JPH03151686A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH03151686A
JPH03151686A JP29158189A JP29158189A JPH03151686A JP H03151686 A JPH03151686 A JP H03151686A JP 29158189 A JP29158189 A JP 29158189A JP 29158189 A JP29158189 A JP 29158189A JP H03151686 A JPH03151686 A JP H03151686A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
height
type electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29158189A
Other languages
Japanese (ja)
Inventor
Atsushi Tachikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP29158189A priority Critical patent/JPH03151686A/en
Publication of JPH03151686A publication Critical patent/JPH03151686A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE: To realize high density mounting of a printed wiring board specially by providing a recessed part on the printed wiring board such that it is lower than the surface of the printed wiring board.
CONSTITUTION: A recessed part 5 is formed at a location where surface mount ing type electronic components 4 on a printed wiring board 1 are mounted. Then, the surface mounting type electronic components 4 are packaged so as to fit into the recessed part 5, reversed in their rear and surface, and a lead 3 and a wiring pattern 2 are brought into contact with each other for their positioning. When the surface mounting type electronic components 4 are mounted on the printed wiring board 1 in such a manner, a height (h) from the printed wiring board including the surface mounting type electronic components is the sum of the height D of the printed wiring board, the height A of the wiring pattern, and the height B of the lead, and hence the height C of the surface mounting type electronic component does not influence the height (h) from the printed wiring board including the surface mounting type electronic components. Hereby, mountging density of the printed wiring board can be improved.
COPYRIGHT: (C)1991,JPO&Japio
JP29158189A 1989-11-08 1989-11-08 Printed wiring board Pending JPH03151686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29158189A JPH03151686A (en) 1989-11-08 1989-11-08 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29158189A JPH03151686A (en) 1989-11-08 1989-11-08 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH03151686A true JPH03151686A (en) 1991-06-27

Family

ID=17770785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29158189A Pending JPH03151686A (en) 1989-11-08 1989-11-08 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH03151686A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710431A1 (en) * 1993-07-19 1996-05-08 Elonex Technologies, Inc. Space-saving memory module
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
JP2003151691A (en) * 2001-11-14 2003-05-23 Aisin Seiki Co Ltd Connecting structure of electronic component

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710431A1 (en) * 1993-07-19 1996-05-08 Elonex Technologies, Inc. Space-saving memory module
EP0710431A4 (en) * 1993-07-19 1997-05-02 Elonex Technologies Inc Space-saving memory module
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6828511B2 (en) 1994-03-11 2004-12-07 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
JP2003151691A (en) * 2001-11-14 2003-05-23 Aisin Seiki Co Ltd Connecting structure of electronic component

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