Patents

Search tools Text Classification Chemistry Measure Numbers Full documents Title Abstract Claims All Any Exact Not Add AND condition These CPCs and their children These exact CPCs Add AND condition
Exact Exact Batch Similar Substructure Substructure (SMARTS) Full documents Claims only Add AND condition
Add AND condition
Application Numbers Publication Numbers Either Add AND condition

Classifications

H01L2224/48247 Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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JPH0295241U

Japan

Other languages
English
Japanese

Worldwide applications
1989 JP

Application JP470389U events
1989-01-18
Application filed
Pending