JPH029444U - - Google Patents
Info
- Publication number
- JPH029444U JPH029444U JP1988087702U JP8770288U JPH029444U JP H029444 U JPH029444 U JP H029444U JP 1988087702 U JP1988087702 U JP 1988087702U JP 8770288 U JP8770288 U JP 8770288U JP H029444 U JPH029444 U JP H029444U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- conductive material
- heat dissipation
- insertion hole
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087702U JPH029444U (US06277897-20010821-C00009.png) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087702U JPH029444U (US06277897-20010821-C00009.png) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029444U true JPH029444U (US06277897-20010821-C00009.png) | 1990-01-22 |
Family
ID=31312303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087702U Pending JPH029444U (US06277897-20010821-C00009.png) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029444U (US06277897-20010821-C00009.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0449405U (US06277897-20010821-C00009.png) * | 1990-08-31 | 1992-04-27 | ||
| JPH04165337A (ja) * | 1990-08-08 | 1992-06-11 | Sankyo Seiki Mfg Co Ltd | 照明光学系 |
-
1988
- 1988-06-30 JP JP1988087702U patent/JPH029444U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04165337A (ja) * | 1990-08-08 | 1992-06-11 | Sankyo Seiki Mfg Co Ltd | 照明光学系 |
| JPH0449405U (US06277897-20010821-C00009.png) * | 1990-08-31 | 1992-04-27 |
