JPH03102791U - - Google Patents

Info

Publication number

JPH03102791U

JPH03102791U JP1167990U JP1167990U JPH03102791U JP H03102791 U JPH03102791 U JP H03102791U JP 1167990 U JP1167990 U JP 1167990U JP 1167990 U JP1167990 U JP 1167990U JP H03102791 U JPH03102791 U JP H03102791U

Authority

JP

Japan

Prior art keywords

heat dissipation

dissipation fin

mounting part

circuit board

printed circuit

Prior art date

1990-02-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000017525 heat dissipation Effects 0.000 claims description 8
• 239000004065 semiconductor Substances 0.000 claims description 4
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• 230000005855 radiation Effects 0.000 description 1