JPH0316785B2 - - Google Patents

Info

Publication number
JPH0316785B2
JPH0316785B2 JP19442881A JP19442881A JPH0316785B2 JP H0316785 B2 JPH0316785 B2 JP H0316785B2 JP 19442881 A JP19442881 A JP 19442881A JP 19442881 A JP19442881 A JP 19442881A JP H0316785 B2 JPH0316785 B2 JP H0316785B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19442881A
Other versions
JPS5896756A (en
Inventor
Yoshitaka Fukuoka
Original Assignee
Tokyo Shibaura Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co filed Critical Tokyo Shibaura Electric Co
Priority to JP19442881A priority Critical patent/JPH0316785B2/ja
Publication of JPS5896756A publication Critical patent/JPS5896756A/ja
Publication of JPH0316785B2 publication Critical patent/JPH0316785B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047Details of electrical connections between containers
    • H01L2225/1058Bump or bump-like electrical connections, e.g. balls, pillars, posts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP19442881A 1981-12-04 1981-12-04 Expired - Lifetime JPH0316785B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19442881A JPH0316785B2 (ja) 1981-12-04 1981-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19442881A JPH0316785B2 (ja) 1981-12-04 1981-12-04

Publications (2)

Publication Number Publication Date
JPS5896756A JPS5896756A (en) 1983-06-08
JPH0316785B2 true JPH0316785B2 (ja) 1991-03-06

Family

ID=16324430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19442881A Expired - Lifetime JPH0316785B2 (ja) 1981-12-04 1981-12-04

Country Status (1)

Country Link
JP (1) JPH0316785B2 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208851A (en) * 1984-03-31 1985-10-21 Toshiba Corp Multiple-chip type memory circuit device
JPS60187543U (ja) * 1984-05-21 1985-12-12
JPS63299256A (en) * 1987-05-29 1988-12-06 Toshiba Corp Electric component
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5804870A (en) * 1992-06-26 1998-09-08 Staktek Corporation Hermetically sealed integrated circuit lead-on package configuration
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5541812A (en) * 1995-05-22 1996-07-30 Burns; Carmen D. Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method

Also Published As

Publication number Publication date
JPS5896756A (en) 1983-06-08

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