JPH03102745U - - Google Patents

Info

Publication number

JPH03102745U

JPH03102745U JP1155490U JP1155490U JPH03102745U JP H03102745 U JPH03102745 U JP H03102745U JP 1155490 U JP1155490 U JP 1155490U JP 1155490 U JP1155490 U JP 1155490U JP H03102745 U JPH03102745 U JP H03102745U

Authority

JP

Japan

Prior art keywords

resin

lead frame

semiconductor device

support

island

Prior art date

1990-02-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 12
• 239000011347 resin Substances 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 4
• 230000017525 heat dissipation Effects 0.000 claims 1
• 229910001111 Fine metal Inorganic materials 0.000 description 1
• 235000014676 Phragmites communis Nutrition 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1