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Application filedfiledCritical
Priority to JP1990009267UpriorityCriticalpatent/JPH087634Y2/ja
Publication of JPH03101527UpublicationCriticalpatent/JPH03101527U/ja
Application grantedgrantedCritical
Publication of JPH087634Y2publicationCriticalpatent/JPH087634Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
