JPH03126072U - - Google Patents

Info

Publication number

JPH03126072U

JPH03126072U JP3594790U JP3594790U JPH03126072U JP H03126072 U JPH03126072 U JP H03126072U JP 3594790 U JP3594790 U JP 3594790U JP 3594790 U JP3594790 U JP 3594790U JP H03126072 U JPH03126072 U JP H03126072U

Authority

JP

Japan

Prior art keywords

rigid

wiring boards

wiring board

flexible composite

rigid wiring

Prior art date

1990-04-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002131 composite material Substances 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 238000007747 plating Methods 0.000 description 1

Cited By (1)