JPH03126059U - - Google Patents
Info
- Publication number
- JPH03126059U JPH03126059U JP3529590U JP3529590U JPH03126059U JP H03126059 U JPH03126059 U JP H03126059U JP 3529590 U JP3529590 U JP 3529590U JP 3529590 U JP3529590 U JP 3529590U JP H03126059 U JPH03126059 U JP H03126059U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal container
- sealed
- hybrid
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035295U JPH085563Y2 (ja) | 1990-03-31 | 1990-03-31 | 高電力ハイブリッドｉｃ用金属パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035295U JPH085563Y2 (ja) | 1990-03-31 | 1990-03-31 | 高電力ハイブリッドｉｃ用金属パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126059U true JPH03126059U (OSRAM) | 1991-12-19 |
| JPH085563Y2 JPH085563Y2 (ja) | 1996-02-14 |
Family
ID=31540522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990035295U Expired - Fee Related JPH085563Y2 (ja) | 1990-03-31 | 1990-03-31 | 高電力ハイブリッドｉｃ用金属パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085563Y2 (OSRAM) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242653A (ja) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | リ−ドフレ−ム用複合材 |
| JPS62217643A (ja) * | 1986-03-18 | 1987-09-25 | Kyocera Corp | 混成集積回路素子収納用パツケ−ジ |
-
1990
- 1990-03-31 JP JP1990035295U patent/JPH085563Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242653A (ja) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | リ−ドフレ−ム用複合材 |
| JPS62217643A (ja) * | 1986-03-18 | 1987-09-25 | Kyocera Corp | 混成集積回路素子収納用パツケ−ジ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085563Y2 (ja) | 1996-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |