JPH03110897A - Electronic-component mounting apparatus - Google Patents

Abstract

PURPOSE:To suppress an impulsive force at a suction operation or a mounting operation, to prevent an electronic component from being damaged and to change a pressure pressing the component according to a thickness or the number of lead pins by providing the following: a magnet part installed at a suction nozzle; and an electromagnet part which can generate a load force, in an axial direction of the suction nozzle, at the magnet part by applying an electric current. CONSTITUTION:An application of an electric current is started at a time Ta immediately before a suction nozzle 11 comes into contact with an electronic component 2. While a state that a compound spring pressure on the suction nozzle 11 has been lowered (at a time Tb) is being maintained, the suction nozzle 11 comes into contact with the electronic component 2 at a time Tc. At this time, a mass of a movable part including the suction nozzle 11 is small, and the compound spring pressure has been weakened. As a result, an impulsive force is small and does not damage the electronic component 2. Then, the application of the electric current to a coil 17 is weakened at a time Td when a pressure after the contact has been stabilized; as a result, a steady pressure is reached at a time Te. A nozzle 3 is raised at a time Tf and a suction operation is finished. Thereby, the impulsive force by which the suction nozzle comes into contact with the electronic component is weakened; it is possible to select the steady pressure according to a thickness and the number of lead pins and to prevent the electronic component from being damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

Conventional technology In recent years, electronic components have been desired to have higher performance and larger capacity, and while the pinch between leads has been reduced for electronic components with leads to support high-density mounting, the chips themselves have become larger. As the number of series leads increases, electronic component mounting apparatuses are required to have higher reliability.

Hereinafter, an example of the electronic component mounting apparatus described above will be described with reference to the drawings. FIG. 4 shows a schematic diagram of a conventional electronic component mounting apparatus.

The nozzle 3 descends and the electronic component 2 having the lead supplied by the supply unit 1 is sucked, the recognition device 4 recognizes the pickup position, the control unit 5 corrects the position, and the XY table 6 transfers the electronic component 2 to the printed board. 7 and mounted.

FIG. 6 is a detailed sectional view of the nozzle 3. A suction nozzle 8 is attached concentrically with respect to the nozzle 3 so as to be able to slide in the vertical direction, and a range in the sliding direction is defined by a pin 9. Further, a compression coil spring 1° is interposed between the nozzle 3 and the suction nozzle 8 to apply preload. With the above configuration, in order to improve the adhesion between the suction nozzle 8 and the electronic component 2 during suction, the nozzle 3 is further lowered after the suction nozzle 8 comes into contact with the electronic component 2, and the electronic component 2 is attached to the compression coil spring. receives a reaction force of 10. Furthermore, during mounting, the nozzle 3 descends even after the electronic component 2 comes into contact with the printed circuit board 7, so that the electronic component 2 is securely mounted on the printed circuit board 7, and the electronic component 2 absorbs the reaction force of the compression coil spring 1o. receive.

Problems to be Solved by the Invention However, the above configuration has the following problems. That is, as shown in FIG. 6, it has been confirmed that the impact force when the suction nozzle 8 collides with the electronic component 2 is several times greater than the constant pressure exerted by the compression coil spring 10, and that the suction nozzle 8 jumps. . Similarly, when the electronic component 2 is mounted, an impact force is generated at the moment the electronic component 2 is mounted on the printed circuit board.

This impact force may cause cracks and damage to the stain component 2 itself, may deform the lead pins of the electronic component 2, making the electronic component that has been sucked into a defective component, and may not be able to be installed correctly when installed. There are negative effects. still,
The pressure with which the suction nozzle 8 presses the electronic component 2 during suction or mounting is constant regardless of the thickness of the electronic component 2 or the number of lead pins. This method has the disadvantage that it is not possible to change the component suppression to an appropriate value depending on the thickness of the electronic component 2, the number of doped pins, and the lead pitch, and it is not possible to mount components with high precision and reliability. Ta.

In view of the above-mentioned problems, the present invention reduces the impact force generated when the suction nozzle of an electronic component mounting device comes into contact with an electronic component to suction the electronic component, or when the electronic component comes into contact with a printed circuit board before being mounted. This invention provides a method that prevents damage to the stain component due to pressure and impact force, and that can vary the pressure with which the suction nozzle presses the electronic component during suction or mounting, depending on the thickness of the electronic component and the number of lead pins. be.

Means for Solving the Problems In order to solve the above problems, the electronic component mounting apparatus of the present invention includes a nozzle that slides in the vertical direction and an axis of the nozzle in the head portion that picks and places electronic components. a suction nozzle attached to slide in a direction; an annular permanent magnet fixed to the suction nozzle; a yoke having an axis concentric with the permanent magnet; The suction nozzle is configured to include a fixed coil, and when energized to the coil present in a magnetic circuit formed by the permanent magnet and the yoke, the suction nozzle receives thrust according to Fleming's left hand rule. It is something that

According to the above configuration, the present invention reduces the amount of current applied to the coil immediately before the suction nozzle comes into contact with the electronic component in order for the electronic component mounting apparatus to suction the electronic component, so that the suction nozzle absorbs the electronic component. Reduces the impact force at the moment of contact with parts,
After the two come into contact, the amount of current applied to the coil is increased and stable adsorption can be achieved. In addition, when the electronic component mounting device mounts an electronic component, the amount of current applied to the coil is changed just before the electronic component and the printed circuit board come into contact, suppressing the generation of impact force such as contact, and printing the electronic component. After mounting on the board, the amount of current applied to the coil is changed to perform mounting with high precision and reliability.

EXAMPLE Hereinafter, an electronic component mounting apparatus according to a first example of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of an electronic component mounting apparatus according to the present invention.

The nozzle 3 descends and the electronic component 2 having the lead supplied by the supply unit is sucked, the recognition device 4 recognizes the suction position, the control unit 5 performs position correction, and the xY table 6
The printed circuit board 7 is then positioned and mounted on the print board 7.

FIG. 2 is a detailed sectional view of the nozzle 3 of the electronic component mounting apparatus. In FIG. 2, the suction nozzle M1 is attached to the nozzle 3 so as to be slidable up and down in the axial direction. Further, a nozzle yoke 13 is fixedly provided via a magnetic insulator 12, and annular permanent magnets 15 and 16 are fixedly provided to the nozzle yoke 13. Because there is a magnetic insulator 12,
The magnetism of the annular magnets 15 and 16 does not leak to the suction nozzle 11. Further, a compression coil spring 14 is provided between a ring 18 fixed to the nozzle 3 and the nozzle yoke 13, and applies a preload to the suction nozzle 11. Annular permanent magnets 15 and 1
An outer yoke 19 is fixed in space so as to surround the outer periphery of 6, and this outer yoke 19 and annular permanent magnet 15
．． A coil 17 is fixed to the outer yoke 19 in the gap between the coils 16, and an annular permanent magnet 20 is fixed to the outer yoke 19 for magnetizing the magnetic circuit. Nozzle yoke 13. Annular permanent magnets 15 and 16
．． Outer yoke 19. By energizing the coil 17 in the magnetic circuit constituted by the annular permanent magnet 20, the annular permanent magnets 15 and 16 receive a thrust according to Schifleming's left-hand rule, and as a result, the suction nozzle 11 receives a thrust.

FIG. 3 is a time chart showing the change in the position of the nozzle 3, the spring pressure applied to the suction nozzle 11, and the reaction force against the suction nozzle 11 when performing a suction or mounting operation.

The adsorption and mounting operations of the electronic component mounting apparatus configured as described above will be explained with reference to FIGS. 2 and 3.

In Fig. 2, among the components of the magnetic circuit, the outer yoke 19 and the coil 17 are fixed in space, and when the coil 17 is energized, the thrust generated according to Fleming's left-hand rule is transferred to the annular permanent magnet 15, 16. It is transmitted to the suction nozzle 11 via the nozzle yoke 13 and the magnetic insulator 12. Since the suction nozzle 11 is preloaded by the compression coil spring 14, the suction nozzle 11 receives a combined spring pressure of the compression coil spring 14 and the thrust according to Fleming's left hand rule.

In FIG. 3, energization of the coil 17 is started at time Ta immediately before the suction nozzle 11 contacts the electronic component 2, and while maintaining the reduced state (time Tb) of the combined spring pressure applied to the suction nozzle 11. By time. At , the suction nozzle 11 comes into contact with the electronic component 2°. At this time, the movable parts including the suction nozzle 11 have a small mass and the combined spring pressure is weakened, so the impact force is small and does not damage the electronic component 2. Next, if the energization to the coil 17 is weakened at time Td when the suppression after contact becomes stable, steady suppression is reached at time T.sub.2. At time T, the nozzle 3 rises and the suction operation ends.The mounting operation can also be performed in exactly the same process.

In the first embodiment, the composite spring pressure immediately before suction is set to be weaker than the preload of the compression coil spring 14, and the steady pressing force is only the spring pressure of the compression coil spring 14. Coil spring 1 compresses the previous spring pressure
It is also effective to use a spring pressure of 4 as the composite spring pressure of the spring pressure of the compression coil spring 14 and the thrust of Fleming's left-hand rule.

Effects of the Invention As described above, the electronic component mounting apparatus of the present invention includes a nozzle that is slidable in the vertical direction and a nozzle that is mounted to slide in the axial direction of the nozzle in the head portion that picks and places electronic components. an annular permanent magnet fixed to the suction nozzle; a yoke coaxial with the permanent magnet; and a coil fixed to the yoke in a space between the yoke and the permanent magnet. Therefore, by energizing the coil in the magnetic circuit formed by the permanent magnet and the yoke, the permanent magnet receives a thrust according to Fleming's left-hand rule, and as a result, the thrust is transmitted to the suction nozzle. If this thrust can be used as spring pressure in the suction nozzle to change the amount of current applied to the coil and freely change the spring pressure, then when the electronic component mounting device suctions the electronic component, the suction nozzle will come into contact with the electronic component. to weaken the impact force,
Steady pressing can be selected depending on the thickness of the electronic component and the number of lead pins, resulting in the effect of preventing damage to the electronic component and preventing bending of the lead of the electronic component. Moreover, by similarly changing the amount of current applied during mounting, there is an effect that highly accurate and highly reliable mounting can be realized.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a detailed enlarged sectional view of the nozzle section, and FIG. 3 is a time chart diagram of the nozzle section during suction operation.
FIG. 4 is a schematic perspective view of a conventional electronic component mounting apparatus, FIG. 5 is a detailed enlarged cross-sectional view of the same nozzle section, and FIG. 6 is a time chart of the suction operation. 1... Supply section, 2... Electronic components, 3.
... Nozzle, 4 ... Recognition device, 5 ...
...Control unit, 6...XY tape 7...
...Printed circuit board, 8...Suction nozzle, 9
...Pin, 10...Compression coil spring,
11...Adsorption nozzle, 12...Magnetic insulator, 13...Kudzu/l/yoke, 14...
... Compression coil spring, 15, 1.6 ... Annular permanent magnet, 17 ... Coil, 18 ...
Ring, 19...Outer yoke, 20...
...Annular permanent magnet.

Claims (2)

[Claims] (1) a nozzle, a suction nozzle that is provided at the tip of the nozzle so as to be slidable in the axial direction and that can attract and attach parts to a predetermined position; and a magnet section that is provided on the suction nozzle;
An electronic component mounting device comprising an electromagnet section that can generate a load force in the axial direction of the suction nozzle on the magnet section when energized. (2) a nozzle that moves up and down to pick and place electronic components; a suction nozzle that is attached to slide in the axial direction of the nozzle; an annular permanent magnet that is fixed to the suction nozzle; An electronic component mounting device comprising a yoke provided concentrically with a magnet, and a coil fixed to the yoke on the space side of the yoke and the permanent magnet.