JPH03124640U - - Google Patents
Info
- Publication number
- JPH03124640U JPH03124640U JP3305590U JP3305590U JPH03124640U JP H03124640 U JPH03124640 U JP H03124640U JP 3305590 U JP3305590 U JP 3305590U JP 3305590 U JP3305590 U JP 3305590U JP H03124640 U JPH03124640 U JP H03124640U
- Authority
- JP
- Japan
- Prior art keywords
- collet
- utility
- scope
- outer periphery
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3305590U JPH03124640U (US20020051482A1-20020502-M00012.png) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3305590U JPH03124640U (US20020051482A1-20020502-M00012.png) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124640U true JPH03124640U (US20020051482A1-20020502-M00012.png) | 1991-12-17 |
Family
ID=31536414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3305590U Pending JPH03124640U (US20020051482A1-20020502-M00012.png) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124640U (US20020051482A1-20020502-M00012.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010248A (US20020051482A1-20020502-M00012.png) * | 1973-06-01 | 1975-02-01 |
-
1990
- 1990-03-29 JP JP3305590U patent/JPH03124640U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010248A (US20020051482A1-20020502-M00012.png) * | 1973-06-01 | 1975-02-01 |
