JPH03104749U - - Google Patents

Info

Publication number

JPH03104749U

JPH03104749U JP1312790U JP1312790U JPH03104749U JP H03104749 U JPH03104749 U JP H03104749U JP 1312790 U JP1312790 U JP 1312790U JP 1312790 U JP1312790 U JP 1312790U JP H03104749 U JPH03104749 U JP H03104749U

Authority

JP

Japan

Prior art keywords

semiconductor element

resin

semiconductor device

sealed

substrate

Prior art date

1990-02-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 14
• 239000000758 substrate Substances 0.000 claims description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• 238000004382 potting Methods 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
• 239000011358 absorbing material Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1

Cited By (2)