JPH03106745U - - Google Patents

Info

Publication number
JPH03106745U
JPH03106745U JP1428190U JP1428190U JPH03106745U JP H03106745 U JPH03106745 U JP H03106745U JP 1428190 U JP1428190 U JP 1428190U JP 1428190 U JP1428190 U JP 1428190U JP H03106745 U JPH03106745 U JP H03106745U
Authority
JP
Japan
Prior art keywords
adhesive layer
plastic sheet
holding tape
wafer holding
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1428190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1428190U priority Critical patent/JPH03106745U/ja
Publication of JPH03106745U publication Critical patent/JPH03106745U/ja
Pending legal-status Critical Current

Links

JP1428190U 1990-02-16 1990-02-16 Pending JPH03106745U (US08124317-20120228-C00060.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1428190U JPH03106745U (US08124317-20120228-C00060.png) 1990-02-16 1990-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1428190U JPH03106745U (US08124317-20120228-C00060.png) 1990-02-16 1990-02-16

Publications (1)

Publication Number Publication Date
JPH03106745U true JPH03106745U (US08124317-20120228-C00060.png) 1991-11-05

Family

ID=31517650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1428190U Pending JPH03106745U (US08124317-20120228-C00060.png) 1990-02-16 1990-02-16

Country Status (1)

Country Link
JP (1) JPH03106745U (US08124317-20120228-C00060.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281001A (ja) * 2006-04-03 2007-10-25 Nec Electronics Corp 半導体ウェーハの加工方法
JPWO2016125841A1 (ja) * 2015-02-07 2017-12-07 株式会社クリエイティブテクノロジー 被加工物保持装置及びレーザカット加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281001A (ja) * 2006-04-03 2007-10-25 Nec Electronics Corp 半導体ウェーハの加工方法
JPWO2016125841A1 (ja) * 2015-02-07 2017-12-07 株式会社クリエイティブテクノロジー 被加工物保持装置及びレーザカット加工方法

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