JPH03112930U - - Google Patents
Info
- Publication number
- JPH03112930U JPH03112930U JP2098990U JP2098990U JPH03112930U JP H03112930 U JPH03112930 U JP H03112930U JP 2098990 U JP2098990 U JP 2098990U JP 2098990 U JP2098990 U JP 2098990U JP H03112930 U JPH03112930 U JP H03112930U
- Authority
- JP
- Japan
- Prior art keywords
- constant temperature
- substrate
- temperature jacket
- developing device
- substrate holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
Description
第１図は本考案に係るウエーハの現像装置の一
実施例を示す図、第２図は浸漬式現像の一連の工
程を説明し、ａは現像液供給工程、ｂは浸漬式現
像工程、ｃは現像液排出工程、ｄはリンス工程お
よびｅはスピン乾燥工程をそれぞれ示す図、第３
図は従来のウエーハの現像装置を示し、離れてい
る現像装置を示す図、ｂは恒温ジヤケツト上にス
プレーノズルからの液だれやスピン乾燥時の飛散
液の残留液滴を示す図である。
１……現像装置、２……スプレーノズル、３…
…基板、４……基板保持台、４ｂ……大径軸部、
５……リンス液、６……レジスト、７……恒温ジ
ヤケツト、７ａ……大径孔（現像槽）、７ｃ……
環状突起、７ｄ……傾斜面。
FIG. 1 is a diagram showing an embodiment of a wafer developing apparatus according to the present invention, and FIG. 2 illustrates a series of steps of immersion type development, in which a is a developer supplying process, b is an immersion type development process, and c is an immersion type development process. 3 shows the developer discharging process, d the rinsing process, and e the spin drying process, respectively.
The figure shows a conventional wafer developing device, with the developing device being shown at a distance, and b is a diagram showing residual droplets of liquid dripping from a spray nozzle and splashed during spin drying on a constant temperature jacket. 1...Developing device, 2...Spray nozzle, 3...
...Substrate, 4...Substrate holding stand, 4b...Large diameter shaft section,
5... Rinse liquid, 6... Resist, 7... Constant temperature jacket, 7a... Large diameter hole (developing tank), 7c...
Annular projection, 7d...slanted surface.
Claims (1)
ケツトと、前記現像槽内に上下移動可能にかつ回
転可能に配設された、基板を保持する基板保持台
と、リンス液をスプレーするノズルとを備え、レ
ジストが塗布された基板を前記基板保持台上に保
持するとともに、その基板保持台を下降して前記
現像槽内の現像液中に前記基板を浸漬し、その後
レジストを前記スプレーノズルからのリンス液に
よつてリンスするようになつている現像装置にお
いて、 前記恒温ジヤケツトの上面が、その恒温ジヤケ
ツトの外周端に向かつて低くなる傾斜面にされて
いるとともに、前記スプレーノズルは、その先端
が前記傾斜面の上方に位置するように配設されて
いることを特徴とするウエーハの現像装置。 (2) 前記恒温ジヤケツトの上面の前記現像槽側
内周端に、上方へ突出する環状突起が形成されて
いることを特徴とする請求項１記載のウエーハの
現像装置。[Scope of Claim for Utility Model Registration] (1) A constant temperature jacket in which a developer tank is formed in the center, and a substrate holder that holds a substrate and is disposed within the developer tank so as to be movable up and down and rotatable. and a nozzle for spraying a rinsing liquid, the resist-coated substrate is held on the substrate holder, and the substrate holder is lowered to immerse the substrate in the developer in the developer tank. In the developing device, the resist is then rinsed with a rinsing liquid from the spray nozzle, and the upper surface of the constant temperature jacket is formed into an inclined surface that becomes lower toward the outer peripheral end of the constant temperature jacket. The wafer developing device is further characterized in that the spray nozzle is disposed such that a tip thereof is located above the inclined surface. (2) The wafer developing device according to claim 1, wherein an annular projection projecting upward is formed at an inner peripheral end of the upper surface of the constant temperature jacket on the side of the developing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2098990U JPH03112930U (en) | 1990-03-01 | 1990-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2098990U JPH03112930U (en) | 1990-03-01 | 1990-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112930U true JPH03112930U (en) | 1991-11-19 |
Family
ID=31524069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2098990U Pending JPH03112930U (en) | 1990-03-01 | 1990-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160049985A (en) * | 2014-10-28 | 2016-05-10 | 도쿄엘렉트론가부시키가이샤 | Substrate liquid processing apparatus |
-
1990
- 1990-03-01 JP JP2098990U patent/JPH03112930U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160049985A (en) * | 2014-10-28 | 2016-05-10 | 도쿄엘렉트론가부시키가이샤 | Substrate liquid processing apparatus |
| JP2016086116A (en) * | 2014-10-28 | 2016-05-19 | 東京エレクトロン株式会社 | Substrate processing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5939139A (en) | Method of removing coated film from substrate edge surface and apparatus for removing coated film | |
| JPS5819170Y2 (en) | Semiconductor wafer plating equipment | |
| JPH0573245B2 (en) | ||
| JPS5931853B2 (en) | Engraving method | |
| US20010014536A1 (en) | Substrate processing method and apparatus | |
| JPH03112930U (en) | ||
| TW202224795A (en) | Wafer rinsing device and method for rinsing wafer | |
| JPH09298181A (en) | Substrate rear surface washer | |
| KR100672928B1 (en) | Photoresist coating equipment | |
| JPS5599725A (en) | Method and device for manufacturing semiconductor device | |
| JP2984963B2 (en) | Semiconductor wafer development method | |
| JPH031823B2 (en) | ||
| JPH062260Y2 (en) | Spray equipment | |
| JPH044850Y2 (en) | ||
| JPS597949A (en) | Developing method | |
| JPS6328298B2 (en) | ||
| JPH0425257Y2 (en) | ||
| TW410374B (en) | Developer tank | |
| KR100790253B1 (en) | Apparatus and method of develop in photolithography | |
| JPH0469920A (en) | Developer | |
| JPS58184725A (en) | Resist applying apparatus for semiconductor substrate | |
| JPH04118067A (en) | Coating device | |
| JP2619282B2 (en) | Resist processing apparatus and resist processing method | |
| KR0132530B1 (en) | Catch cup | |
| JP3119616B2 (en) | Developing device |