JPH03166247A - Vibration damping composition - Google Patents
Vibration damping compositionInfo
- Publication number
- JPH03166247A JPH03166247A JP30424089A JP30424089A JPH03166247A JP H03166247 A JPH03166247 A JP H03166247A JP 30424089 A JP30424089 A JP 30424089A JP 30424089 A JP30424089 A JP 30424089A JP H03166247 A JPH03166247 A JP H03166247A
- Authority
- JP
- Japan
- Prior art keywords
- vibration damping
- molecular weight
- isoprene
- block
- block copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000013016 damping Methods 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920001400 block copolymer Polymers 0.000 claims abstract description 29
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- VLLYOYVKQDKAHN-UHFFFAOYSA-N buta-1,3-diene;2-methylbuta-1,3-diene Chemical compound C=CC=C.CC(=C)C=C VLLYOYVKQDKAHN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000178 monomer Substances 0.000 claims abstract description 10
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 4
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- -1 vinyl aromatic compound Chemical class 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 238000005984 hydrogenation reaction Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000002879 Lewis base Substances 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000007527 lewis bases Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- APQIUTYORBAGEZ-UHFFFAOYSA-N 1,1-dibromoethane Chemical compound CC(Br)Br APQIUTYORBAGEZ-UHFFFAOYSA-N 0.000 description 1
- WQONPSCCEXUXTQ-UHFFFAOYSA-N 1,2-dibromobenzene Chemical compound BrC1=CC=CC=C1Br WQONPSCCEXUXTQ-UHFFFAOYSA-N 0.000 description 1
- VDNSZPNSUQRUMS-UHFFFAOYSA-N 1-cyclohexyl-4-ethenylbenzene Chemical compound C1=CC(C=C)=CC=C1C1CCCCC1 VDNSZPNSUQRUMS-UHFFFAOYSA-N 0.000 description 1
- WJNKJKGZKFOLOJ-UHFFFAOYSA-N 1-dodecyl-4-ethenylbenzene Chemical compound CCCCCCCCCCCCC1=CC=C(C=C)C=C1 WJNKJKGZKFOLOJ-UHFFFAOYSA-N 0.000 description 1
- JHTICDZLXFNVKL-UHFFFAOYSA-N 1-ethenyl-4-(4-phenylbutyl)benzene Chemical compound C1=CC(C=C)=CC=C1CCCCC1=CC=CC=C1 JHTICDZLXFNVKL-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 241000206761 Bacillariophyta Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000007868 Raney catalyst Substances 0.000 description 1
- 229910000564 Raney nickel Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000010533 azeotropic distillation Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- SMBQBQBNOXIFSF-UHFFFAOYSA-N dilithium Chemical class [Li][Li] SMBQBQBNOXIFSF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- BLHLJVCOVBYQQS-UHFFFAOYSA-N ethyllithium Chemical compound [Li]CC BLHLJVCOVBYQQS-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- VGMQZCPHUDXGFR-UHFFFAOYSA-N lithium;naphthalene Chemical compound [Li].[Li].C1=CC=CC2=CC=CC=C21 VGMQZCPHUDXGFR-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000006886 vinylation reaction Methods 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Vibration Dampers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、広い温度範囲で優れた制振性能を示す、熱可
塑性の制振性組或物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a thermoplastic damping composition that exhibits excellent damping performance over a wide temperature range.
近年、自動車等交通機関の発達に伴い、これに起因する
騒音、振動が大きな社会問題となってきた。また自動車
内部にも、低振動、低騒音性という高度な要求が求めら
れるに至っている。また、一般家庭でも複写機、プリン
ター等の事務機器が広く使用されるようになり、これら
の機器の発生する騒音、振動の低減が重要な課題となっ
ている。In recent years, with the development of transportation such as automobiles, noise and vibration caused by this have become a major social problem. Furthermore, high-level requirements such as low vibration and low noise are now required inside automobiles. Furthermore, office equipment such as copying machines and printers has come to be widely used in general households, and reducing the noise and vibration generated by these equipment has become an important issue.
さらにまた、生活様式の変化から、家庭用電気製品は大
型化しており、冷蔵庫、洗濯機、掃除機等の振動を伴う
機器の低振動、低騒音化による静粛性も商品としての重
要な性能の一つとなっている.従来、この振動、騒音を
低減するために、様々なバネ類、防振ゴム等が使用され
てきたが、上述の様々な要求には対応し切れなくなった
きた。この方法は、振動の伝達を遮断することにより振
動、騒音の発生を低下させるというものであるが、これ
とは別に、振動そのものを抑えるという、いわゆる制振
という方法が広まってきた。これら各種粘弾性体を振動
するものに貼付ける、成るいは挟み込むことにより振動
の発生を抑えるという方法である.この目的で使用され
る制振材としては、これまでポリエステル系(特開昭6
2 − 295949号公報)、ポリアミド系(特開昭
56−159160号公報)、エポキシ樹脂系(特公昭
58 − 23426号公報)等多数の例が提唱されて
いる.
しかしながらこれらのものは、有機溶剤の溶液で使用す
る、流動性の配合物を注形により戒型する、戒型物を接
着剤を使用して接着する等、戒型、施工時に煩雑な操作
を必要とすると同時に、安全衛生上にも問題となる場合
があった.また、得られる制振材は、使用される場合に
対象となる機材との接着性が良く、かつ、張り合わせた
後に或型する場合には十分な戒型性を有するために十分
な弾性を示す必要もある.十分な制振性能を有し、かつ
、施工時の加工性、張り合わせた後の戒型性等、すべて
を満足する材料は得られていないのが現状である.
本発明者らは、上述の要求を満たす材料について鋭意検
討の結果、一定のξクロ構造を有するジエン系モノマー
からなるブロックと、芳香族ビニル系モノマーからなる
ブロックとからなるブロック共重合体が、前記特性を具
備した優れた制振材用の材料であることを見出した(特
願昭63−254657号)。Furthermore, due to changes in lifestyles, household electrical appliances are becoming larger, and quietness through low vibration and noise reduction of vibrating equipment such as refrigerators, washing machines, and vacuum cleaners is an important performance factor for products. It has become one. Conventionally, various springs, anti-vibration rubber, etc. have been used to reduce this vibration and noise, but these have become unable to meet the various demands described above. This method reduces the generation of vibrations and noise by blocking the transmission of vibrations, but a separate method called vibration damping, which suppresses vibration itself, has become widespread. This is a method of suppressing vibration by attaching or sandwiching these various viscoelastic materials to a vibrating object. Until now, the damping materials used for this purpose have been polyester-based (Japanese Patent Laid-Open No. 6
A large number of examples have been proposed, including polyamide systems (Japanese Patent Publication No. 56-159160), epoxy resin systems (Japanese Patent Publication No. 58-23426), etc. However, these methods require complicated operations during molding and construction, such as using an organic solvent solution, molding a fluid compound by casting, or gluing molded objects with adhesive. While this was necessary, there were also cases in which it became a health and safety issue. In addition, the obtained damping material has good adhesion to the target equipment when used, and exhibits sufficient elasticity to have sufficient shapeability when molded after lamination. There is also a need. Currently, there is no material that has sufficient vibration damping performance and satisfies all of the requirements, including workability during construction and formability after lamination. As a result of intensive studies on materials that meet the above-mentioned requirements, the present inventors found that a block copolymer consisting of a block consisting of a diene monomer having a certain ξ-chloro structure and a block consisting of an aromatic vinyl monomer, It has been found that this material has the above characteristics and is an excellent material for vibration damping materials (Japanese Patent Application No. 63-254657).
しかしながら、かかるブロック共重合体が制振性能を示
す温度範囲は比較的狭いものであり、実際に使用する際
に周囲の温度の変化により十分な制振性能を示さない場
合がある。However, the temperature range in which such a block copolymer exhibits vibration damping performance is relatively narrow, and when it is actually used, it may not exhibit sufficient vibration damping performance due to changes in ambient temperature.
本発明者は、広い温度範囲で十分な制振性能を発揮し得
る制振性材料を目指しさらに検討を進めた結果本発明に
至った。The present inventor has conducted further studies aimed at creating a vibration damping material that can exhibit sufficient vibration damping performance over a wide temperature range, and as a result has arrived at the present invention.
本発明によれば上記課題は、数平均分子量が2500〜
40000のビニル芳香族モノマーから成るブロック(
A)と、イソプレンまたはイソプレンーブタジエン混合
物から戒り、数平均分子量が10000〜200000
で、3.4結合及び1.2結合含有量が40%以上であ
り、O′C以上にjanδΦ主分散のビークを有するブ
ロック、またはその鎖中の炭素一炭素二重結合の少なく
とも一部が水添されたブロック(B)より構成され、ブ
ロックの結合の形態が、A−(B−A)n 、又は(A
−B)n (nは1以上の整数)で表される、分子量が
30000〜300000であるブロック共重合体、お
よびイソブチレン系重合体からなる組戒物により解決さ
れる.
本発明に使用されるブロック共重合体はビニル芳香族ブ
ロック(A)が疑似架橋点を形威するため架橋反応する
こと無く十分な強度的性質を示し、イソブレンまたはイ
ソプレンーブタジエン混合物から成るブロック(B)が
弾性に優れることから、張り合わせた後に戒型する場合
にも十分な威型性を有する.また、本ブロック共重合体
は、熱可塑性を有しホシトメルトによる威型加工が可能
であり或型加工が極めて容易である。According to the present invention, the above problem is solved when the number average molecular weight is 2500 to
A block of 40,000 vinyl aromatic monomers (
A) and isoprene or isoprene-butadiene mixtures with a number average molecular weight of 10,000 to 200,000.
and the content of 3.4 bonds and 1.2 bonds is 40% or more, and the block has a peak of janδΦ main dispersion above O'C, or at least a part of the carbon-carbon double bonds in the chain is It is composed of hydrogenated block (B), and the bonding form of the block is A-(B-A)n or (A
-B) Solved by a combination consisting of a block copolymer represented by n (n is an integer of 1 or more) and having a molecular weight of 30,000 to 300,000, and an isobutylene polymer. The block copolymer used in the present invention exhibits sufficient strength without undergoing a crosslinking reaction because the vinyl aromatic block (A) forms pseudo-crosslinking points, and the block copolymer consisting of isobrene or an isoprene-butadiene mixture ( Since B) has excellent elasticity, it has sufficient strength even when it is molded after being pasted together. In addition, this block copolymer has thermoplasticity and can be molded using photomelt, making molding extremely easy.
また、イソブチレン系重合体を組み合わせることにまり
制振性を示す温度範囲を十分に広くすることが可能にな
りその応用範囲が一段と広くなる。Furthermore, by combining isobutylene polymers, it becomes possible to sufficiently widen the temperature range in which vibration damping properties are exhibited, further widening the range of applications.
以下に本発明をさらに詳しく説明する.本発明において
用いられるブロック共重合体の第一成分としては、ビニ
ル芳香族モノマー、例えばスチレン、α−メチルスチレ
ン、1−ビニルナフタレン、2−ビニルナフタレン、3
−メチルスチレン、4−プロビルスチレン、4−シクロ
ヘキシルスチレン、4−ドデシルスチレン、2−エチル
−4−ペンジルスチレン、4−(フエニルブチル)スチ
レン等があるが、最も好ましいのはスチレンである。The present invention will be explained in more detail below. The first component of the block copolymer used in the present invention includes vinyl aromatic monomers such as styrene, α-methylstyrene, 1-vinylnaphthalene, 2-vinylnaphthalene,
Examples include -methylstyrene, 4-probylstyrene, 4-cyclohexylstyrene, 4-dodecylstyrene, 2-ethyl-4-pendylstyrene, 4-(phenylbutyl)styrene, and the most preferred is styrene.
また、本発明において用いられるブロック共重合体の第
二威分としてはイソプレン、またはイソプレンとブタジ
エンを併用するのが適している。Further, as the second component of the block copolymer used in the present invention, it is suitable to use isoprene or a combination of isoprene and butadiene.
これ以外のモノマーを使用した場合、例えば、ブタジエ
ン単独の場合、3,4結合及び1,2結合含有量は増や
しても制振性能を発現する温度はO″C未満であり、実
際に使用される温度での機能は得られず、実用上の意義
は少ない。イソプレンの場合、本発明の3,4結合及び
1,2結合含有量とすることにより、概ね0℃から50
゜C前後までの実用的な温度範囲で制振性能を発揮する
ことができ、広い用途に対応することが可能になり、実
用上極めて有意義である。イソプレンーブタジエンを併
用する場合、イソブレンの割合が40%以上であれば0
゜C以上で制振性能を発揮する。併用する場合のブロッ
ク(B)の形態としてはランダム、ブロック、テーパー
ドのいずれでも良い。When other monomers are used, for example, butadiene alone, even if the 3,4 bond and 1,2 bond contents are increased, the temperature at which vibration damping performance is exhibited is below O''C, so it is not actually used. It cannot function at temperatures as high as
It can exhibit vibration damping performance in a practical temperature range up to around 100°C, and can be used in a wide range of applications, making it extremely meaningful from a practical standpoint. When using isoprene-butadiene together, if the proportion of isoprene is 40% or more, 0
Demonstrates vibration damping performance at temperatures above °C. The form of the block (B) when used together may be random, block, or tapered.
本発明の、ブロック共重合体のイソプレンまたはイソプ
レンとブタジエン混合物から戒るブロック部分の3,4
結合及び1,2結合含有量は40%以上のもの(100
%でもよい)が用いられる。3 and 4 of the block portions of the block copolymer of the present invention, which are excluded from isoprene or a mixture of isoprene and butadiene.
The bond and 1,2 bond content is 40% or more (100%
%) is used.
3,4結合及び1,2結合含有量が40%より少ない場
合、通常の使用温度領域で十分な制振性能が得られず好
ましくない。If the content of 3,4 bonds and 1,2 bonds is less than 40%, sufficient vibration damping performance cannot be obtained in the normal operating temperature range, which is not preferable.
また、ブロック共重合体の粘弾性測定により得られるt
anδ(損失正接)の主分散のピークの温度が0゜C以
上であることが必要である。0゜Cよりも低い温度にし
かピークがない場合には、通常の温度領域で十分な制振
性能が得られない。なお、イソプレンブロックの3,4
結合及び1,2結合含有量が100%の場合、tanδ
の吸収温度は約60″Cとなることから、可能な上限は
60゜C程度となる.このイソプレンまたはイソプレン
ーブタジエンからなるブロック(B)の分子量は、10
000〜200000の範囲のものが用いられる。分子
量が上記の範囲より小さい場合には、弾性的性質が損な
い好ましくない。また、大きすぎる場合には、ブロック
ボリマーの流動性が悪くなり好ましくない。In addition, t obtained by measuring the viscoelasticity of the block copolymer
It is necessary that the temperature of the peak of the main dispersion of an δ (loss tangent) is 0°C or higher. If there is a peak only at a temperature lower than 0°C, sufficient damping performance cannot be obtained in a normal temperature range. In addition, 3 and 4 of the isoprene block
When the bond and 1,2 bond content is 100%, tan δ
Since the absorption temperature of is approximately 60°C, the possible upper limit is approximately 60°C. The molecular weight of block (B) consisting of isoprene or isoprene-butadiene is 10
A value in the range of 000 to 200,000 is used. If the molecular weight is smaller than the above range, the elastic properties will be impaired, which is not preferable. Moreover, if it is too large, the fluidity of the block polymer will deteriorate, which is not preferable.
ビニル芳香族ブロックの分子量は2500〜40000
の範囲であり、分子量が2500より小さいと機械的性
質が低下し、40000を超えると溶融粘度が高くなり
過ぎ熱可塑性が損なわれ好ましくない。The molecular weight of the vinyl aromatic block is 2500-40000
If the molecular weight is less than 2,500, the mechanical properties will deteriorate, and if it exceeds 40,000, the melt viscosity will become too high and thermoplasticity will be impaired, which is not preferable.
イソブレンまたはイソブレンーブタジエンから成るブロ
ック(B)はそのブロック中の炭素一炭素二重結合の少
なくとも一部が水添されたものであっても良い。水添率
は、要求される耐熱性、耐候性のレベルに応じて決定さ
れる。高度な耐久性が要求される場合には、水添率を5
0モル%以上とするのが好ましい。The block (B) consisting of isobrene or isobrene-butadiene may be one in which at least a portion of the carbon-carbon double bonds in the block are hydrogenated. The hydrogenation rate is determined depending on the required levels of heat resistance and weather resistance. If high durability is required, increase the hydrogenation rate to 5.
The content is preferably 0 mol% or more.
また、ビニル芳香族から成るブロック(A)のブロック
共重合体中での割合は、一般に5重量%〜50重量%の
範囲である。ブロック(A)の割合が5重量%より小さ
いと、ブロック共重合体の機械的性質が不十分となり、
逆に50重量%を超えると粘度が著しく高くなるため加
工が困難となり、また制振性能も低下する。Further, the proportion of the block (A) consisting of vinyl aromatic group in the block copolymer is generally in the range of 5% by weight to 50% by weight. If the proportion of block (A) is less than 5% by weight, the mechanical properties of the block copolymer will be insufficient;
On the other hand, if it exceeds 50% by weight, the viscosity becomes extremely high, making processing difficult, and vibration damping performance also decreases.
得られるブロック共重合体の分子量は30000〜30
0000の範囲にあることが必要である.分子量が30
000より小さいとブロック共重合体自体の破断時の強
度、伸度等の機械的性質が低下する。また、30000
0を超えると加工性が悪くなる。この点からブロック共
重合体の分子量はより好ましくは80000〜2500
00の範囲にあるのが良い。The molecular weight of the block copolymer obtained is 30,000 to 30
Must be in the range 0000. Molecular weight is 30
If it is less than 000, the mechanical properties such as strength and elongation at break of the block copolymer itself will decrease. Also, 30,000
If it exceeds 0, workability will deteriorate. From this point of view, the molecular weight of the block copolymer is more preferably 80,000 to 2,500.
It is good that it is in the range of 00.
本発明のブロック共重合体のブロック形態は、A(BA
)n, (AB)nで示される物が用いられる。ここで
、nは1以上の整数であり、その上限はとくに制限はな
いが、概ね20以下の値であるのが好ましい。The block morphology of the block copolymer of the present invention is A(BA
)n, (AB)n are used. Here, n is an integer of 1 or more, and the upper limit thereof is not particularly limited, but is preferably a value of approximately 20 or less.
本発明のブロック共重合体は次の種々の方法により得ら
れる。The block copolymer of the present invention can be obtained by the following various methods.
まずブロック共重合体の重合は、アルキルリチウム化合
物を開始剤としてビニル芳香族化合物、イソプレンまた
はイソプレンーブタジエンを逐次重合させる方法、また
はビニル芳香族化合物次いでイソプレンまたはイソブレ
ンーブタジエン混合物を重合し、これをカップリング剤
によりカップリングする方法、あるいはジリウチム化合
物を開始剤としてイソプレンまたはイソプレンーブタジ
エン混合物、次いでビニル芳香族化合物を逐次重合させ
る方法等があげられる。アルキルリチウム化合物の例と
してはアルキル残基の炭素原子数が1〜10のアルキル
化合物があげられるが、とくにメチルリチウム、エチル
リチウム、ベンチルリチウム、及びブチルリチウムが好
ましい。カップリング剤としてはジクロロメタン、ジブ
ロモメタン、ジクロロエタン、ジブロモエタン、ジブロ
モベンゼン等が用いられる。ジリチウム化合物の例とし
てはナフタレンジリチウム、ジリチオヘキシルベンゼン
等があげられる。使用量は求める分子量により決定され
るものであるが、重合に用いられる全モノマー100重
量部に対し、概ね各開始剤0.01〜0. 2重量部、
カップリング剤0.04〜0.8重量部程度の範囲で用
いられる。First, the block copolymer is polymerized by sequentially polymerizing a vinyl aromatic compound, isoprene, or isoprene-butadiene using an alkyllithium compound as an initiator, or by polymerizing a vinyl aromatic compound and then isoprene or an isoprene-butadiene mixture. Examples include a method of coupling with a coupling agent, or a method of sequentially polymerizing isoprene or an isoprene-butadiene mixture and then a vinyl aromatic compound using a diliutium compound as an initiator. Examples of alkyllithium compounds include alkyl compounds in which the alkyl residue has 1 to 10 carbon atoms, with methyllithium, ethyllithium, bentyllithium, and butyllithium being particularly preferred. As the coupling agent, dichloromethane, dibromomethane, dichloroethane, dibromoethane, dibromobenzene, etc. are used. Examples of dilithium compounds include naphthalene dilithium, dilithiohexylbenzene, and the like. The amount to be used is determined by the desired molecular weight, but approximately 0.01 to 0.00 parts by weight of each initiator per 100 parts by weight of all monomers used for polymerization. 2 parts by weight,
The coupling agent is used in an amount of about 0.04 to 0.8 parts by weight.
イソプレン、またはイソプレンープタジェン混合物から
なるブロック(B)のミクロ構造として3.4結合及び
1.2結合を40%以上、かつO′C以上にtanδの
主分散のピークを持つようにするためには、イソブレン
またはイソプレンーブタジエン混合物の重合の際に共触
媒としてルイス塩基が用いられる。ルイス塩基の例とし
てはジメチルエーテル、ジエチルエ・−テル、テトラヒ
ドロフラン等のエーテル類、エチレングリコールジメチ
ルエーテル、ジエチレングリコールジメチルエーテル等
のグリコールエーテル類、トリエチルア4ン、N. N
, N′,N”−テトラメチルエチレンジアξン(TH
EDA) .N−メチルモルホリン等のアξン系化合物
等があげられる。これらのルイス塩基の使用量は重合触
媒のリチウムのモル数に対し概ね0. 1〜1000倍
の範囲で用いられる。In order to make the microstructure of the block (B) consisting of isoprene or isoprene-ptadiene mixture have 40% or more of 3.4 bonds and 1.2 bonds, and a main dispersion peak of tan δ above O'C. Lewis bases are used as cocatalysts in the polymerization of isobrene or isoprene-butadiene mixtures. Examples of Lewis bases include ethers such as dimethyl ether, diethyl ether and tetrahydrofuran, glycol ethers such as ethylene glycol dimethyl ether and diethylene glycol dimethyl ether, triethylamine, N. N
, N′,N”-tetramethylethylene diane (TH
EDA). Examples include amine compounds such as N-methylmorpholine. The amount of these Lewis bases used is approximately 0.0% based on the number of moles of lithium in the polymerization catalyst. It is used in a range of 1 to 1000 times.
重合の際には制御を容易にするために溶媒を使用するの
が好ましい.溶媒としては重合触媒に対し不活性な有機
溶媒が用いられる。特に炭素数が6〜l2の脂肪族、脂
環族、芳香族炭化水素が好ましく用いられる。その例と
しては、ヘキサン、ヘプタン、シクロヘキサン、メチル
シクロヘキサン、ベンゼン等があげられる。It is preferable to use a solvent during polymerization to facilitate control. As the solvent, an organic solvent inert to the polymerization catalyst is used. In particular, aliphatic, alicyclic, and aromatic hydrocarbons having 6 to 12 carbon atoms are preferably used. Examples include hexane, heptane, cyclohexane, methylcyclohexane, benzene, and the like.
重合はいずれの重合法による場合もO〜80’Cの温度
範囲で、0.5〜50時間の範囲で行われる。Regardless of the polymerization method, the polymerization is carried out at a temperature range of 0 to 80'C for a period of 0.5 to 50 hours.
ブロック(B)を水添する場合には公知の方法が用いら
れる。水添反応、水添触媒に対して不活性な溶媒に溶解
した状態で、公知の水添触媒により分子状水素を反応さ
せる方法が好ましく用いられる。使用される触媒として
は、ラネーニッケル、あるいはPL+ Pdr Ru,
Rh, Ni等の金属をカーボン、アルミナ、珪藻上
等の単体に担持させたもの等の不均一触媒、ま・たは、
遷移金属とアルキルアルご化合物、アルキルリチウム化
合物等の組み合わせからなるチーグラ一系の触媒等が用
いられる。反応は、水素圧が常圧ないし2 0 0 k
g/cm” 、反応温度が常温ないし250℃、反応時
間が0. 1ないし100時間の範囲で行われる。When block (B) is hydrogenated, a known method is used. A method is preferably used in which molecular hydrogen is reacted with a known hydrogenation catalyst in a state where it is dissolved in a solvent inert to the hydrogenation reaction and the hydrogenation catalyst. The catalyst used is Raney nickel or PL+Pdr Ru,
Heterogeneous catalysts such as metals such as Rh and Ni supported on carbon, alumina, diatoms, etc., or
A Ziegler series catalyst or the like consisting of a combination of a transition metal, an alkyl algo compound, an alkyl lithium compound, etc. is used. The reaction is carried out at a hydrogen pressure of normal pressure to 200 k
g/cm'', the reaction temperature is room temperature to 250°C, and the reaction time is 0.1 to 100 hours.
反応後のブロック共重合体は、反応液をメタノール等に
より凝固させた後、加熱あるいは減圧乾燥させるか、反
応液を沸騰水中に注ぎ溶剤を共沸させ除去した後、加熱
あるいは減圧乾燥することにより得られる。The block copolymer after the reaction can be produced by coagulating the reaction solution with methanol or the like and then drying it by heating or under reduced pressure, or by pouring the reaction solution into boiling water to remove the solvent by azeotropic distillation, and then drying it by heating or under reduced pressure. can get.
本発明におけるもう一つの重要な戒分てあるイソプチレ
ン系重合体について説明する.ここで用いられる重合体
は、インブチレンの単独重合体あるいは、イソブチレン
とn−プテンの共重合体、イソブチレンと共役ジエンの
共重合体等があげられる。共重合体の場合、他のモノマ
ーの比率は、概ね20モル%以下のものが好ましい。イ
ソブチレン系重合体の分子量は特に制限されるものでは
ないが200〜1000000の範囲のものが用いられ
る。Another important aspect of the present invention, the isoptylene polymer, will be explained. Examples of the polymer used here include a homopolymer of inbutylene, a copolymer of isobutylene and n-butene, and a copolymer of isobutylene and conjugated diene. In the case of a copolymer, the proportion of other monomers is preferably approximately 20 mol% or less. The molecular weight of the isobutylene polymer is not particularly limited, but one in the range of 200 to 1,000,000 is used.
ブロック共重合体とイソブチレン系重合体との混合比率
は特に制限は無いが、温度と制振性能との兼ね合いから
、重量比で95/5〜3 0/7 0の範囲で用いるの
がより好ましい.
このイソブチレン系重合体を混合することによりブロッ
ク共重合体が本来制振性能を示す温度領域以外の低温領
域でも、制振性を示すことが可能となる。There is no particular restriction on the mixing ratio of the block copolymer and isobutylene polymer, but it is more preferable to use a weight ratio in the range of 95/5 to 30/70 from the viewpoint of temperature and vibration damping performance. .. By mixing this isobutylene polymer, it becomes possible to exhibit vibration damping properties even in a low temperature range other than the temperature range in which the block copolymer originally exhibits vibration damping properties.
本発明の組威物は熱可塑性を有し、ホットメルトによる
戒型加工が可能であり、優れた加工性を有する。すなわ
ち、二一ダー等により加熱下に溶融混練し、溶融下にコ
ーティングしたり、あるいはプレス等により成型する方
法、また、押出機により或型する方法等が採られる。こ
れらのいずれの方法によっても、架橋等の反応は必要と
せず、戒型後冷却することにより十分な強度的性質を示
す戒型物が得られる。The kumiaimono of the present invention has thermoplasticity, can be processed into a shape using hot melt, and has excellent workability. That is, methods such as melt-kneading under heating using a molder or the like, coating while melting, or molding using a press, etc., or molding using an extruder, etc. are employed. In any of these methods, reactions such as crosslinking are not required, and by cooling after molding, a molded product exhibiting sufficient strength can be obtained.
本発明による組成物は、必要に応じ各種配合剤を配合し
使用される。その例としては、ロジン、テンペル、石油
樹脂等の粘着付与樹脂、DOP、DOA、プロセスオイ
ル等の可塑剤、カーボンブラック、シリカ、炭酸カルシ
ウム、マイカ等の補強剤、充填剤、着色剤等が挙げられ
る。これらの内、特にマイカは制振性能を向上させるこ
とから好ましく用いられる。これらの配合剤の使用量は
、粘着付与樹脂はIO〜300重量部、補強剤、充填剤
は20〜250重量部、マイ力については20重量部以
上の範囲で好ましく用いられる。The composition according to the present invention may be used by adding various additives as necessary. Examples include tackifying resins such as rosin, tempel, and petroleum resins, plasticizers such as DOP, DOA, and process oils, reinforcing agents such as carbon black, silica, calcium carbonate, and mica, fillers, and colorants. It will be done. Among these, mica is particularly preferably used because it improves vibration damping performance. The amounts of these compounding agents used are preferably in the range of IO to 300 parts by weight for the tackifier resin, 20 to 250 parts by weight for the reinforcing agent and filler, and 20 parts by weight or more for the strength.
また、場合によっては本発明の趣旨を損なわない程度に
他のボリマーをブレンドして使用することも可能である
。この場合、スチレンーエチレンブチレンースチレンブ
ロック共重合体、スチレンーエチレンプロピレンースチ
レンブロック共重合体、スチレンーブタジエンースチレ
ンブロック共重合体、スチレンーイソプレンースチレン
ブロック共重合体、エチレンー酢酸ビニル共重合体等が
より好ましく用いられる。これらのボリマーのブレンド
率は30重量%以下で用いるのが好ましい.本発明の組
底物は、戒型物としてそのまま、または金属、プラスチ
ック等の板に塗布、挾む等の形で使用される。Further, depending on the case, it is also possible to blend and use other polymers to the extent that the spirit of the present invention is not impaired. In this case, styrene-ethylene butylene-styrene block copolymer, styrene-ethylene propylene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, ethylene-vinyl acetate copolymer Combination etc. are more preferably used. The blending ratio of these polymers is preferably 30% by weight or less. The assembled bottom product of the present invention can be used as it is as a pre-shaped product, or by being coated on or sandwiched between metal, plastic, or other plates.
本発明による組或物は、これをベースとして使用される
ほか、各種プラスチックにブレンドし使用することも可
能である。特に好ましいプラスチックの例としては、ポ
リオレフィン、ポリアミド、スチレン系プラスチック、
ポリエステル、ABS系プラスチック、ポリカーボネー
トがあげられる.これらのフ゜ラスチックへのフ゛レン
ド率は、1既ね50重量%以下で用いられるのが良い。The composite according to the present invention can be used not only as a base, but also by blending it with various plastics. Examples of particularly preferred plastics include polyolefins, polyamides, styrene plastics,
Examples include polyester, ABS plastic, and polycarbonate. It is preferable that the blend ratio of these plastics is 50% by weight or less.
これらのプラスチックとのブレンドは通常の方法により
行われる。本発明によるブロック共重合体を各種プラス
チックにブレンドすることにより、それらに制振性能を
付与することが可能になり、筐体、各種部分等に好まし
く使用される。Blending with these plastics is carried out by conventional methods. By blending the block copolymer according to the present invention with various plastics, it is possible to impart vibration damping performance to them, and they are preferably used for housings, various parts, etc.
[実施例] 以下、実施例によって本発明を更に具体的に説明する。[Example] Hereinafter, the present invention will be explained in more detail with reference to Examples.
なお、実施例中の各測定値は以下の方法により求めた。In addition, each measurement value in an Example was calculated|required by the following method.
分子量はGPCによった。Molecular weight was determined by GPC.
ミクロ構造はNMRスペクトルを測定し、64.8 p
pm 、65.8 ppmの、3.4結合及び1,2結
合のピークと65.3 ppmの1,4結合のピークの
比から3,4結合及び1,2結合の含有量を算出した。The microstructure was determined by measuring the NMR spectrum and was found to be 64.8 p.
The contents of 3,4 bonds and 1,2 bonds were calculated from the ratio of the peak of 3.4 bonds and 1,2 bonds at 65.8 ppm and the peak of 1,4 bonds at 65.3 ppm.
水添率は、水添反応前後のブロック共重合体のヨウ素価
を測定し、その比より算出した。The hydrogenation rate was calculated from the ratio of the measured iodine values of the block copolymer before and after the hydrogenation reaction.
tanδのピーク温度は、レオバイブロン(オリエンテ
ック社製)により粘弾性スペクトルを測定することによ
り求めた。The peak temperature of tan δ was determined by measuring the viscoelastic spectrum using a Rheovibrone (manufactured by Orientech Co., Ltd.).
制振性能を示す損失係数(η)は、厚さ1++nの鋼板
に配合物を塗布した験体に、加振器により振動を与え、
験体の共振の度合いを測定するという共振法によった。The loss coefficient (η), which indicates vibration damping performance, is determined by applying vibration to a steel plate with a thickness of 1++n and applying the compound to it using an exciter.
The resonance method was used to measure the degree of resonance of the object being tested.
なお、測定周波数は5 0 0 Hz、測定温度は40
、20、O″Cでおこない制振性を示す温度範囲の広さ
の指標とした。The measurement frequency was 500 Hz, and the measurement temperature was 40
, 20, O''C, and was used as an index of the breadth of the temperature range showing vibration damping properties.
実施例1、比較例l
乾燥し、窒素で置換された耐圧反応器に、溶媒としてシ
クロヘキサ76 0 0mj2、重合触媒としてn −
BuLi O.2mf,ビニル化剤にTHEDA 0
.2mlを添加し、50゜Cに昇温した後、スチレンモ
ノ7−5mj2、イソプレンモノマ−120mj2、ス
チレンモノマ−5rnfの順に添加し重合させた。Example 1, Comparative Example 1 In a pressure-resistant reactor that was dried and purged with nitrogen, 7600 mj2 of cyclohexa was added as a solvent and n-
BuLiO. 2mf, THEDA 0 as vinylation agent
.. After adding 2 ml and raising the temperature to 50°C, styrene monomer 7-5mj2, isoprene monomer 120mj2, and styrene monomer 5rnf were added in this order and polymerized.
重合液をメタノールで処理することにより共重合体を回
収した。得られた共重合体を真空乾燥することにより、
ブロック共重合体(1)を得た。The copolymer was recovered by treating the polymerization liquid with methanol. By vacuum drying the obtained copolymer,
A block copolymer (1) was obtained.
得られたポリマーの分子量は165000、ポリスチレ
ンブロックの分子量は9800、ポリイソプレンブロッ
クの分子量は145000, 3.4結合及び1.2結
合の合計量が79.8%であった。The molecular weight of the obtained polymer was 165,000, the molecular weight of the polystyrene block was 9,800, the molecular weight of the polyisoprene block was 145,000, and the total amount of 3.4 bonds and 1.2 bonds was 79.8%.
また、tanδのピーク温度は39.8%であった。Moreover, the peak temperature of tan δ was 39.8%.
得られた共重合体と、各種イソブチレン系ポリマーとし
て、イソブテンとブテンー1の共重合体(イソブテン/
1−ブテン=約85/15(wt/ w t ) 、分
子量1450 ;ポリブテンHV−300日本石油化学
製)、ポリイソブチレンス(分子箪35000、ビスタ
ネックスLM.日本フ゛チノレ製)、ブチルゴム(イソ
プレン含有量1.6モル%、分子量;約350000ボ
リサー社製)とを第1表に示した処方により配合物を作
戒し損失係数の測定を行った。第1表に示した結果のと
うり、ブロック共重合体のみの場合、40’Cでは高い
制振性能を示すものの、20゜C,O″Cでは損失係数
は小さく、制振性能が不十分であることを示している。The obtained copolymer and various isobutylene-based polymers include isobutene and butene-1 copolymers (isobutene/butene-1).
1-butene = approx. 85/15 (wt/wt), molecular weight 1450; Polybutene HV-300 manufactured by Nippon Oil & Chemicals Co., Ltd.), polyisobutylene (Molecular Box 35000, Vistanex LM manufactured by Nippon Petrochemical Co., Ltd.), butyl rubber (isoprene content 1.6 mol %, molecular weight: approximately 350,000 (manufactured by Borisar), and the formulation shown in Table 1 was used to prepare the formulation, and the loss factor was measured. As shown in the results shown in Table 1, when only the block copolymer is used, although it shows high damping performance at 40'C, the loss coefficient is small at 20°C and O''C, and the damping performance is insufficient. It shows that.
これに対し本発明の組或物はいずれの温度でも十分高い
損失係数を持ち広い温度範囲で制振性能を有することが
わかる。In contrast, it can be seen that the assembly of the present invention has a sufficiently high loss coefficient at any temperature and has damping performance over a wide temperature range.
実施例2
スチレンモノマーとイソプレンモノマーの使用量をそれ
ぞれ7mAおよび150mffiに変えること以外は実
施例1と同様にして重合した後、Pd−Cを触媒として
水添することにより、ブロック共重合体(II)を得た
。Example 2 A block copolymer (II ) was obtained.
このものの分子量は120000、ボリスチレンブロッ
クの分子量は8000、ポリイソプレンブロックの分子
量は100000、3,4結合及び1,2結合の合計量
は73.4%、水添率は78.2%であった。tanδ
のピーク温度は36.8℃であった。The molecular weight of this product was 120,000, the molecular weight of the polystyrene block was 8,000, the molecular weight of the polyisoprene block was 100,000, the total amount of 3,4 bonds and 1,2 bonds was 73.4%, and the hydrogenation rate was 78.2%. Ta. tanδ
The peak temperature was 36.8°C.
共重合体とポリイソブチレン(ビスタネックスLM)と
のブレンド物を作成し損失係数を測定した。第2表に示
した結果のとうり本発明の組成物は広い温度範囲で制振
性能を示すことがわかる。A blend of the copolymer and polyisobutylene (Vistanex LM) was prepared and its loss factor was measured. The results shown in Table 2 indicate that the composition of the present invention exhibits vibration damping performance over a wide temperature range.
以下余白
〔発明の効果〕
本発明は広い温度範囲で十分な制振性能を発揮する制振
性材料を提供する。Margins below [Effects of the Invention] The present invention provides a vibration damping material that exhibits sufficient vibration damping performance over a wide temperature range.
Claims (1)
族モノマーから成るブロック(A)と、イソプレンまた
はイソプレン−ブタジエン混合物から成り、数平均分子
量が10000〜200000で、3,4結合及び1,
2結合含有量が40%以上であり、0℃以上にtanδ
の主分散のピークを有するブロック、またはその鎖中の
炭素−炭素二重結合の少なくとも一部が水添されたブロ
ック(B)より構成され、ブロックの結合の形態が、A
−(B−A^)_n、又は(A−B)_n(nは1以上
の整数)で表される、分子量が30000〜30000
0であるブロック共重合体、およびイソブチレン系重合
体からなる制振性組成物。1) A block (A) consisting of a vinyl aromatic monomer with a number average molecular weight of 2,500 to 40,000, and isoprene or an isoprene-butadiene mixture, with a number average molecular weight of 10,000 to 200,000, 3,4 bonds and 1,
2 bond content is 40% or more, tan δ is higher than 0℃
or a block (B) in which at least a part of the carbon-carbon double bonds in the chain is hydrogenated, and the bonding form of the block is A.
- Molecular weight is 30,000 to 30,000, expressed as (B-A^)_n or (A-B)_n (n is an integer of 1 or more)
1. A vibration damping composition comprising a block copolymer of 0.0 and an isobutylene polymer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424089A JP2795707B2 (en) | 1989-11-22 | 1989-11-22 | Damping composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424089A JP2795707B2 (en) | 1989-11-22 | 1989-11-22 | Damping composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03166247A true JPH03166247A (en) | 1991-07-18 |
JP2795707B2 JP2795707B2 (en) | 1998-09-10 |
Family
ID=17930683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30424089A Expired - Lifetime JP2795707B2 (en) | 1989-11-22 | 1989-11-22 | Damping composition |
Country Status (1)
Country | Link |
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JP (1) | JP2795707B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993014135A1 (en) * | 1992-01-21 | 1993-07-22 | Nippon Zeon Co., Ltd. | Damping material composition |
JP2006282784A (en) * | 2005-03-31 | 2006-10-19 | Nippon Zeon Co Ltd | Vibration-damping molding |
WO2006132233A1 (en) * | 2005-06-07 | 2006-12-14 | Kaneka Corporation | Resin composition |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2981253B2 (en) | 1990-04-04 | 1999-11-22 | 株式会社クラレ | Damping composition |
-
1989
- 1989-11-22 JP JP30424089A patent/JP2795707B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993014135A1 (en) * | 1992-01-21 | 1993-07-22 | Nippon Zeon Co., Ltd. | Damping material composition |
JP2006282784A (en) * | 2005-03-31 | 2006-10-19 | Nippon Zeon Co Ltd | Vibration-damping molding |
WO2006132233A1 (en) * | 2005-06-07 | 2006-12-14 | Kaneka Corporation | Resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2795707B2 (en) | 1998-09-10 |
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