JPH031582U - - Google Patents

Info

Publication number

JPH031582U

JPH031582U JP6152789U JP6152789U JPH031582U JP H031582 U JPH031582 U JP H031582U JP 6152789 U JP6152789 U JP 6152789U JP 6152789 U JP6152789 U JP 6152789U JP H031582 U JPH031582 U JP H031582U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

copper foil

pattern

foil pattern

Prior art date

1989-05-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 238000000605 extraction Methods 0.000 claims description 4
• 230000037431 insertion Effects 0.000 claims description 4
• 238000003780 insertion Methods 0.000 claims description 4
• 239000004020 conductor Substances 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1