JPH0296741U - - Google Patents

Info

Publication number

JPH0296741U

JPH0296741U JP472889U JP472889U JPH0296741U JP H0296741 U JPH0296741 U JP H0296741U JP 472889 U JP472889 U JP 472889U JP 472889 U JP472889 U JP 472889U JP H0296741 U JPH0296741 U JP H0296741U

Authority

JP

Japan

Prior art keywords

integrated circuit

semiconductor integrated

package

marking

mold package

Prior art date

1989-01-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 238000005538 encapsulation Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1