JPH0315507A - Protecting method for mold - Google Patents
Protecting method for moldInfo
- Publication number
- JPH0315507A JPH0315507A JP14952389A JP14952389A JPH0315507A JP H0315507 A JPH0315507 A JP H0315507A JP 14952389 A JP14952389 A JP 14952389A JP 14952389 A JP14952389 A JP 14952389A JP H0315507 A JPH0315507 A JP H0315507A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- protection
- setting device
- mold closing
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 24
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 230000005856 abnormality Effects 0.000 claims description 12
- 230000007257 malfunction Effects 0.000 claims description 5
- 230000002159 abnormal effect Effects 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は金型の保護方法に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for protecting a mold.
（従来技′＃Ｉ）
金型の保護方法として、低い型締力（以下第１型締とい
う）により金型閉位置を検出し、次に正規型締力（以下
第２型締という）で型締めを行う。(Conventional technique '#I) As a mold protection method, the mold closing position is detected using a low mold clamping force (hereinafter referred to as the first mold clamping), and then the mold closing position is detected with a normal mold clamping force (hereinafter referred to as the second mold clamping). Perform mold clamping.
この動きの中で金型面に異物がある場合には、この異物
の厚さのため、金型閉位置の検出が出来ず、次の第２型
締に進むことができない。従って第｛型締を開始してか
ら、あらかじめ設定した規定時間内に金型閉位置に至ら
ない場合を異常とし、型締を中止する等の保護方法を行
っていた。この作動に於では金型閉位置の設定がむずか
しく、温度による金型の膨張等があるので、厳密な設定
をすると、異常が無いのに保護装置が作動するという問
題が生ずる。If there is a foreign object on the mold surface during this movement, the mold closing position cannot be detected due to the thickness of this foreign object, and it is impossible to proceed to the next second mold clamping. Therefore, if the mold does not reach the closed position within a preset time after starting mold clamping, it is regarded as an abnormality, and protective measures such as stopping mold clamping have been taken. In this operation, it is difficult to set the mold closing position, and the mold expands due to temperature, so if the settings are made strictly, a problem arises in that the protection device is activated even though there is no abnormality.
（９！明により解決しようとする課題）上記従来の金型
の保護方法をさらに改良し、より精度の高い検出を可能
にし、しかも異常がないのに保護装置が作動するという
ような問題の生じない金型の保護方法を提供することを
目的とする。(9! Problems to be solved by Akira) The conventional mold protection method described above has been further improved to enable more accurate detection, and to solve the problem of the protection device operating even when there is no abnormality. The purpose is to provide a method of protecting molds that is not available.
（発明による課題の解決手段）
型閉ストロー゛ク検出による金型の保護方法において、
通常の金型保護限界値設定器の外に、異物検出サイズの
理論値設定器を設け、通常の金型保護限界値設定器に設
定された金型保護設定値以下の型閉スＩ一口一クの場合
は、前サイクル迄の型閉ストローク位置演算値と，設定
器による演算金型保護位置を作り、この値を基準として
異常正常の判定を行い、毎サイクルの型閉位置検出は型
閉ストローク位置検出、エンコーダの信号の変化が零ま
たは十分小さくなった時点の型閉ス１・ロー夕とした。(Means for solving problems by invention) In a mold protection method by detecting mold closing stroke,
In addition to the normal mold protection limit value setting device, a theoretical value setting device for the foreign object detection size is installed, and each mold closing step is less than the mold protection setting value set in the normal mold protection limit value setting device. In the case of a mold closing stroke position calculated up to the previous cycle and the calculated mold protection position by the setting device, abnormality and normality are judged based on these values, and the mold closing position detection is performed in each cycle. The stroke position was detected and the mold was closed when the change in the encoder signal became zero or sufficiently small.
又、型閉ストローク位置検出による金型保護装置におい
て、通常の金型保護最大位置設定器の外に金型保護最小
位置設定器を設け、金型保護最大位Ｗ設定器と金型保護
最小位置設定器との間の位置の場合、演算により判定基
準を算出する事により、通常作動において誤作動を無く
しながら、厳密な金型保護最小位置設定に移行する演算
を行ない、最終的に金型保護最小位置設定器の判定に移
行するようにし、毎サイクルの型閉位置を型閉エンコー
ダ信号の変化が十分小さくなった位置とするようにした
。In addition, in a mold protection device that detects the mold closing stroke position, a mold protection minimum position setting device is provided in addition to the normal mold protection maximum position setting device, and a mold protection maximum position W setting device and a mold protection minimum position setting device are installed. In the case of the position between the setter and the setting device, by calculating the judgment criteria by calculation, it is possible to eliminate malfunctions during normal operation, while performing calculations to move to the strict mold protection minimum position setting, and finally mold protection The process is shifted to the determination of the minimum position setter, and the mold closing position of each cycle is set to the position where the change in the mold closing encoder signal becomes sufficiently small.
（第１実施例）
第１図は本方法を実施する型締装置であって、固定プラ
テン１、可動プラテン２にそれぞれ金型５と６を取付け
第１型締を行う。固定側金型５と可動側金型６とが正規
に閉じられた点を型締ストローク零位置とし、型締ス１
−ローク位置検出エンコーダ３の信号をｉｌｌする。(First Embodiment) FIG. 1 shows a mold clamping device for implementing the present method, in which molds 5 and 6 are attached to a fixed platen 1 and a movable platen 2, respectively, and a first mold clamping operation is performed. The point at which the stationary mold 5 and the movable mold 6 are properly closed is defined as the mold clamping stroke zero position, and the mold clamping stroke 1
- illuminating the signal of the low position detection encoder 3;
３
上記で調整した零位置を金型保護作動の設定位置とした
場合は、金型の温度膨張等による厚みの変化で誤作動す
るので、通常の金型保護ストロークを金型保護限界値設
定器８にセッ１・する。この値は通常０ ． ３ ｍ＋
＋程度である。3 If the zero position adjusted above is used as the setting position for the mold protection operation, malfunction will occur due to changes in the thickness of the mold due to temperature expansion, etc., so the normal mold protection stroke should be set to the mold protection limit value setting device. Set 1 at 8. This value is usually 0. 3 m+
It is about +.
第１型締を行い、金型保護限界値設定器８の設定位置ま
で至らない場合は異常とし、型閉動作を停止する等の保
護処理を行う。設定位置を通過した場合は、制御用マイ
コン７に型閉ストローク位置を記憶し、金型保護演算値
との大小比較を行い、異常・正常の判定と処理を行う（
下図参照）。If the first mold clamping is performed and the setting position of the mold protection limit value setter 8 is not reached, it is determined to be abnormal and protective processing such as stopping the mold closing operation is performed. If the set position is passed, the mold closing stroke position is stored in the control microcomputer 7, and compared with the mold protection calculation value, and abnormality/normality is determined and processed (
(See figure below).
０
演算値により判定
金型保護演算値としては、毎回の型閉ストローク位置を
検出し、前サイクル迄の型閉ストローク位置の正常な５
サイクル程度の型閉ストロークの平均＋０．０５＋ｎｍ
等を使用する。；： （１） ＋０．０５ｍｎなる値を
異物検出の理論的大きさとし理論値設定器９に４−
設定する。0 Judgment based on calculated values Mold protection Calculated values are determined by detecting the mold closing stroke position each time and determining the normal 5 mold closing stroke positions up to the previous cycle.
Average mold closing stroke of cycle +0.05+nm
etc. ;: (1) Set the value +0.05 mn as the theoretical size for foreign object detection in the theoretical value setter 9.
毎回の型閉ストローク位置の検出は、第１型締工程にお
いて、型閉ストローク位置検出エンコダの信号の変化が
０または十分小さくなった時点の位置とする。The mold closing stroke position is detected each time at the time when the change in the signal of the mold closing stroke position detection encoder becomes 0 or sufficiently small in the first mold clamping process.
（作用）
ｌ）固定プラテン１、可動プラテン２に金型５，６を取
付け、第１型締を行う。(Function) l) Attach the molds 5 and 6 to the fixed platen 1 and the movable platen 2, and perform the first mold clamping.
２）型閉ストロークを型閉ストローク位置検出エンコー
ダ３により検出し、制御用マイコンマに入力される。2) The mold closing stroke is detected by the mold closing stroke position detection encoder 3 and input to the control microcomma.
３）金型５，６が密着（全開）した位置を型閉ストロー
ク零位置として使用の初回に調整する。3) The position where the molds 5 and 6 are in close contact (fully open) is adjusted as the mold closing stroke zero position at the first time of use.
４）金型保護限界値設定器８に限界値をセットする・・
・通常０．３ｍｍ。4) Set the limit value in the mold protection limit value setter 8...
・Normally 0.3mm.
５）異物検出サイズの理論値設定器９に理論値（ｉｌｉ
Ｉ常０．０５ｍｎ）をセットする。5) Set the theoretical value (ili
I usually set 0.05mm).
６）さて第１型締を行い、金型が停止した位置が、
ａ）金型保護限界値を超えている時は、金型保護作動を
行う。6) Now, perform the first mold clamping, and if the position where the mold stopped exceeds the mold protection limit value, perform the mold protection operation.
ｂ）金型保護限界値以下の時は、金型保護演算値との大
小判定を行い、演算値より大きい時は異常と判定し、型
締動作を停止する等の処理をする。b) When it is less than the mold protection limit value, it is determined whether it is larger or smaller than the mold protection calculation value, and if it is larger than the calculation value, it is determined that there is an abnormality, and processing such as stopping the mold clamping operation is performed.
演算値より小さい時は正常と判定し、第２型締エ程に移
行する。When it is smaller than the calculated value, it is determined to be normal and the process moves to the second mold clamping process.
Ｃ）金型保護演算値は一例として、前サイクル迄の（型
閉ストローク位置正常５サイクルの型閉ス！・ロークの
平均値）＋（異物検出サイズの理論値）とする。C) The mold protection calculation value is, for example, (average value of the mold closing stroke position of 5 cycles with normal mold closing stroke position) + (theoretical value of foreign object detection size) up to the previous cycle.
７）なお第１型締による型閉ストローク位置の検出は、
第１型締工程中で型閉ストローク位置検出エンコーダ信
号の変化が零または十分小さくなった時点の型閉ストロ
ークとする。7) The detection of the mold closing stroke position by the first mold clamp is as follows:
The mold closing stroke is defined as the time when the change in the mold closing stroke position detection encoder signal becomes zero or sufficiently small during the first mold clamping process.
（第２実施例）
第２図の型締装置において、固定プラテン１と可動プラ
テン２に金型を取付け第１型締を行い、固定側金型５と
可動側金型６とが正規に閉じられた点を型閉ストローク
零位置として型閉ストロク位置検出エンコーダ３の位置
信号を調整する。(Second Embodiment) In the mold clamping device shown in Fig. 2, the molds are mounted on the fixed platen 1 and the movable platen 2, and the first mold clamping is performed, and the fixed mold 5 and the movable mold 6 are properly closed. The position signal of the mold-closing stroke position detection encoder 3 is adjusted by setting the point at which the mold-closing stroke is zero.
上記で調整した零位置を仮に金型保護作動の設定位置と
すると、金型の温度膨張による厚みの変化で誤作動する
ので、金型保護ス１〜ロークを金型保護最大位置設定器
８′にセッ１・する。この値は通常０．３ｎｎ程度であ
る。If the zero position adjusted above is used as the setting position for the mold protection operation, it will malfunction due to changes in the thickness of the mold due to temperature expansion, so the mold protection maximum position setter 8' Set 1. This value is usually about 0.3 nn.
第１型締を行い、金型保護最大位置設定器８′の設定よ
り大きいストローク迄しか閉じなかった時は、異常とし
て金型保護作動を行う。When the first mold clamping is performed and the mold is closed only to a stroke larger than the setting of the mold protection maximum position setting device 8', the mold protection operation is performed as an abnormality.
金型保護最大位置設定器８′以外に、金型保護最小位置
設定器９′を設け、これに期待する金型保護の最小位置
をセットする・・・この値はＯ ． ｌ ｎｏ程度であ
る。この金型保護最小設定器９′のセット位置では、金
型温度、プラテン温度等により位置が変化し、通常の判
定では正常時でも異常判定が出てしまうため、毎回の型
閉ストローク位置を検出し、前サイクルまでの正常な５
サイクル程度の型閉ス１〜ロークの平均により、金型保
護判定位置を演算し、その値を基に異常判定を行う（下
図参照）。In addition to the mold protection maximum position setting device 8', a mold protection minimum position setting device 9' is provided, and the expected minimum mold protection position is set therein...This value is O. It is about l no. The set position of this mold protection minimum setting device 9' changes depending on the mold temperature, platen temperature, etc., and an abnormality determination will be made even in normal conditions, so the mold closing stroke position is detected every time. and the normal 5 up to the previous cycle.
The mold protection judgment position is calculated based on the average of the mold closing speeds 1 to 30 times over the cycle, and an abnormality judgment is made based on that value (see the figure below).
７
演算値によりその都度判定
毎回の型閉ストローク位置の検出は、第ｌ型締工程にお
いて、型締ストローク位置検出エンコダ信号の変化が無
くなった時点、実用上ではこの信号の変化が十分小さく
なった時点の位置とする。7. Each time the mold closing stroke position is determined based on the calculated value, the detection of the mold closing stroke position is carried out in the first mold clamping process, when there is no change in the mold clamping stroke position detection encoder signal, the change in this signal has become sufficiently small for practical use. Let it be the position at the time.
（作用）
１）固定プラテン１、可動プラテン２に金型５，６を取
付け、第１型締を行う。(Function) 1) Attach the molds 5 and 6 to the fixed platen 1 and the movable platen 2, and perform the first mold clamping.
２）型閉ストロークはエンコーダ３ばより検出し、制御
用マイコン７に入力される。2) The mold closing stroke is detected by the encoder 3 and input to the control microcomputer 7.
３）金型５，６が密着した位置を型閉ストロク零位置と
して調整する。3) Adjust the position where the molds 5 and 6 are in close contact as the mold closing stroke zero position.
４）金型保護最大位置設定器８′に限界値（通常０．３
ｍｍ）をセットする。4) Set the limit value (usually 0.3
mm).
５）金型保護最小位置設定器９′に期待値（通常０ ．
１ ｍｍ ）をセットする。5) Set the expected value (usually 0.
1 mm).
６）第１型締を行ない金型が閉した位置が、８
ａ）最大位置設定を超えている時は金型保護作動を行う
。6) When the position where the mold is closed after performing the first mold clamping exceeds the maximum position setting in 8 a), perform the mold protection operation.
ｂ）最小位置設定以下の時は第２型締工程に移り、正規
型締力を発生させる。b) When the position is below the minimum position setting, the process moves to the second mold clamping process and the normal mold clamping force is generated.
Ｃ）最大位置設定以下かつ最小位置設定以上の範囲では
毎回の型閉ストローク位置を検出し、位置の統計的演算
結果を基に異常・正常の判定を行ない、異常の時は型閉
動作を修正する等の保護作動を行う。正ク；（゛の時は
第２型締工程に進む。C) In the range below the maximum position setting and above the minimum position setting, the mold closing stroke position is detected every time, abnormality/normality is determined based on the statistical calculation results of the position, and the mold closing operation is corrected in case of abnormality. Perform protective actions such as Correct; (If ゛, proceed to the second mold clamping process.
７）前記Ｃ）の演算は種々考えられるが、一例として前
サイクルまでの正常なサイクルの型閉ス１〜ローク位置
の平均値＋〇．０５ｎ＋ｍとする。7) Various calculations can be considered for the above C), but one example is the average value of the mold closing position 1 to the mold closing position of the normal cycle up to the previous cycle + 〇. 05n+m.
８）第ｌ型締による型閉位置の検出は、第↓型締工程中
で型締位置信号の変化がＯまたは十分小さくなった時点
とする（又は第■型締工程に入ってからある設定時間経
過した時の型閉位置を採用する）。8) The mold closing position by the first mold clamping is detected when the change in the mold clamping position signal becomes O or sufficiently small during the ↓ mold clamping process (or when a certain setting is detected after entering the mold clamping process (Adopt the mold closing position when the time has elapsed).
（効果）
第１実施例の如く、従来は金型保護限界値設定９
器８に対する判定だけのため、金型の熱膨張の変化を見
込んだラフな値しか検出できなかった。これに対し演算
金型保護位置判定を追加することにより、金型の熱膨張
等による変化もその都度修正され、精度の高い検出が可
能となった。(Effects) As in the first embodiment, in the past, only the mold protection limit value setting device 8 was judged, and therefore only a rough value that took into account changes in the thermal expansion of the mold could be detected. On the other hand, by adding calculation mold protection position determination, changes due to thermal expansion of the mold can be corrected each time, making highly accurate detection possible.
又型締機構、金型機構のがた等があり、毎回の型閉位置
が微妙にばらつく場合も設定器９を使用することにより
正しく判定させることが可能となった・
さらに第２実施例のごとく最小位置設定器を設け、かつ
誤作動とならない様、最大設定位置と最小設定位置間は
演算処理により判定値を決めるので、金型の熱膨張等に
よる変化もその都度修正され、精度の高い検出が可能と
なった。In addition, even if there is play in the mold clamping mechanism or mold mechanism, and the mold closing position varies slightly each time, it is now possible to make an accurate determination by using the setting device 9. A minimum position setting device is provided, and in order to prevent malfunctions, the judgment value between the maximum setting position and minimum setting position is determined by calculation processing, so changes due to thermal expansion of the mold etc. are corrected each time, resulting in high accuracy. Detection is now possible.
第１図は本発明の第↓実施例に係る金型保護方法を実施
する装置を示す。
第２図は同じく第２実施例に゛係る金型保護方法を実施
する装置を示す。
図において；
固定プラテン ２ 可動プラテン
型閉ス１−ローク位置検出エンコーダ
型締シリンダ ５ 固定側金型
可動側金型 ７ 制御用マイコン金型保護限界値
設定器
金型保護最大位置設定器
異物検出サイズの理論値設定器
金型保護最小位置設定器
以」一FIG. 1 shows an apparatus for carrying out a mold protection method according to the second embodiment of the present invention. FIG. 2 also shows an apparatus for implementing the mold protection method according to the second embodiment. In the figure; Fixed platen 2 Movable platen Mold closing position 1-Low position detection encoder Mold clamping cylinder 5 Fixed side mold Movable side mold 7 Control microcomputer Mold protection limit value setter Mold protection maximum position setter Foreign object detection size Theoretical value setter Mold protection minimum position setter
Claims (2)
おいて、通常の金型保護限界値設定器（８）の外に、異
物検出サイズの理論値設定器（９）を設け、保護限界値
設定器（８）に設定された金型保護設定値以下の型閉ス
トロークの場合は、前サイクル迄の型閉ストローク位置
演算値と、設定器による演算金型保護位置を作り、この
値を基準として異常正常の判定を行い、毎サイクルの型
閉位置検出は型閉ストローク位置検出、エンコーダの信
号の変化が零または十分小さくなった時点の型閉ストロ
ークとしたことを特徴とする金型の保護方法。(1) In the mold protection method by detecting the mold closing stroke position, in addition to the normal mold protection limit value setting device (8), a theoretical value setting device (9) for foreign object detection size is provided to set the protection limit value. If the mold closing stroke is less than the mold protection setting value set in the setting device (8), create the mold closing stroke position calculation value up to the previous cycle and the mold protection position calculated by the setting device, and use this value as a reference. A mold protection method characterized in that abnormality and normality are determined, the mold closing position is detected in each cycle by mold closing stroke position detection, and the mold closing stroke is determined when the change in encoder signal becomes zero or sufficiently small. .
いて、通常の金型保護最大位置設定器の外に金型保護最
小位置設定器を設け、金型保護最大位置設定器と金型保
護最小位置設定器との間の位置の場合、演算により判定
基準を算出する事により、通常作動において誤作動を無
くしながら、厳密な金型保護最小位置設定に移行する演
算を行ない、最終的に金型保護最小位置設定器の判定に
移行するようにし、毎サイクルの型閉位置を型閉エンコ
ーダ信号の変化が十分小さくなった位置とすることを特
徴とする金型の保護方法。(2) In a mold protection device that detects the mold closing stroke position, a mold protection minimum position setting device is provided in addition to the normal mold protection maximum position setting device, and the mold protection maximum position setting device and the mold protection minimum position setting device are installed. In the case of the position between the setter and the setting device, by calculating the judgment criteria by calculation, it is possible to eliminate malfunctions during normal operation, while performing calculations to move to the strict mold protection minimum position setting, and finally mold protection A method for protecting a mold, characterized in that the process moves to a minimum position setter determination, and the mold closing position in each cycle is set to a position where a change in a mold closing encoder signal becomes sufficiently small.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14952389A JP2760575B2 (en) | 1989-06-14 | 1989-06-14 | Mold protection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14952389A JP2760575B2 (en) | 1989-06-14 | 1989-06-14 | Mold protection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0315507A true JPH0315507A (en) | 1991-01-23 |
| JP2760575B2 JP2760575B2 (en) | 1998-06-04 |
Family
ID=15476999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14952389A Expired - Lifetime JP2760575B2 (en) | 1989-06-14 | 1989-06-14 | Mold protection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2760575B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103770303A (en) * | 2012-10-24 | 2014-05-07 | 江苏新昌汽车部件有限公司 | Instrument desk injection mould limit protection device |
| CN106513628A (en) * | 2016-10-21 | 2017-03-22 | 张斌 | Floating type position detecting connecting device and die-casting machine |
| CN110625871A (en) * | 2018-06-21 | 2019-12-31 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| JP2020151738A (en) * | 2019-03-19 | 2020-09-24 | 宇部興産機械株式会社 | Method and device for detecting looseness of rack shaft for vertical injection |
-
1989
- 1989-06-14 JP JP14952389A patent/JP2760575B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103770303A (en) * | 2012-10-24 | 2014-05-07 | 江苏新昌汽车部件有限公司 | Instrument desk injection mould limit protection device |
| CN106513628A (en) * | 2016-10-21 | 2017-03-22 | 张斌 | Floating type position detecting connecting device and die-casting machine |
| CN106513628B (en) * | 2016-10-21 | 2019-04-05 | 张斌 | Floating type position detection attachment device and die casting machine |
| CN110625871A (en) * | 2018-06-21 | 2019-12-31 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| JP2020151738A (en) * | 2019-03-19 | 2020-09-24 | 宇部興産機械株式会社 | Method and device for detecting looseness of rack shaft for vertical injection |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2760575B2 (en) | 1998-06-04 |
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