JPH03122550U - - Google Patents

Info

Publication number

JPH03122550U

JPH03122550U JP3173490U JP3173490U JPH03122550U JP H03122550 U JPH03122550 U JP H03122550U JP 3173490 U JP3173490 U JP 3173490U JP 3173490 U JP3173490 U JP 3173490U JP H03122550 U JPH03122550 U JP H03122550U

Authority

JP

Japan

Prior art keywords

aluminum wiring

case

heat dissipation

insulating substrate

glued

Prior art date

1990-03-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
• 229910052782 aluminium Inorganic materials 0.000 claims 3
• 230000017525 heat dissipation Effects 0.000 claims 2
• 239000000758 substrate Substances 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1
• 238000000605 extraction Methods 0.000 description 1