JPH03155179A - Laminated displacement element - Google Patents

Laminated displacement element

Info

Publication number
JPH03155179A
JPH03155179A JP1295337A JP29533789A JPH03155179A JP H03155179 A JPH03155179 A JP H03155179A JP 1295337 A JP1295337 A JP 1295337A JP 29533789 A JP29533789 A JP 29533789A JP H03155179 A JPH03155179 A JP H03155179A
Authority
JP
Japan
Prior art keywords
displacement element
laminated
terminal
electrically
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1295337A
Other languages
Japanese (ja)
Inventor
Shigeru Sadamura
定村 茂
Junichi Watanabe
純一 渡辺
Yoshiyuki Watabe
嘉幸 渡部
Takahiro Sometsugu
孝博 染次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP1295337A priority Critical patent/JPH03155179A/en
Publication of JPH03155179A publication Critical patent/JPH03155179A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve mechanical strength of a terminal plate fully and prevent the tension from affecting an external electrode even if the tension operates on a lead member by introducing a pair of terminal plates which protrude from the side surface of a laminated body and which has an anchoring part which is formed so that it can be connected to the lead member electrically in electrically insulated state and by connecting the external electrode to the terminal plate electrically. CONSTITUTION:After a thin plate 1 with internal electrodes 2a and 2b is laminated alternately and are contact-bonded, it is fired and a laminated body 5 is formed. Then, a film 4 consisting of an insulating material and external electrodes 3a and 3b consisting of an conductive material are provided at every other layer of an end face of the internal electrodes 2a and 2b of the side surface of the laminated body 5. Each terminal plate 8a, 8b are formed in the plane contour which is nearly the same as the thin plate 1 by a conductive metal material. Then, an anchoring part 9 is allowed to protrude in one piece and is adhered to the upper and lower end faces of the laminated body 5 by an adhesive, etc. The terminal plates 8a and 8b are electrically connected to each external electrodes 3a and 3b through a solder 7, thus keeping the area between the terminal plates 8a and 8b to be electrically insulated.

Description

【発明の詳細な説明】 (産業上の利用分野〕 本発明は1産業用ロボツトのアクチュエータ。[Detailed description of the invention] (Industrial application field) The present invention is an actuator for an industrial robot.

超音波モータ等に使用する電気機械変換素子に関するも
のであり、特に電気機械変換材料からなる薄板を、内部
電極を介して複数枚積層することにより、変位量を増大
させた積層型変位素子の改良に関するものである。
This relates to electromechanical transducers used in ultrasonic motors, etc., and in particular improves laminated displacement elements that increase the amount of displacement by laminating multiple thin plates made of electromechanical transducer material via internal electrodes. It is related to.

〔従来の技術〕[Conventional technology]

従来、x−yステージの位置決め機構や制動ブレーキ等
に用いられている変位用素子に使用する積層型変位素子
は、所定の形状に加工した圧電セラミンク材料からなる
薄板に電極を設けて分極した後1直接若しくは薄い金属
を介して有機系の接着剤で接合する方法が採用されてい
る。しかし上記のように接着剤を使用して積層したもの
は、使用条件により、圧電素子の振動による変位を接着
剤層が吸収したり、高温の環境若しくは長期間の使用に
より接着剤が劣化する等の欠点がある。
Conventionally, laminated displacement elements used for displacement elements used in positioning mechanisms of x-y stages, brakes, etc. are made by attaching electrodes to a thin plate made of piezoelectric ceramic material processed into a predetermined shape, and then polarizing it. 1. A method of bonding directly or via a thin metal using an organic adhesive is adopted. However, when stacking layers using adhesive as described above, depending on the usage conditions, the adhesive layer may absorb displacement due to vibration of the piezoelectric element, or the adhesive may deteriorate due to high temperature environment or long-term use. There are drawbacks.

このため、最近では積層チップコンデンサ構造方式の積
層型圧電素子が実用化されている。すなわち1例えば特
公昭59−32040号公報に記載のように、原料粉末
にバインダーを添加、混練したペースト状の圧電セラミ
ンク材料を、所定の厚さの薄板に形成し、この薄板の一
方の面若しくは両面に根−パラジウム等の導電材料を塗
布して内部電極を形成する。上記薄板を所定枚数積層し
て圧着し更に所定の形状に加工した後、焼成することに
よってセラミック化し、積層体の両側面に外部電極を形
成したものである。上記構成の積層型圧電素子は1圧電
セラミツク材料からなる薄板と内部電極の接合部の密着
性に優れると共に、熱的特性も安定であるため高温環境
においても充分に使用可能であり、また長期間に亘って
劣化が極めて少ない等の利点がある。
For this reason, recently, multilayer piezoelectric elements having a multilayer chip capacitor structure have been put into practical use. That is, 1. For example, as described in Japanese Patent Publication No. 59-32040, a paste-like piezoelectric ceramic material obtained by adding a binder to raw material powder and kneading is formed into a thin plate of a predetermined thickness, and one side of this thin plate or A conductive material such as palladium is coated on both sides to form internal electrodes. A predetermined number of the above thin plates are laminated and pressed together, further processed into a predetermined shape, and then fired to form a ceramic, and external electrodes are formed on both sides of the laminate. The laminated piezoelectric element with the above structure has excellent adhesion between the thin plate made of piezoelectric ceramic material and the internal electrode, and has stable thermal properties, so it can be used satisfactorily even in high-temperature environments, and can be used for long periods of time. It has the advantage of extremely little deterioration over time.

第7図は上記積層型圧電素子の構成の例であり所謂交互
電極型と称されるものである。第7図において、■は薄
板であり圧電セラミック材料によって形成し、正負の内
部電極2a、2bを交互に挟着して積層し、積層体5を
形成する。内部電極2a、2bは各々一方の端縁部が外
方に突出若しくは露出するように形成し1各々積層方向
に延設した外部電極3a、3bと接続し、この外部電極
3a、3bにはんだ7を介してリード線6を接続する。
FIG. 7 shows an example of the structure of the laminated piezoelectric element, which is so-called an alternating electrode type. In FIG. 7, a thin plate (■) is made of a piezoelectric ceramic material, and positive and negative internal electrodes 2a and 2b are alternately sandwiched and stacked to form a laminate 5. The internal electrodes 2a, 2b are each formed so that one end edge protrudes or is exposed to the outside, and are connected to external electrodes 3a, 3b each extending in the stacking direction, and a solder 7 is applied to the external electrodes 3a, 3b. The lead wire 6 is connected via.

以上の構成により、外部電極3a、3bに正負の電圧を
印加すると、前記内部iit極2a、2b間に電界が発
生し、薄板1は圧電セラミンク材料の縦効果により厚さ
方向に伸びて変位を生ずる。
With the above configuration, when positive and negative voltages are applied to the external electrodes 3a and 3b, an electric field is generated between the internal IIT electrodes 2a and 2b, and the thin plate 1 is elongated in the thickness direction due to the longitudinal effect of the piezoelectric ceramic material, causing displacement. arise.

次に第8図に示すものは他の積層型圧電素子の例であり
、圧電変位効率を向上させた所謂全面電極型と称される
ものである(例えば特開昭58−196068号公報等
参照)。第8図において同一部分は前記第7図と同一の
参照符号で示すが、内部室Fi2a、2bは薄板1の表
面全域に及ぶように形成して、所要枚数を前記同様に積
層する。次に上記のようにして形成した積層体5の一方
の側面において、内部電極2a、2bの端縁に一層おき
に(例えば内部電極2bのみに)絶縁材料からなる被覆
4を設けると共に、被覆4の上から導電性子オ料からな
る外部電極3aを被着させる。一方積層体5の他の側面
においては、上記被覆4を設けなかった内部電極(例え
ば2a)の端縁に前記と同様に被覆4を設け、その上か
ら外部電極3bを被着させるのである。以上の構成によ
る作用は前記第7図におけるものと同様である。
Next, the one shown in FIG. 8 is an example of another laminated piezoelectric element, which is a so-called full-surface electrode type with improved piezoelectric displacement efficiency (for example, see Japanese Patent Application Laid-Open No. 196068/1983). ). In FIG. 8, the same parts are indicated by the same reference numerals as in FIG. 7, but the internal chambers Fi2a, 2b are formed so as to cover the entire surface of the thin plate 1, and the required number of sheets are laminated in the same manner as described above. Next, on one side of the laminate 5 formed as described above, coatings 4 made of an insulating material are provided on the edges of the internal electrodes 2a and 2b every other layer (for example, only on the internal electrodes 2b), and An external electrode 3a made of a conductive dielectric material is applied from above. On the other hand, on the other side of the laminate 5, a coating 4 is provided on the edge of the internal electrode (for example, 2a) not provided with the coating 4 in the same manner as described above, and an external electrode 3b is applied thereon. The effect of the above configuration is similar to that shown in FIG. 7 above.

(発明が解決しようとする課題〕 上記従来の積層型変位素子においては、外部型i3a、
3bとリード線6との接続手段としてはんだ7等の低融
点合金による所謂点付けを使用することが多い。しかし
ながらこのような接続手段では、はんだ7による接続部
の接続強度が充分でないため、車輌その他のような大き
な振動を生ずる用途に積層型変位素子を使用した場合に
は、この振動によって前記接続部が外部電極3a、3b
から剥離し、この結集積層型変位素子の作動不良を招来
するという問題点がある。また薄板lを例えば厚さ10
0μmに形成した場合、はんだ7を被着する充分なスペ
ースを確保できなかったり、外部電i3a、3bのはん
だ食われや、はんだ7の歪抑制効果による被覆4の破壊
を誘発して、信頼性を低下する欠点もある。次にリード
線6および外部電極3a、3bを介して積層体5に電圧
を印加、解除して積層体5を伸縮させる場合には、外部
電極3a、3bに応力が作用する。一方外部電極3a、
3bは例えば銀ペーストを塗布若しくは印刷して形成す
るものであり、極めて薄い数μm程度の厚さを有するに
過ぎず、前記応力の作用により亀裂が発生し易く、また
断線し易い。このような亀裂若しくは断線が発生すると
、積層体5を所定量だけ伸縮させることができず、積層
型変位素子の作動不良を生しるという問題点がある。
(Problems to be Solved by the Invention) In the conventional laminated displacement element described above, the external type i3a,
3b and the lead wire 6, so-called dotting with a low melting point alloy such as solder 7 is often used. However, with this type of connection means, the connection strength of the solder 7 connection is not sufficient, so when the laminated displacement element is used in an application that generates large vibrations, such as in a vehicle, the vibration may cause the connection to be damaged. External electrodes 3a, 3b
There is a problem in that the laminated displacement element peels off from the substrate, causing malfunction of the integrated laminated displacement element. Also, the thickness of the thin plate l is, for example, 10
If it is formed to have a thickness of 0 μm, it may not be possible to secure enough space for the solder 7 to adhere, or the external electrodes i3a and 3b may be eaten away by the solder, or the coating 4 may be destroyed due to the strain suppressing effect of the solder 7, resulting in poor reliability. There is also a drawback that it reduces the Next, when applying and releasing a voltage to the laminate 5 via the lead wire 6 and the external electrodes 3a, 3b to cause the laminate 5 to expand or contract, stress acts on the external electrodes 3a, 3b. On the other hand, external electrode 3a,
The wire 3b is formed by applying or printing a silver paste, for example, and has a very thin thickness of only a few micrometers, and is easily cracked or broken due to the stress described above. If such a crack or disconnection occurs, there is a problem in that the laminate 5 cannot be expanded or contracted by a predetermined amount, resulting in malfunction of the laminate displacement element.

上記のような問題点を解決するために、リード線6を積
層体5の積層方向の略全長に渡って配置すると共に、積
層方向の略全長に渡り外部電極3a、3bに例えばはん
だ等により電気的かつ機械的に接続するという内容の提
案がされている(特開昭63−92068号公報参照)
。このような構成とすることにより、リード線6と外部
電Fi3a、3bとの接合面積が増大するため9例えば
はんだ打部の強度が増大することとなる。また上記接合
部は積層方向の略全長に渡って延長しているので、積層
体5の反復伸縮によって外部電Ji3a、3bに亀裂若
しくは断線が発生しても、すべての内部電極2a、2b
とリード線6との間には常に電気的接続状態が確保され
るという効果があると記載されている。
In order to solve the above-mentioned problems, the lead wires 6 are disposed over almost the entire length of the laminate 5 in the stacking direction, and the external electrodes 3a and 3b are electrically connected to the external electrodes 3a and 3b by, for example, solder, over almost the entire length in the stacking direction. A proposal has been made to connect them mechanically and mechanically (see Japanese Patent Laid-Open No. 63-92068).
. With such a configuration, the bonding area between the lead wire 6 and the external electric wires Fi 3a, 3b increases, so that the strength of the solder joint 9, for example, increases. Furthermore, since the joint portion extends over almost the entire length in the stacking direction, even if cracks or disconnections occur in the external electrodes 3a and 3b due to repeated expansion and contraction of the stacked body 5, all internal electrodes 2a and 2b
It is stated that there is an effect that an electrical connection state is always ensured between the lead wire 6 and the lead wire 6.

しかしながら上記構成の積層型変位素子においては、上
記効果を有する反面において、積層体5の伸縮機能を阻
害し、および/または積層体5にクラックを生ずるとい
う問題点がある。すなわちリード線6を外部電極3a、
3bの全長に渡ってはんだ付等によって接続すると、リ
ード線6によって積層体5を拘束することとなり、変位
を減少することとなる。また本来積層体5の伸縮と対応
して伸縮すべき外部電極3a、3bを剛性化することと
なり、積層体5および/または積層体5と外部電極3a
、3bとの接合部にクランク若しくは剥離を生じ、積層
型変位素子としての機能を阻害するという問題点がある
However, while the laminated displacement element having the above structure has the above effects, it also has the problem that the expansion and contraction function of the laminated body 5 is inhibited and/or cracks are generated in the laminated body 5. That is, the lead wire 6 is connected to the external electrode 3a,
If the entire length of the laminate 3b is connected by soldering or the like, the laminate 5 will be restrained by the lead wire 6, and displacement will be reduced. In addition, the external electrodes 3a and 3b, which should originally expand and contract in accordance with the expansion and contraction of the laminate 5, are made rigid, and the laminate 5 and/or the laminate 5 and the external electrode 3a are made rigid.
, 3b, which causes cranking or peeling, which impairs its function as a laminated displacement element.

また第9図に示すように最外層の薄板1aに。Also, as shown in FIG. 9, the outermost thin plate 1a.

内部電極2a、2bと同様の導電材2cを貫通させて設
け、端子電¥i3c、3dと各々電気的に接続してなる
積層型変位素子の提案もなされている(特開昭63−1
77480号公報参照)、上記提案によれば、リード線
を取り付けた時の不具合や、従来のリードレス構造にお
ける外部!桟の形成不具合を解消できる旨の記載がある
A laminated displacement element has also been proposed in which a conductive material 2c similar to the internal electrodes 2a and 2b is provided through and electrically connected to terminal electrodes 3c and 3d (Japanese Patent Laid-Open No. 63-1
(Refer to Publication No. 77480), according to the above proposal, there are problems when attaching the lead wires and external problems in the conventional leadless structure! There is a statement that it is possible to resolve the formation defect of the crosspiece.

しかしながら上記構成のものにおいては、最外層の薄板
1a内に導電材2cを貫通させて形成する必要があり、
薄板1aの製作が極めて煩雑となると共に、導電材2c
と内部電極2a、2bとの電気的接続状態が不安定であ
るため、信頼性が低いという問題点がある。なおこの形
式の積層型変位素子は、リードレス構造のものであるた
め、第7図および第8図におけるリード線6に張力が作
用した場合のはんだ7および/または外部電極3a、3
bの剥離防止作用については依然として不充分であると
いう問題点も併存する。
However, in the above structure, it is necessary to form the conductive material 2c through the outermost thin plate 1a.
The production of the thin plate 1a becomes extremely complicated, and the conductive material 2c
There is a problem in that the reliability is low because the electrical connection between the internal electrodes 2a and 2b is unstable. Note that this type of laminated displacement element has a leadless structure, so when tension is applied to the lead wire 6 in FIGS. 7 and 8, the solder 7 and/or the external electrodes 3a, 3
There is also the problem that the anti-peeling effect of b is still insufficient.

本発明は上記従来技術に存在する問題点を解決し、外部
電極の亀裂若しくは断線による作動不良を防止し得ると
共に、所定の変位を充分に確保しかつリード部材の接続
部における強度を向上させ得る積層型変位素子を提供す
ることを目的とする。
The present invention solves the problems existing in the above-mentioned prior art, can prevent malfunctions due to cracks or disconnections in the external electrode, can sufficiently secure a predetermined displacement, and can improve the strength of the connection portion of the lead member. The present invention aims to provide a laminated displacement element.

〔課題を解決するための手段] 上記目的を達成するために、まず第1の発明においては
、略同一の平面輪郭および接触面積に形成した電気機械
変換材料からなる薄板と導電材料からなる内部電極とを
各々複数個交互に積層して積層体を形成し、この積層体
の側面に前記内部電極と一層おきに接続すべき1対の外
部電極を設けてなる積層型変位素子において。
[Means for Solving the Problems] In order to achieve the above object, first of all, in the first invention, a thin plate made of an electromechanical conversion material and an internal electrode made of a conductive material are formed to have substantially the same planar contour and contact area. In a laminated displacement element, a laminated body is formed by alternately laminating a plurality of these, and a pair of external electrodes to be connected to the internal electrodes every other layer is provided on the side surface of the laminated body.

積層体の側面に突出し、かつリード部材と電気的に接続
可能に形成した係止部を有する1対の端子板を電気的絶
縁状態に介装させると共に、外部電極と端子板とを電気
的に接続する。という技術的手段を採用した。
A pair of terminal boards having a locking part that protrudes from the side surface of the laminate and is formed to be electrically connectable to the lead member are interposed in an electrically insulated state, and the external electrode and the terminal board are electrically connected. Connecting. A technical method was adopted.

次に、第2の発明においては、略同一の平面輪郭および
接触面積に形成した電気機械変換材料からなる薄板と導
電材料からなる内部電極とを各々複数個交互に積層して
形成した単位積層体を更に複数個積層して複積層体を形
成し、この複積層体の側面に前記内部電極と一層おきに
接続すべき1対の外部電極を設けてなる積層型変位素子
において。
Next, in the second invention, a unit laminate is formed by alternately laminating a plurality of thin plates made of an electromechanical conversion material and internal electrodes made of a conductive material, which are formed to have substantially the same planar outline and contact area. In a laminated displacement element, a plurality of layers are further laminated to form a multi-layer body, and a pair of external electrodes to be connected to the internal electrodes every other layer are provided on the side surfaces of the multi-layer body.

単位積層体間に、この単位積層体の側面に突出し、かつ
リード部材と電気的に接続可能に形成した係止部を有す
る1対の端子板を電気的絶縁状態に介装させると共に、
外部電極と端子板とを電気的に接続する。という技術的
手段を採用した。
A pair of terminal plates having locking portions protruding from the side surfaces of the unit laminates and formed to be electrically connectable to the lead members are interposed between the unit laminates in an electrically insulated state, and
Electrically connect the external electrode and the terminal board. A technical method was adopted.

上記両発明において、端子板を金属材料によって形成す
ることができる。
In both of the above inventions, the terminal plate can be formed of a metal material.

また絶縁材料からなる基板の表面に各々導電材料からな
る被膜を電気的絶縁状態に固着して1対の端子板を形成
してもよい。
Alternatively, a pair of terminal plates may be formed by fixing a coating made of a conductive material to the surface of a substrate made of an insulating material in an electrically insulating state.

更に端子板の中間部に絶縁材料からなる分割部を設けた
構成としてもよい。
Furthermore, a structure may be adopted in which a divided portion made of an insulating material is provided in the intermediate portion of the terminal board.

〔作 用〕[For production]

上記の構成により、端子板の機械的強度を充分に向上さ
せ得ると共に、リード部材に張力が作用しても、外部電
極にその張力が及ぶことを防止することができ、外部電
極の剥離による事故を未然に防止するという作用を期待
できる。
With the above configuration, the mechanical strength of the terminal board can be sufficiently improved, and even if tension is applied to the lead member, it can be prevented from being applied to the external electrode, resulting in accidents caused by peeling of the external electrode. It can be expected to have the effect of preventing this from occurring.

〔実施例〕〔Example〕

第1図は本発明の実施例を模式的に示す側面図であり、
同一部分は前記第7図および第8図と同一の参照符号で
示す。第1図においてまず例えばPb (Zr、Ti)
O,粉末に、有機バインダーとしてPVB、可塑剤とし
てBPBG、有機溶剤としてトリクレンを夫々添加して
混合し、この混合材料をドクターブレード法により厚さ
1100aのシート状の薄板1に形成する。次にこの薄
板1の表面全域に内部電極2a、2bを形成する銀−パ
ラジウムペーストをスクリーン印刷する。上記のように
形成した内部電極2a、2bを有する薄板1を交互に例
えば100枚積積層て圧着した後。
FIG. 1 is a side view schematically showing an embodiment of the present invention,
Identical parts are designated by the same reference numerals as in FIGS. 7 and 8 above. In FIG. 1, first, for example, Pb (Zr, Ti)
PVB as an organic binder, BPBG as a plasticizer, and trichlene as an organic solvent are respectively added to the powder and mixed, and the mixed material is formed into a sheet-like thin plate 1 having a thickness of 1100 a by a doctor blade method. Next, a silver-palladium paste forming internal electrodes 2a, 2b is screen printed over the entire surface of this thin plate 1. For example, 100 thin plates 1 having internal electrodes 2a and 2b formed as described above are alternately stacked and pressure bonded.

所定の寸法形状に切断して積層体とし、 1050〜1
200℃で1〜5時間焼成して積層体5を形成する。
Cut into a predetermined size and shape to form a laminate, 1050-1
The laminate 5 is formed by firing at 200° C. for 1 to 5 hours.

次にこの積層体5の側面に、内部電極2a、2bの端縁
に一層おきに絶縁材料からなる被覆4と。
Next, on the side surface of this laminate 5, a coating 4 made of an insulating material is provided on every other layer at the edges of the internal electrodes 2a, 2b.

導電性材料からなる外部電極3a、3bとを設ける。次
に8a、8bは各々端子板であり1例えば銅、真鍮等の
導電性金属材料により、薄板lと略同一の平面輪郭に形
成すると共に、係止部9を一体的に突出させ、積層体5
の上下端面に接着剤その他により固着する。なお端子板
8a、8bは各々前記外部電極3a、3bとはんだ7を
介して電気的に接続する。従って端子板8a、8b間は
電気的絶縁状態に保持される。
External electrodes 3a and 3b made of a conductive material are provided. Next, terminal plates 8a and 8b are each made of a conductive metal material such as copper or brass, and are formed to have approximately the same planar outline as the thin plate 1, and have locking portions 9 integrally projected. 5
It is fixed to the upper and lower end surfaces of the board with adhesive or other means. Note that the terminal plates 8a and 8b are electrically connected to the external electrodes 3a and 3b via solder 7, respectively. Therefore, the terminal plates 8a and 8b are maintained in an electrically insulated state.

第2図(a)は第1図における端子板8a、8bを示す
斜視図である。第2図(a)において例えば右方に突出
させて設けた係止部9には、穴10を貫通させて設ける
FIG. 2(a) is a perspective view showing the terminal plates 8a and 8b in FIG. 1. In FIG. 2(a), for example, a hole 10 is provided in the locking portion 9 which is provided to protrude to the right.

上記の構成により、端子板8a、8bの係止部9に設け
た穴10内にリード線を挿通し、第1図に示すように捻
回固着し、更にはんだ7を肉盛すれば、リード線6と端
子板8a、8bとは強固に固着され得る。この状態にお
いてリード線6,6間に電圧を印加すれば、積層体5を
上下方向に伸縮駆動することができる。この場合端子板
8a。
With the above configuration, the lead wires are inserted into the holes 10 provided in the locking portions 9 of the terminal plates 8a and 8b, twisted and fixed as shown in FIG. The wire 6 and the terminal plates 8a, 8b can be firmly fixed. In this state, if a voltage is applied between the lead wires 6, 6, the stacked body 5 can be driven to expand and contract in the vertical direction. In this case, the terminal plate 8a.

8bは例えば肉厚を0.05〜3mmに形成することが
できるため、va械的強度が大であると共に。
8b can be formed to have a wall thickness of 0.05 to 3 mm, for example, and thus has high mechanical strength.

リード線6との固着力も充分に大である。従ってリード
線6に不測の張力が作用しても充分に対抗することがで
き、外部電極3a、3bが剥離するおそれは皆無とし得
る。
The adhesion force with the lead wire 6 is also sufficiently large. Therefore, even if unexpected tension is applied to the lead wire 6, it can be sufficiently resisted, and there is no possibility that the external electrodes 3a, 3b will peel off.

次に第2図(ロ)(C)は各々第2図(a)における端
子板8a、8bの変形例を示す斜視図である。まず第2
図(b)に示すものは、端子板8a、8bの一方の表面
に絶縁部材8cを固着したものである。また第2図(C
)に示すものは、係止部9の一方の表面にも絶縁部材9
cを固着したものである。
Next, FIGS. 2(b) and 2(c) are perspective views showing modified examples of the terminal plates 8a and 8b in FIG. 2(a), respectively. First, the second
In the case shown in FIG. 8(b), an insulating member 8c is fixed to one surface of terminal plates 8a and 8b. Also, Figure 2 (C
) shows an insulating member 9 also on one surface of the locking part 9.
c is fixed.

上記のように形成した端子板8a、8bを、第1図に示
す積層体5に固着する場合に、最上下面に絶縁部材8c
または絶縁部材8c、9cが現れるように形成すれば、
積層体5の上下に近接する他部材との電気的絶縁を61
保することができる。
When the terminal plates 8a and 8b formed as described above are fixed to the laminate 5 shown in FIG.
Or, if it is formed so that the insulating members 8c and 9c appear,
Electrical insulation from other members adjacent to the top and bottom of the laminate 5 is provided by 61.
can be maintained.

なお上記のような端子板8a、8bに絶縁部材8c、9
cを固着する構成に代えて、PZTAl、O,、ZrO
□等の絶縁材料によって形成した端子板(例えば第2図
(C)における8c、9cの部分)にメツキ、スパッタ
、ペースト塗布等の手段によって、導電部材(例えば第
2[m(C)における8a、8bの部分)を形成しても
よい。
Note that insulating members 8c and 9 are attached to the terminal plates 8a and 8b as described above.
Instead of fixing c, PZTAL, O, ZrO
A conductive member (for example, 8a in 2nd [m(C) , 8b) may be formed.

第3図(a)ないしくd)は夫々第2図(a)における
端子板8a、8bの他の変形例を示す平面図である。
3(a) to 3(d) are plan views showing other modifications of the terminal plates 8a and 8b in FIG. 2(a), respectively.

第3図(a) (b)に示すように、係止部9に設ける
穴10の平面輪郭形状は、半円形若しくはU字形として
もよい。また第3図(C) (d)に示すように係止部
9に前記の穴を欠如するように形成してもよい。
As shown in FIGS. 3(a) and 3(b), the planar contour shape of the hole 10 provided in the locking portion 9 may be semicircular or U-shaped. Further, as shown in FIG. 3(C)(d), the locking portion 9 may be formed so as to lack the aforementioned hole.

なお係止部9を第1図におけるように積層体5の両側面
に突出させる代わりに、一方の側面に突出させても作用
は同一であり、このような態様で使用する場合には、第
3図(d)に示すように係止部9を端子板8a、8bの
角部に近接させて設けると好都合である。
Note that the effect is the same even if the locking part 9 is made to protrude from one side of the laminate 5 instead of from both sides as shown in FIG. As shown in FIG. 3(d), it is convenient to provide the locking portions 9 close to the corners of the terminal plates 8a, 8b.

第4図(a) (b) (C)は夫々端子板の更に他の
変形例を示す斜視図である。第4図(a) (b) (
C)において端子板11は中間部に絶縁材料からなる分
割部11cを介在させて、1対の端子部11 a 、 
11 bを絶縁状態に接合一体化したものである。なお
端子部11a、11bは前記第1図ないし第3図におけ
る端子板8a8bと対応するものである。
FIGS. 4(a), 4(b), and 4(c) are perspective views showing still other modified examples of the terminal plate. Figure 4 (a) (b) (
In C), the terminal board 11 has a divided part 11c made of an insulating material in the middle part, and has a pair of terminal parts 11a,
11b in an insulated state. Note that the terminal portions 11a and 11b correspond to the terminal plates 8a8b in FIGS. 1 to 3 above.

上記構成の端子板11を第1図に示す積層体5の上下何
れかの端面に固着し、端子部11 a 、 11 bを
各々外部電極3a、3bと電気的に接続し、係止部9に
リード線6を固着すれば、前記第1図におけるものと同
様に作動させることができ1作用もまた同様のものを期
待できる。
The terminal board 11 having the above structure is fixed to either the upper or lower end surface of the laminate 5 shown in FIG. If the lead wire 6 is fixed to the terminal, it can be operated in the same manner as that shown in FIG. 1, and the same effect can be expected.

第5図(a)(b)は各々端子板のまた更に池の変形例
を示す断面図であり、同一部分は前記第4図(a)(b
)(C)と同一の参照符号で示す、まず第5図(a)に
示すものは絶縁材料からなる分割部11cの表裏両面に
端子部11a、11bを貼着したものである。次に第5
図Φ)に示すものは1分割部11cの表裏両面に導電材
料の薄膜からなる端子部11a、llbを固着したもの
である。このような薄膜からなる端子部11a、llb
を形成する手段としては、蒸着、スバンタ、メツキ、ペ
ースト塗布等の手段を適用することができる。なお端子
部11a、llbと分割部11cとの熱膨張係数を近似
させるため1分割部11cを例えばPZT、ZrOx 
、Alz03等の絶縁材料で形成することが好ましい。
FIGS. 5(a) and 5(b) are sectional views showing modified examples of the terminal plate and the pond, respectively, and the same parts are shown in FIGS. 4(a) and 5(b).
) The one shown in FIG. 5(a), which is designated by the same reference numeral as (C), has terminal portions 11a and 11b adhered to both the front and back surfaces of a divided portion 11c made of an insulating material. Next, the fifth
The one shown in Fig. Φ) has terminal parts 11a and 11b made of a thin film of a conductive material fixed to both the front and back surfaces of one divided part 11c. Terminal parts 11a and llb made of such thin films
As a means for forming this, methods such as vapor deposition, svantalization, plating, and paste application can be applied. Note that in order to approximate the thermal expansion coefficients of the terminal portions 11a and 11b and the divided portion 11c, one divided portion 11c is made of, for example, PZT or ZrOx.
, Alz03, or other insulating material.

上記構成による作用は前記第4図(a)[有])(C)
に示すものと同様である。
The effect of the above configuration is as shown in Fig. 4 (a) [Yes]) (C).
It is similar to that shown in .

第6図は本発明の他の実施例を模式的に示す斜視図であ
り、同一部分は前記第1図と同一の参照符号にて示す。
FIG. 6 is a perspective view schematically showing another embodiment of the present invention, and the same parts are designated by the same reference numerals as in FIG. 1.

第6図において、5aは複積層体であり、前記第1図に
示す積層体5(以下単位積層体と記述する)を4個積層
して形成する。なお端子板8a、8bは上記単位積層体
5.5間に挟着すると共に、外部電極3a、3bと各々
電気的に接続する。
In FIG. 6, 5a is a multi-laminate, which is formed by laminating four laminates 5 (hereinafter referred to as unit laminates) shown in FIG. 1. Note that the terminal plates 8a and 8b are sandwiched between the unit laminates 5.5 and electrically connected to the external electrodes 3a and 3b, respectively.

上記の構成により、リード線6.6間に電圧を印加する
ことにより、複積層体5aを積層方向に伸縮駆動するこ
とができる。この場合端子板8a8bは単位積層体5,
5間に例えば接着剤を介して一体に挟着しであると共に
、リード線6との接合部は前記第1図に示すものと同様
にはんだ肉盛(図示せず)可能であり、接合強度を大に
形成することができる。従って前記第1図におけるもの
と同様にリード線6に不測の張力が作用しても充分に対
抗することができ、リード線6および/または外部電極
3a、3bが剥離する事故を回避することができる。
With the above configuration, by applying a voltage between the lead wires 6 and 6, the multi-layer body 5a can be driven to expand and contract in the stacking direction. In this case, the terminal plate 8a8b is the unit laminate 5,
For example, the joints with the lead wires 6 can be overlaid with solder (not shown) in the same manner as shown in FIG. can be formed into a large size. Therefore, even if an unexpected tension is applied to the lead wire 6, as in the case shown in FIG. can.

本実施例においては、全面電極型の例について記述した
が、交互電極型のものについても当然に適用可能である
。また薄板および内部電極の平面投影形状は矩形以外に
、正方形1円形、楕円形その他の幾何学的形状とするこ
とができる。なお上記の実施例においては、内部電極お
よび外部電極の形成手段としてスクリーン印刷法を使用
した例について記述したが、これに限定せず、メツキ蒸
着、塗布等の他の手段によっても作用は同一である。更
に前記の実施例においては、電気機械変換材料が圧電材
料である場合について記述したが。
In this embodiment, an example of a full-surface electrode type has been described, but it is naturally applicable to an alternating electrode type. In addition, the planar projection shape of the thin plate and the internal electrodes may be a square, a circle, an ellipse, or other geometric shapes other than a rectangle. In the above embodiment, an example was described in which screen printing was used as a means of forming the internal electrodes and external electrodes, but the method is not limited to this, and the same effect can be achieved by other methods such as plating vapor deposition or coating. be. Furthermore, in the embodiments described above, the electromechanical conversion material is a piezoelectric material.

キュリー温度が室温より低いため1分極の必要がなく、
かつ変位量が大であると共にヒステリシスが少ない等の
特徴を有する電歪材料についても。
Since the Curie temperature is lower than room temperature, there is no need for single polarization.
Also regarding electrostrictive materials which have characteristics such as large displacement and small hysteresis.

前記と全く同様な作用を期待できる。このような電歪材
料としては9例えば。
Exactly the same effect as above can be expected. Examples of such electrostrictive materials include 9.

CPbo、q+h  Lao、o*a>CZro、bs
  Tio、5s)o、、tq  Os  +(Pbo
、ss Sro、+5)(Zro、s+ Tto、3n
 Zno、owsNi@、。375 Nha、 +11
)03゜(Pbo、ss Sro、+5)(Zro、s
o Tio、+o Zno、osNio、。5NbO,
l。)0; 等を使用することができる。なお第6図に示すような複
積層体に対しても、第4図(alΦ)(C)および第5
図(a)[有])に示す端子板を適用できることは当然
である。
CPbo, q+h Lao, o*a>CZro, bs
Tio, 5s) o,, tq Os + (Pbo
, ss Sro, +5) (Zro, s+ Tto, 3n
Zno,owsNi@,. 375 Nha, +11
) 03° (Pbo, ss Sro, +5) (Zro, s
o Tio, +o Zno, osNio,. 5NbO,
l. )0; etc. can be used. In addition, for the multi-layered body as shown in FIG. 6, FIG.
It goes without saying that the terminal board shown in Figure (a) can be applied.

(発明の効果〕 本発明は以上記述のような構成および作用であるから、
下記の効果を奏し得る。
(Effect of the invention) Since the present invention has the structure and operation as described above,
The following effects can be achieved.

(1)  リード部材固着のためのスペースが充分に確
保されると共に、外部電極のはんだ食われ等の事故を皆
無とすることができる。
(1) Sufficient space for fixing the lead member can be secured, and accidents such as solder erosion of external electrodes can be completely eliminated.

(2)端子板とリード部材との接合が確実であるため1
 リード部材の剥離、断線を回避できる。
(2) Because the connection between the terminal board and the lead member is reliable, 1
Peeling of the lead member and disconnection can be avoided.

(3)  リード部材に不測の張力が作用しても、端子
板自体、およびリード部材との接続部の機械的強度が充
分に大であるため、外部電極の剥離事故を皆無とするこ
とができる。
(3) Even if unexpected tension is applied to the lead member, the mechanical strength of the terminal board itself and the connection part with the lead member is sufficiently high, so there will be no accident of peeling of the external electrode. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例を模式的に示す側面図。 第2図(a)は第1図における端子板を示す斜視図。 第2図(b)(C)は各々第2図(a)における端子板
の変形例を示す斜視図、第3図(a)ないしく口)は夫
々第2図(a)における端子板の他の変形例を示す平面
図、第4図(a) (bl (C)は夫々端子板の更に
他の変形例を示す斜視図、第5図(a)(b)は各々端
子板のまた更に他の変形例を示す断面図、第6図は本発
明の他の実施例を模式的に示す斜視図、第7図ないし第
9図は夫々従来の積層型変位素子の例を模式的に示す側
面図である。 3a、3b:外部電極、6:リード線、8a8b、11
:端子板、9:係止部。 第 7(21 晃 O
FIG. 1 is a side view schematically showing an embodiment of the present invention. FIG. 2(a) is a perspective view showing the terminal plate in FIG. 1. 2(b) and 2(C) are perspective views showing modified examples of the terminal board in FIG. 2(a), and FIG. 4(a) (bl) (C) are perspective views showing still other modified examples of the terminal board, and FIGS. 5(a) and 5(b) are plan views showing other modified examples of the terminal board. Furthermore, FIG. 6 is a cross-sectional view showing another modification, FIG. 6 is a perspective view schematically showing another embodiment of the present invention, and FIGS. 7 to 9 each schematically show an example of a conventional laminated displacement element. 3a, 3b: external electrodes, 6: lead wires, 8a, 8b, 11
: Terminal board, 9: Locking part. 7th (21 Akira O

Claims (8)

【特許請求の範囲】[Claims] (1)略同一の平面輪郭および接触面積に形成した電気
機械変換材料からなる薄板と導電材料からなる内部電極
とを各々複数個交互に積層して積層体を形成し,この積
層体の側面に前記内部電極と一層おきに接続すべき1対
の外部電極を設けてなる積層型変位素子において。 積層体の側面に突出し,かつリード部材と電気的に接続
可能に形成した係止部を有する1対の端子板を電気的絶
縁状態に介装させると共に,外部電極と端子板とを電気
的に接続したことを特徴とする積層型変位素子。
(1) A laminate is formed by alternately stacking a plurality of thin plates made of an electromechanical transducer material and internal electrodes made of a conductive material, which are formed to have approximately the same planar contour and contact area, and the side surfaces of this laminate are In a laminated displacement element comprising a pair of external electrodes to be connected to the internal electrodes every other layer. A pair of terminal boards having a locking part that protrudes from the side surface of the laminate and is formed to be electrically connectable to the lead member are interposed in an electrically insulated state, and the external electrode and the terminal board are electrically connected. A laminated displacement element characterized by being connected.
(2)端子板を金属材料によって形成した請求項(1)
記載の積層型変位素子。
(2) Claim (1) in which the terminal plate is formed of a metal material
The laminated displacement element described above.
(3)絶縁材料からなる基板の表面に各々導電材料から
なる被膜を電気的絶縁状態に固着して1対の端子板を形
成した請求項(1)記載の積層型変位素子。
(3) A laminated displacement element according to claim (1), wherein a pair of terminal plates are formed by fixing a coating made of a conductive material to the surface of a substrate made of an insulating material in an electrically insulating state.
(4)端子板の中間部に絶縁材料からなる分割部を設け
た請求項(2)記載の積層型変位素子。
(4) The laminated displacement element according to claim (2), wherein a dividing portion made of an insulating material is provided in the intermediate portion of the terminal plate.
(5)略同一の平面輪郭および接触面積に形成した電気
機械変換材料からなる薄板と導電材料からなる内部電極
とを各々複数個交互に積層して形成した単位積層体を更
に複数個積層して複積層体を形成し,この複積層体の側
面に前記内部電極と一層おきに接続すべき1対の外部電
極を設けてなる積層型変位素子において, 単位積層体間に,この単位積層体の側面に突出し,かつ
リード部材と電気的に接続可能に形成した係止部を有す
る1対の端子板を電気的絶縁状態に介装させると共に,
外部電極と端子板とを電気的に接続したことを特徴とす
る積層型変位素子。
(5) Further laminating a plurality of unit laminates formed by alternately laminating a plurality of thin plates made of an electromechanical conversion material and internal electrodes made of a conductive material, which are formed to have substantially the same planar outline and contact area. In a laminated displacement element formed of a multi-layered body and provided with a pair of external electrodes to be connected to the internal electrodes every other layer on the side surfaces of this multi-layered body, a portion of the unit laminated body is provided between the unit laminated bodies. A pair of terminal plates having locking portions protruding from the sides and formed so as to be electrically connectable to the lead member are interposed in an electrically insulated state, and
A laminated displacement element characterized by electrically connecting an external electrode and a terminal plate.
(6)端子板を金属材料によって形成した請求項(5)
記載の積層型変位素子。
(6) Claim (5) in which the terminal plate is formed of a metal material.
The laminated displacement element described above.
(7)絶縁材料からなる基板の表面に各々導電材料から
なる被膜を電気的絶縁状態に固着して1対の端子板を形
成した請求項(5)記載の積層型変位素子。
(7) The laminated displacement element according to claim (5), wherein a pair of terminal plates are formed by fixing a coating made of a conductive material to the surface of a substrate made of an insulating material in an electrically insulating state.
(8)端子板の中間部に絶縁材料からなる分割部を設け
た請求項(5)記載の積層型変位素子。
(8) The laminated displacement element according to claim (5), wherein a dividing portion made of an insulating material is provided in the intermediate portion of the terminal plate.
JP1295337A 1989-11-14 1989-11-14 Laminated displacement element Pending JPH03155179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1295337A JPH03155179A (en) 1989-11-14 1989-11-14 Laminated displacement element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1295337A JPH03155179A (en) 1989-11-14 1989-11-14 Laminated displacement element

Publications (1)

Publication Number Publication Date
JPH03155179A true JPH03155179A (en) 1991-07-03

Family

ID=17819309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1295337A Pending JPH03155179A (en) 1989-11-14 1989-11-14 Laminated displacement element

Country Status (1)

Country Link
JP (1) JPH03155179A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013211419A (en) * 2012-03-30 2013-10-10 Kyocera Corp Lamination type piezoelectric element and piezoelectric actuator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013211419A (en) * 2012-03-30 2013-10-10 Kyocera Corp Lamination type piezoelectric element and piezoelectric actuator

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