apparatus, and method, exposure apparatus, and control method therefor

Also Published As

Publication number Publication date Type
JPH0666244B2 (en) 1994-08-24 grant

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