JPH03110870U - - Google Patents
Info
- Publication number
- JPH03110870U JPH03110870U JP1988890U JP1988890U JPH03110870U JP H03110870 U JPH03110870 U JP H03110870U JP 1988890 U JP1988890 U JP 1988890U JP 1988890 U JP1988890 U JP 1988890U JP H03110870 U JPH03110870 U JP H03110870U
- Authority
- JP
- Japan
- Prior art keywords
- insulator layer
- pads
- conductor
- insulating substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988890U JPH03110870U (en:Method) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988890U JPH03110870U (en:Method) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110870U true JPH03110870U (en:Method) | 1991-11-13 |
Family
ID=31522992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988890U Pending JPH03110870U (en:Method) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110870U (en:Method) |
-
1990
- 1990-02-28 JP JP1988890U patent/JPH03110870U/ja active Pending