JPH03128950U - - Google Patents
Info
- Publication number
- JPH03128950U JPH03128950U JP3728490U JP3728490U JPH03128950U JP H03128950 U JPH03128950 U JP H03128950U JP 3728490 U JP3728490 U JP 3728490U JP 3728490 U JP3728490 U JP 3728490U JP H03128950 U JPH03128950 U JP H03128950U
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- metal layer
- material molded
- inorganic material
- contact point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一例を示す一部縦断面図、第
２図は本考案の他の一例を示す一部縦断面図、第
３図は従来例の一部縦断面図である。
１……無機材料成形体、２……金属層、３……
ポーラス層、４……リード線、５……接点。
FIG. 1 is a partial vertical cross-sectional view showing one example of the present invention, FIG. 2 is a partial vertical cross-sectional view showing another example of the present invention, and FIG. 3 is a partial vertical cross-sectional view of a conventional example. 1... Inorganic material molded body, 2... Metal layer, 3...
Porous layer, 4...Lead wire, 5...Contact point.
Claims (1)
て金属層を設け、これにリード線の接点を設けた
ことを特徴とする無機材料成形体におけるリード
線の接続構造。 A connection structure for lead wires in an inorganic material molded body, characterized in that a metal layer is provided on the inorganic material molded body via an inorganic porous layer, and a contact point for the lead wire is provided on the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3728490U JPH03128950U (en) | 1990-04-09 | 1990-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3728490U JPH03128950U (en) | 1990-04-09 | 1990-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128950U true JPH03128950U (en) | 1991-12-25 |
Family
ID=31544253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3728490U Pending JPH03128950U (en) | 1990-04-09 | 1990-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128950U (en) |
-
1990
- 1990-04-09 JP JP3728490U patent/JPH03128950U/ja active Pending