JPH03178146A - Inspecting equipment for wire bonding state - Google Patents

Inspecting equipment for wire bonding state

Info

Publication number
JPH03178146A
JPH03178146A JP1316997A JP31699789A JPH03178146A JP H03178146 A JPH03178146 A JP H03178146A JP 1316997 A JP1316997 A JP 1316997A JP 31699789 A JP31699789 A JP 31699789A JP H03178146 A JPH03178146 A JP H03178146A
Authority
JP
Japan
Prior art keywords
distance
center
image
ball
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1316997A
Other languages
Japanese (ja)
Other versions
JP2843388B2 (en
Inventor
Hiroyuki Tsukahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1316997A priority Critical patent/JP2843388B2/en
Publication of JPH03178146A publication Critical patent/JPH03178146A/en
Application granted granted Critical
Publication of JP2843388B2 publication Critical patent/JP2843388B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE: To improve the inspection precision of bonding state by distance- transforming a binary-valued monochromatic image of an inspection region, searching each pixel value of the above obtained image, from the direction opposite to a wire, setting the center of pixel position of the firstly detected maximum value as the center position of a bonding ball, and detecting the minimum radius of the image subjected to distance transformation.
CONSTITUTION: A monochromatic image obtained by a threshold value calculating means 13 is subjected to distance transformation by a distance-transforming means 14. Out of the values of the pixels of the monochromatic image subjected to distance transformation, the maximum value is detected from the direction opposite to a wire 4 by using a center detecting means 15. The center of the pixel position of the firstly detected maximum value is set as the center position of the bonding ball 5. By a shape inspecting means 16, the distance between the above center position and the pixel position of a specified value out of each pixel of the image subjected to distance transformation is calculated, and the shape of the bonding ball 5 is inspected. Thereby the ball shape can be inspected without the influence of wire image and ball shape, and the state of the bonding ball 5 can be inspected with high precision.
COPYRIGHT: (C)1991,JPO&Japio
JP1316997A 1989-12-06 1989-12-06 Wire bonding condition inspection device Expired - Fee Related JP2843388B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1316997A JP2843388B2 (en) 1989-12-06 1989-12-06 Wire bonding condition inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1316997A JP2843388B2 (en) 1989-12-06 1989-12-06 Wire bonding condition inspection device

Publications (2)

Publication Number Publication Date
JPH03178146A true JPH03178146A (en) 1991-08-02
JP2843388B2 JP2843388B2 (en) 1999-01-06

Family

ID=18083265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1316997A Expired - Fee Related JP2843388B2 (en) 1989-12-06 1989-12-06 Wire bonding condition inspection device

Country Status (1)

Country Link
JP (1) JP2843388B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312317A (en) * 1996-05-23 1997-12-02 Nec Corp Flip chip junction inspection method and device
WO2010013564A1 (en) * 2008-07-28 2010-02-04 株式会社 日立ハイテクノロジーズ Defect review device, defect review method, and defect review execution program

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312317A (en) * 1996-05-23 1997-12-02 Nec Corp Flip chip junction inspection method and device
WO2010013564A1 (en) * 2008-07-28 2010-02-04 株式会社 日立ハイテクノロジーズ Defect review device, defect review method, and defect review execution program
JP2010032308A (en) * 2008-07-28 2010-02-12 Hitachi High-Technologies Corp Defect review device, defect review method, and defect review execution program

Also Published As

Publication number Publication date
JP2843388B2 (en) 1999-01-06

Similar Documents

Publication Publication Date Title
JPS5385454A (en) Distance detecting method
JPH0244202A (en) Apparatus for detecting end position of object
JPH03178146A (en) Inspecting equipment for wire bonding state
JPH03138775A (en) Crack measuring system
JPH04120456A (en) Nondestructive inspecting apparatus by skid
JPH04359122A (en) Measurement precision inspection method for electrostatic capacity type liquid level meter
JPH0254544A (en) Brobing
JPH0315707A (en) Lead inspection method and lead measuring instrument and lead inspection device used for the method
JPH04269614A (en) Pattern-position detecting method and executing apparatus thereof
JPH02280035A (en) Method for inspecting electrode pattern by processing image
JPH03100882A (en) Defect inspecting method by appearance inspection
JPH03154807A (en) Pattern inspecting method
JPH04147002A (en) Inspecting apparatus of surface of fruit and vegetable
JPS5551308A (en) Area measuring device for pattern inside loop region
JPH0381878A (en) Distance measuring image recognizing device using stereoscope image
JPH03123982A (en) Detection method for fruit and the like
JPH02236406A (en) Method for inspecting mask pattern
JPH02258345A (en) Decoloration tester for printed matter
JPH0414184A (en) Parts inspection method
JPH03178145A (en) Inspecting equipment for bonding ball
JPS5551307A (en) Pattern area measuring device
JPH02287257A (en) Method for measuring human g-cf
JPH03186711A (en) Microdimension length measuring device
JPS5398871A (en) Shape inspecting apparatus
JPH04278445A (en) Soldering inspection apparatus

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees