JPH0313773U - - Google Patents

Info

Publication number

JPH0313773U

JPH0313773U JP7360189U JP7360189U JPH0313773U JP H0313773 U JPH0313773 U JP H0313773U JP 7360189 U JP7360189 U JP 7360189U JP 7360189 U JP7360189 U JP 7360189U JP H0313773 U JPH0313773 U JP H0313773U

Authority

JP

Japan

Prior art keywords

substrates

metal plate

solder reflow

hybrid integrated

integrated circuit

Prior art date

1989-06-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 4
• 239000000758 substrate Substances 0.000 claims 5

Cited By (2)