JPH0313738U - - Google Patents
Info
- Publication number
- JPH0313738U JPH0313738U JP1989073521U JP7352189U JPH0313738U JP H0313738 U JPH0313738 U JP H0313738U JP 1989073521 U JP1989073521 U JP 1989073521U JP 7352189 U JP7352189 U JP 7352189U JP H0313738 U JPH0313738 U JP H0313738U
- Authority
- JP
- Japan
- Prior art keywords
- lead bonding
- carrier tape
- chip
- bonding part
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073521U JPH0313738U (https=) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073521U JPH0313738U (https=) | 1989-06-26 | 1989-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313738U true JPH0313738U (https=) | 1991-02-12 |
Family
ID=31612404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989073521U Pending JPH0313738U (https=) | 1989-06-26 | 1989-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313738U (https=) |
-
1989
- 1989-06-26 JP JP1989073521U patent/JPH0313738U/ja active Pending