JPH0317622B2 - - Google Patents

Info

Publication number
JPH0317622B2
JPH0317622B2 JP61205759A JP20575986A JPH0317622B2 JP H0317622 B2 JPH0317622 B2 JP H0317622B2 JP 61205759 A JP61205759 A JP 61205759A JP 20575986 A JP20575986 A JP 20575986A JP H0317622 B2 JPH0317622 B2 JP H0317622B2
Authority
JP
Japan
Prior art keywords
plate
polishing
polished
parallelism
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61205759A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362668A (ja
Inventor
Koichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP61205759A priority Critical patent/JPS6362668A/ja
Publication of JPS6362668A publication Critical patent/JPS6362668A/ja
Publication of JPH0317622B2 publication Critical patent/JPH0317622B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP61205759A 1986-09-03 1986-09-03 研摩装置 Granted JPS6362668A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61205759A JPS6362668A (ja) 1986-09-03 1986-09-03 研摩装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61205759A JPS6362668A (ja) 1986-09-03 1986-09-03 研摩装置

Publications (2)

Publication Number Publication Date
JPS6362668A JPS6362668A (ja) 1988-03-18
JPH0317622B2 true JPH0317622B2 (en, 2012) 1991-03-08

Family

ID=16512193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61205759A Granted JPS6362668A (ja) 1986-09-03 1986-09-03 研摩装置

Country Status (1)

Country Link
JP (1) JPS6362668A (en, 2012)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220606B1 (en) 1991-11-26 2001-04-24 Nippon Gasket Co., Ltd. Metallic gasket
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP3489755B2 (ja) * 1994-08-05 2004-01-26 日本ガスケット株式会社 金属製ガスケット
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JP3230959B2 (ja) * 1995-09-05 2001-11-19 日本ガスケット株式会社 金属ガスケット
JP3230966B2 (ja) * 1995-10-09 2001-11-19 日本ガスケット株式会社 金属製ガスケット
US5791978A (en) * 1996-11-14 1998-08-11 Speedfam Corporation Bearing assembly for wafer planarization carrier
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6116990A (en) * 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
US7156946B2 (en) 2003-04-28 2007-01-02 Strasbaugh Wafer carrier pivot mechanism
CN114770339B (zh) * 2022-06-15 2022-09-06 沃中孚精密主轴昆山有限公司 一种用于镜面抛光的浮动动力抛光头及抛光方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571653A (en) * 1980-05-29 1982-01-06 Shibayama Kikai Kk Parallel stabilizer of surface lapping machine or polishing machine

Also Published As

Publication number Publication date
JPS6362668A (ja) 1988-03-18

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