JPH0312450U - - Google Patents
Info
- Publication number
- JPH0312450U JPH0312450U JP7173189U JP7173189U JPH0312450U JP H0312450 U JPH0312450 U JP H0312450U JP 7173189 U JP7173189 U JP 7173189U JP 7173189 U JP7173189 U JP 7173189U JP H0312450 U JPH0312450 U JP H0312450U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- electrode
- contact hole
- resin film
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7173189U JPH0312450U (US06826419-20041130-M00005.png) | 1989-06-21 | 1989-06-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7173189U JPH0312450U (US06826419-20041130-M00005.png) | 1989-06-21 | 1989-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0312450U true JPH0312450U (US06826419-20041130-M00005.png) | 1991-02-07 |
Family
ID=31609028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7173189U Pending JPH0312450U (US06826419-20041130-M00005.png) | 1989-06-21 | 1989-06-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0312450U (US06826419-20041130-M00005.png) |
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1989
- 1989-06-21 JP JP7173189U patent/JPH0312450U/ja active Pending